An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

In some embodiments, apparatuses and methods are provided herein useful for environmental control inside an enclosure including an enclosure, an exhaust fan located in proximity to an outlet of the enclosure, a temperature sensor located proximate the exhaust fan and configured to provide exhaust air temperature data, a first sensor located proximate a supply intake of one of one or more electronic equipment and configured to provide sensor data associated with air that is supplied to the one of the one or more electronic equipment, a fan control unit (FCU), and a power control unit (PCU). The FCU is configured to adjust fan speed of the exhaust fan. The PCU is configured to receive the sensor data from the first sensor; receive the exhaust air temperature data; and provide the fan speed control data to the FCU based on the sensor data and the exhaust air temperature data.

A power conversion system includes a housing (outer housing) and a power converter. The power converter is arranged in an internal space of the housing. An outer peripheral surface of the housing is provided with an air inlet and an air outlet. The air outlet communicates with the air inlet via the internal space of the housing and is located below the air inlet.

In some implementations, a network device includes a housing and a set of switch cards within the housing and including a first set of connectors. A set of line cards within the housing includes a second set of connectors. The set of line cards are oriented orthogonally to the set of switch cards. A first set of power supplies and a second set of power supplies are in the housing. A midplane includes a plurality of circuit board assemblies arranged within the housing between the set of line cards and the first and second sets of power supplies to allow air to flow through the set of line cards to the set of switch cards, first set of power supplies, and second set of power supplies.

A power distribution cabinet is disclosed which includes multiple internal compartments for separating and channeling hot air generated by high heat generating components out of the cabinet without coming into contact with more heat sensitive components. The cabinet includes a baffle structure which forms an internal wall within the cabinet, which helps to form a high heat compartment and an upper compartment. The high heat compartment houses a heat generating component. Cool air is allowed to flow into a lower area of the cabinet and into the high heat compartment, and is also channeled into the upper compartment where at least one other heat generating component is located. The baffle structure channels hot air formed within the high heat compartment out toward a rear area of the equipment cabinet, while also helping to channel warm air created within the upper compartment through a top panel of the cabinet.

An airflow management system that can be fitted to an electrical cabinet intended to accommodate electrical devices in the internal volume thereof, the system comprising: a casing comprising at least one air input intended to be placed in communication with the internal volume of the electrical cabinet, at least two air outputs and at least one principal throat arranged to connect the air input to the two air outputs, a switch device arranged inside said principal throat, between the first air output and the second air output, the switch device comprising movable flaps that can be controlled between a first position in which the air input communicates solely with the first air output and a second position in which the air input communicates at least with the second air output.

In one embodiment, the system includes one or more electrical components associated with turbomachinery, and the one or more electrical components are disposed within two or more interior compartments of an electrical enclosure. The system also includes a cooling system coupled to the electrical enclosure. The cooling system includes one or more air ducts configured to direct a cooling air to each interior compartment of the two or more interior compartments. The cooling system also includes a controller configured to route cooling air to each interior compartment via the one or more air ducts. The controller is configured to independently regulate a thermal environment for each interior compartment of the two or more interior compartments.

A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack ((OR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may he about of less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.