In one embodiment, a system includes a central hub comprising a power source, a data switch, a coolant system, and a management module, a plurality of network devices located within an interconnect domain of the central hub, and at least one combined cable connecting the central hub to the network devices and comprising a power conductor, a data link, a coolant tube, and a management communications link contained within an outer cable jacket.

A cabinet liquid cooling system is configured to dissipate heat of a cabinet. A flow allocation unit is installed on a single side of the cabinet, is located in space between a side wall of the cabinet and a mounting bar of the cabinet, and is provided with a liquid inlet and a liquid outlet. A liquid cooling system (LCS) control unit is installed at the bottom of the cabinet and cyclically supplies liquid to the flow allocation unit using the liquid inlet and the liquid outlet. A liquid supply branch includes a liquid delivery pipe and a liquid return pipe. A node pipe includes a liquid inlet pipe and a liquid outlet pipe. Both the liquid inlet pipe and the liquid outlet pipe are connected to the corresponding liquid delivery pipe and liquid return pipe using the quick male connector and the quick female connector.

In one embodiment, a system includes a central hub comprising a power source, a data switch, a coolant system, and a management module, a plurality of network devices located within an interconnect domain of the central hub, and at least one combined cable connecting the central hub to the network devices and comprising a power conductor, a data link, a coolant tube, and a management communications link contained within an outer cable jacket.

Cooling systems for devices arranged in rows are disclosed. An example cooling system for a datacenter in a building includes a supply air duct to extend lengthwise along a first aisle within the building. The first aisle is defined between a first row of computers and a second row of computers. The first row of computers provides passage of a first current of air from the first aisle to a second aisle on an opposite side of the first row of computers. The supply air duct is to be positioned with an upper section that is higher than a top surface associated with the first and second rows of computers. The cooling system includes a first wing to extend from the supply air duct toward the first row of computers, and a second wing to extend from the supply air duct toward the second row of computers.

A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.

A data center includes two or more rack computing systems and an air handling system. The rack computing systems may each include racks and computing devices mounted in the rack. The air handling system includes one or more air moving devices external to the one or more racks. The air moving devices create a negative pressure relative to ambient air at air inlets to the racks to draw air from the inlets and through computing devices in the racks.

Thermal energy management kits are described herein. A thermal energy management kit described herein includes one or more thermal storage cells. Individual thermal storage cells have a container. The container may be formed from a thermally conductive material and has an interior volume. The thermal storage cell further includes a phase change material disposed within the interior volume of the container. Thermal energy management kits described herein may optionally further include one or more mounting structures.

A method of providing cooling air for cooling data centre IT equipment, an evaporative humidifier and an air handling unit is disclosed. The method comprises operating an evaporative humidifier (201) to humidify air for supply as IT equipment cooling air, the evaporative humidifier preferably comprising a deformable wettable matrix (207). Preferably, the method comprises steps of wetting the deformable wettable matrix (207), passing air through the wetted matrix (207) thus producing humidified air, and expelling water from the wettable matrix (207) by subjecting the wettable matrix to compressive deformation. The evaporative humidifier (201) preferably comprises a compressible wettable matrix (207), a water reservoir (217), a pump (218) for supplying water from the reservoir (217) to the wettable matrix (207), a frame for supporting the compressible wettable matrix, and an actuator (211) for effecting a compressive force on the compressible wettable matrix (207) for the purpose of expelling water from the wettable matrix (207). The air handling unit preferably comprises an evaporative humidifier (201) as disclosed.

A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch waveguide and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.

An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.