An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.

A circuit card assembly includes a heat sink, a locking mechanism, and a thermal insert. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downwards along the upper surface thereof. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The thermal insert is disposed within the heat sink and is an elongated member. The thermal insert is configured to contact a portion of at least one of the solid wedges, thus assisting in removing a first amount of thermal energy from the circuit board.

A heat transfer system for use within an avionics bay of an aircraft is provided by the present disclosure that includes, in one form, an aircraft panel comprising an upper skin, a lower skin, and a foam core disposed between the upper skin and the lower skin. At least one heat conducting array extends through the foam core and between the upper skin and the lower skin, the heat conducting array defining at least one upper cap, at least one lower cap, and a wall portion extending between the upper cap and the lower cap, the upper cap being disposed proximate avionics within the avionics bay. A heat conducting spreader is disposed between the lower cap of the heat conducting array and the lower skin of the aircraft panel.

An electronics rack comprising a frame, a heat sink coupled to the frame, and a cage adapted to support an electronic component. The cage is movable between first and second positions toward and away from the heat sink. The rack further includes an eccentric cam operatively positioned between the frame and the cage and being rotatable to move the cage between the first and second positions. In one embodiment, the cage comprises a cooling brick movable toward and away from the heat sink when the cage moves between the first and second positions. The cooling brick can include a first heat pipe extending generally in a first direction and a second heat pipe extending generally in a second direction transverse to the first direction. For example, the first heat pipe can be embedded in a top plate and the second heat pipe can be embedded in a top cold rail.

A device for retaining a printed circuit board module in a mounting groove of a cold plate, the device comprising an elongated housing made of metal, which has a cross-section in the shape of a horizontal U. A pressure piece made of metal is mounted in the housing so as to be displaceable transversely relative to the rotational axis of the housing and comprises a flat clamping surface on the front side. A rotary cylinder can be rotatably mounted in the housing so as to be transversely displaceable relative to the rotational axis. During a rotation, eccentric guide elements can be used to effect a forward displacement of the rotary cylinder. The pressure piece follows the displacement of the rotary cylinder and slides outward. The waste heat of the printed circuit board module is transported via the housing and the pressure piece to the cold plate.

An electrical device including a skeleton-like frame structure and at least one electrical module is provided. The skeleton-like frame structure has a low rigidity, while the at least one electrical module provides an increased rigidity when mounted.

A solid state relay module configured to be coupled to an electronics enclosure. The solid state relay module includes a body with a first side and an opposite second side and two cable channels extending from the first side of the body. Each of the two cable channels is sized to receive a heating cable. The solid state module also includes a solid state relay platform defined between the two cable channels, where the solid state relay platform is sized to receive a solid state relay. The solid state relay module further includes a heat sink extending from the second side of the body.

A coupling is disclosed providing fluidic continuity between first and second orifices of two portions of an air circuit which includes a flexible sleeve, a first frame connected in fluid-tight manner to a first end of the flexible sleeve and having a first opening, and a second frame, connected in fluid-tight manner to a second end of the flexible sleeve and having a second opening. The coupling is deformable so that the flexible sleeve may adapt to the variable spacing between two avionics racks and is able to compensate for a misalignment between the orifices of two portions of an air circuit.

A heat sink mounting apparatus including: a heat sink; and a device housing, the housing having a slot in the wall of the housing configured to receive a heat sink, wherein the heat sink and the housing are configured such that the heat sink can be secured within the slot with an interference fit.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.