A camera module comprising: a housing; a lens assembly that is fixed to the housing and comprises at least one lens; a circuit board that is arranged inside the housing and comprises a first circuit board and a second circuit board, on which image sensors arranged to face the lens are mounted, respectively; and a first shield can arranged inside the housing so as to support edges of the first and second circuit boards.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

A shielding cover shields and protects a component in an electronic device. The shielding cover includes a cover body and a flexible printed circuit board disposed on the cover body. A first opening is disposed on an end face of the cover body, and the flexible printed circuit board may be affixed to an outer side of the end face of the cover body through soldering, bonding, or the like, blocking the first opening.

A display device includes a display panel, a printed circuit board attached to the display panel and including a ground potential supply terminal, a circuit, and a wiring pattern electrically coupling the ground potential supply terminal and the circuit, and a housing that contacts a coupling place provided to the wiring pattern and is attached to the printed circuit board through the coupling place. The wiring pattern includes a terminal wiring pattern electrically coupled with the ground potential supply terminal, a circuit wiring pattern branched from a branch part at a predetermined position on the terminal wiring pattern and electrically coupled with the circuit, and a housing wiring pattern branched from the branch part of the terminal wiring pattern and electrically coupled with the coupling place, and the circuit wiring pattern and the housing wiring pattern are uncoupled with each other at any place other than the branch part.

A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls. The circuit components are accommodated only in the first accommodation-chamber section and the plug components are accommodated only in the second accommodation-chamber section.

A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

An electronic device includes a printed board having an electronic part mounted on a surface thereof and a shield member arranged so as to be opposite to the surface of the printed board and to cover the electronic part. The shield member has a protruding portion that extends to the outer side beyond one end of the printed board as viewed in top plan, and the protruding portion is bent to the printed board side and has a tip end extending at least to a position opposite to a side face of the printed board.

A camera module comprising: a housing; a lens assembly that is fixed to the housing and comprises at least one lens; a circuit board that is arranged inside the housing and comprises a first circuit board and a second circuit board, on which image sensors arranged to face the lens are mounted, respectively; and a first shield can arranged inside the housing so as to support edges of the first and second circuit boards.

An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer.

The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission includes: a first shielding film, a second shielding film and a circuit board body. The circuit board body includes a first surface and a second surface that are arranged opposite to each other. The first shielding film covers the first surface, and the second shielding film covers the second surface. The circuit board body is provided with a wire region. The first shielding film and the second shielding film are in electrical connection at a lateral side of the wire region. Therefore, leaky waves at the lateral side of the circuit board body are effectively avoided, and the circuit board body is thin in structure.