An information handling system may include an information handling resource, at least one fluidic conduit thermally coupled to the information handling resource and configured to convey a cooling liquid proximate to the information handling resource in order to cool the information handling resource, an air mover support infrastructure comprising a plurality of bays, each bay of the plurality of bays configured to receive an air mover for cooling components of the information handling system, and a liquid manifold sized and shaped to be received in at least one of the plurality of bays and received in a first bay of the plurality of bays and configured to enable at least one fluidic conduit to fluidically couple to an external cooling system, wherein the external cooling system is configured to deliver cooled cooling liquid to the information handling system, receive warmed cooling liquid from the information handling system, and cool the warmed cooling liquid.

A charging cabinet is disclosed having a frame, a center vertical member, wherein the center vertical member includes a lock plate, a plurality of stock chargers, an exhaust system, configured to vent heat from the charging cabinet to cool the at least one battery, a heater, configured to warm the at least one battery, a pair of duplex receptacles, a pass-thru connector recess box, wherein the pass-thru connector recess box is angled downward, a pass-thru connector mount box, wherein the pass-thru connector mount box is angled upward, an inlet connector recess box, wherein the inlet connector recess box is angled downward, and an inlet connector mount box, wherein the inlet connector mount box is angled upward.

An immersion cooling assembly comprises at least one primary heat-generating electronic component and a flow-through cooling module mounted near the at least one primary heat-generating component. The flow-through cooling module comprises at least one inlet conduit to accept an inflow of pressurized dielectric coolant, a fluid chamber through which fluid flows to provide targeted, direct cooling to a heat-generating component, and exit passageways to facilitate flow-through of the dielectric coolant into a surrounding immersion bath for cooling of other components. As it flows out of the cooling module and over the heat-generating component, the coolant fluid absorbs heat from the heat-generating electronic component. In certain embodiments, the assembly may also comprise at least one periphery heat-generating electronic component, which may also be cooled by the dielectric coolant as it exits the vicinity of the flow-through cooling module. The cooling module may include impingement nozzles to accelerate and direct the flow of coolant fluid toward the high-heat-generating electronic component.

A tiered immersion cooling system includes a chassis, a cabinet frame slidably mounted to the chassis, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidable between a first internal position and a first external position. Sliding motion of the cabinet frame is in a horizontal direction along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank slides relative to the cabinet frame, in a vertical direction along a height of the chassis. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is mounted to slide independently from the cabinet frame, in the horizontal direction. The lower immersion tank slides between a second internal and a second external position.

The invention relates to a device (2) for cooling a plurality of electronic elements (11) that are capable of releasing heat when supplying power to an appliance or vehicle, wherein the electronic elements are arranged in a housing (12), the device (2) comprises at least one element (22) for spraying a diphasic dielectric fluid (3) onto the electronic elements (11), as well as a condenser (26) with a cooling fluid circuit (23), the housing (12) comprises a receptacle (25) for collecting the dielectric fluid (3), the cooling device (2) comprises a dielectric fluid circuit (21) with a circulation pump (24), which is configured to draw the dielectric fluid (3) from the collection receptacle (25) and is directly connected to the spraying element (22), characterised in that the cooling device (2) comprises a system (4) for controlling the internal pressure of the housing (12), the control system (4) comprising a control module (41) configured to generate a control command to control the internal pressure depending on a state of the cooling device and/or a state of the appliance or vehicle.

This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

A cooling device of a projection display apparatus includes a first heat receiving unit including an opening that is rectangular. The first heat receiving unit includes a flow path part that forms the opening. An image display element of the projection display apparatus includes a first front face located in front of a reflective image display, a second front face parallel to the first front face and located behind and outside the first front face, and a first side face located between the first front face and the second front face. The first front face is inserted into the opening, and the flow path part is in contact with the first side face and the second front face via a heat conductive member. The flow path part includes a front face that is flush with or in front of the first front face of the image display element.

Cooling device (15) for cooling semiconductor switching elements (10, 11), comprising a first wall (17) having a first side (18) for carrying the semiconductor switching elements (10, 11) and having a second side (19) being opposite the first side (18), a second wall (20) having a first side (21) that forms a main cooling channel (22) together with the second side (19) of the first wall (17) and having a second side (25) being opposite to the first side (21) of the second wall (20), and a third wall (23) that forms an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), wherein the second wall (20) comprises a connection means (26) that connects the auxiliary cooling channel (24) with the main cooling channel (22) in a fluid-conductive manner.

The use of a heat-transfer composition including at least one refrigerant chosen from halogenated hydrocarbons, perhalogenated hydrocarbons, fluorinated ketones, fluorinated ethers and also combinations thereof, and at least one dielectric fluid, for cooling a battery of an item of equipment, such as an electric or hybrid vehicle, the heat-transfer composition having a volume resistivity of greater than or equal to 106 Ω.Math.cm at 25° C.

A heat discharge device having a bottom plate having a bottom and an upper surface. Heat discharge blades extend between two front faces of the bottom plate and inclinations of the heat discharge blades are configured in a way such that neighbouring heat discharge blades alternatingly approach one another and move away from each other. Neighbouring heat discharge blades are connected to one another at the end regions facing away from the upper surface of the bottom plate directly and delimit a first air flow channel. Neighbouring heat discharge blades delimit a second air flow channel, which is open at the side facing away from the upper surface of the bottom plate. The heat discharge blades have a group of air vents, wherein the first air flow channels are open at the opposite distal ends thereof and the second air flow channels are closed at the opposite distal ends thereof.