A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

This description provides a system for recovering energy released by a computing unit. The system comprises a first computing unit that generates heat energy as the first computing processes information, an energy recovery unit configured to recover the heat energy generated by the first computing unit, and a second computing unit coupled to the energy the energy recovery unit. The energy recovery unit further comprise a pump configured to transport a working fluid to absorb the heat energy generated by the first computing device and a conversion device configured to convert the absorbed heat energy into electrical energy. The electrical energy is passed to the second computing unit to supply power for the second computing unit to process information.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

An electric power generation system receives a gas flow at a heater, heats the gas flow at the heater with a heated fluid from a waste heat process, and directs the heated gas flow to a turbine wheel of an electric generator. The heated gas flow drives rotation of the turbine wheel, and in response to rotating the turbine wheel, electrical current is generated by the electric generator. Generated electrical current is then directed to power electronics.

A server device which is self-adaptive to different placements and locations includes a chassis, a plurality of storage elements, and a storage cabinet. First and third slide rails are positioned at opposite sides of the storage cabinet along a first direction. Second and fourth slide rails are positioned at other two opposing sides of the storage cabinet. The storage cabinet is movably positioned in the chassis along a third direction. When the chassis is horizontal, the first slide rail and the third slide rail provide support for the storage cabinet and when the chassis is vertical, support is provided by the second and fourth slide rails. The problem of the storage cabinet being difficult to slide when the placement of the chassis is changed is reduced, and the server device is more flexible in its placement.

Data center mechanical infrastructure is incrementally deployed and commissioned to support incremental changes in computing capacity in a data center while mitigating interaction between infrastructure being commissioned and installed computer systems. Incremental mechanical infrastructure commissioning can be concurrent with incremental electrical infrastructure commissioning and includes operating mechanical infrastructure to remove heat generated as a result of operating electrical infrastructure to support simulated electrical loads as part of electrical infrastructure commissioning. Incremental mechanical infrastructure deployment can be based on the power support capacity provided by incrementally deployed electrical infrastructure. Incremental infrastructure deployment can include partitioning a space in which incremental mechanical infrastructure is configured to provide cooling, so that heat generation and removal in the space, based on commissioning the incremental mechanical infrastructure, is isolated electrical and cooling support provided to electrical loads located in a remainder of the data center.

Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.