An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

An electronic device including a shielding member for performing an electromagnetic interference (EMI) shielding function is provided. The electronic device includes a printed circuit board including a first area in which first electronic components having a first frequency as a driving frequency are mounted, and a second area in which second electronic components having a second frequency as a driving frequency are mounted, a shielding film disposed to cover the first area and the second area of the printed circuit board and attached to a first ground portion of the printed circuit board, and at least one conductive member formed to extend in a direction perpendicular to an extending direction of the printed circuit board. The at least one conductive member includes a first end that contacts the shielding film, and a second end that contacts a second ground portion of the printed circuit board, the second end being disposed between the first area and the second area of the printed circuit board.

An electronic device according to various embodiments disclosed in this document may include: a display panel; a recognition member disposed under the display panel and including a conductive pattern to recognize a signal from a pen input device; a first shielding member disposed under the recognition member; and a second shielding member disposed under the first shielding member and made of a material different than the first shielding member, wherein the second shielding member includes a component region corresponding to at least one electronic component disposed under the second shielding member, and wherein at least a portion of the second shielding member is removed from the component region.

A display device includes a display panel, a printed circuit board attached to the display panel and including a ground potential supply terminal, a circuit, and a wiring pattern electrically coupling the ground potential supply terminal and the circuit, and a housing that contacts a coupling place provided to the wiring pattern and is attached to the printed circuit board through the coupling place. The wiring pattern includes a terminal wiring pattern electrically coupled with the ground potential supply terminal, a circuit wiring pattern branched from a branch part at a predetermined position on the terminal wiring pattern and electrically coupled with the circuit, and a housing wiring pattern branched from the branch part of the terminal wiring pattern and electrically coupled with the coupling place, and the circuit wiring pattern and the housing wiring pattern are uncoupled with each other at any place other than the branch part.

A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.

Disclosed is a hearing device configured to be worn at or in an ear of a user. The hearing device comprises a substrate. The substrate comprises one or more electronic components mounted on the substrate. The hearing device comprises a shielding component. The shielding component being arranged on the substrate to provide a space between the shielding component and the substrate. The shielding component is configured to cover at least a first electronic component of the one or more electronic components on the substrate. The space between the shielding component and the substrate is at least partly filled with a fill encapsulation material configured for encapsulating at least the first electronic component. The shielding component comprises a reservoir configured to collect/accumulate any excess fill encapsulation material from the space between the shielding component and the substrate.

A radar system is described herein. The radar system includes a printed circuit board (PCB) that includes a metallized top layer and a substrate layer that is adjacent the metallized top layer. The substrate layer includes a substrate integrated waveguide (SIW), and the metallized layer has a slotted taper etched therein. The slotted taper is positioned relative to the SIW such that an electromagnetic signal generated by a monolithic microwave integrated circuit (MMIC) passes from the slotted taper to the SIW without an intervening microstrip line. The radar system further includes a housing that acts both to disperse heat and to suppress undesired electromagnetic radiation.

An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.