Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, a radiation shield around the radiation source, and a hook and loop radiation shield securing mechanism to removably secure the radiation shield to the support structure, where the hook and loop radiation shield securing mechanism includes a hook portion with a plurality of hooks and a loop portion that includes a plurality of loops, where an angle of a retention hook for each of the plurality of hooks is less than about eighty degrees.

Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.

A shield can for an electronic eyewear device is described that reduces RF signals emanating from the electronic eyewear device. The shield can is attached to a ground plate of the electronic eyewear device using leaf springs on a side of the shield can. The leaf springs do not add to the stack-up thickness of the shield can assembly and provide a balanced force against the ground plate. The shield can is attached to a printed circuit board and encompasses radio frequency (RF) electronic components to prevent RF signals emanating from the RF electronic components. The leaf springs have a pair of fingers providing the balanced mechanical point force. A conductive pressure sensitive adhesive is also provided to secure a top surface of the shield can to the ground plate along with a thermal paste.

An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.

A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps.

An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.

A clip terminal for fixedly retaining a casing is provided. The terminal may have a connector part, at least one upstanding retention clip having a first height relative to a surface of the connector part, and a shielding part. The shielding part is located on an edge of the connector part and projects upwards relative to a surface of the connector part, and has a second height relative to the surface of the connector part which is greater than the first height. Alternatively, a clip terminal comprises a connector part, at least one upstanding retention clip, and a shielding part wherein the shielding part includes an extension portion at a top end that forms a surface for interaction with a suction instrument. A method of retaining a casing relative to a circuit board is also provided. Forming a clip terminal is provided along with a corresponding apparatus.

An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

A clip terminal for fixedly retaining a casing is provided. The terminal may have a connector part, at least one upstanding retention clip having a first height relative to a surface of the connector part, and a shielding part. The shielding part is located on an edge of the connector part and projects upwards relative to a surface of the connector part, and has a second height relative to the surface of the connector part which is greater than the first height. Alternatively, a clip terminal comprises a connector part, at least one upstanding retention clip, and a shielding part wherein the shielding part includes an extension portion at a top end that forms a surface for interaction with a suction instrument. A method of retaining a casing relative to a circuit board is also provided. Forming a clip terminal is provided along with a corresponding apparatus.