A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

The present disclosure provides a power module and a solid-state transformer system. The power module includes: a circuit module, having a voltage level; and a cabin, configured to wrap the circuit module by bending or splicing, where the cabin has a shielding structure, the shielding structure including: a first conductor layer, located at a side close to the circuit module and equipotentially connected to the circuit module; a second conductor layer, arranged apart from the first conductor layer and located at a side away from the circuit module; and a solid insulating layer, provided between the first conductor layer and the second conductor layer for electrically isolating the first conductor layer and the second conductor layer. The power module provided by the present disclosure has good insulation performance and is easy to assemble.

An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.

In example implementations, an apparatus is provided. The apparatus includes a polymer based enclosure, an absorber, and a connection interface. The polymer based enclosure is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board. The absorber is coated over the polymer based enclosure to block radio frequency signals generated by the memory modules. The connection interface is to connect to the memory module connection interface.

An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

An optoelectronic device comprises a substrate, an optoelectronic element mounted on the substrate, a shielding cap providing electromagnetic shielding, at least one optical element attached to the shielding cap, and a detection element configured to detect if the shielding cap is mounted on the substrate.

A module includes a main board including a first surface, a submodule mounted on the first surface, a first component mounted on the first surface separately from the submodule, a first sealing resin formed so as to cover the first surface, the submodule, and the first component, and an external shield film formed so as to cover a surface and a side surface of the first sealing resin on a side far from the first surface and a side surface of the main board. The submodule includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shield film formed so as to cover at least a part of a side surface of the second sealing resin. The internal shield film has at least a two-layer structure.

A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.