Presented herein is an air vent including a plate, and a non-uniform array of openings extending through a thickness of the plate. The non-uniform array of openings arranged to admit a flow of cooling air through the plate. The plate and the non-uniform array of openings are arranged to attenuate electromagnetic interference (EMI) emitted through the plate.

A method for managing electromagnetic interference (EMI) includes: obtaining electromagnetic radiation from a device, disposed in an internal volume of a data processing device, while the internal volume is EMI isolated and after the device performs a function; making a determination that the device disposed in the internal volume has an optical state associated with the electromagnetic radiation; and performing a first action set based on the determination, in which the electromagnetic radiation is obtained through a boundary of the internal volume.

A housing wall includes at least one air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure is coextensively arranged with the second mesh structure. The first layer and the second layer are electrically conductively coupled. The first mesh structure includes a first plurality of through-holes. The second mesh structure includes a second plurality of through-holes. The through-holes of the first plurality of through-holes are misaligned compared to through-holes of the second plurality of through-holes such that a nonuniform total through-hole configuration of the air grid is provided.

In some embodiments, a computer system chassis comprises a chassis side having an antenna portion and a fan portion. The antenna portion is located closer to an antenna located on an external surface of the chassis side than the fan portion. The antenna and fan portions comprise ventilation holes that provide for the venting of heated air from the chassis interior to the surrounding environment. In some embodiments, the ventilation holes in the antenna portion are thicker than the ventilation holes in the fan portion. The thicker ventilation holes provide an adequate level of EMI shielding for the antenna from platform noise generated by components (CPUs, GPUs, memories, etc.) located in the chassis interior. In other embodiments, the antenna portion comprises alternating positive and negative cross pattern ventilation holes and provides an adequate level of EMI shielding with the antenna portion ventilation holes having the same thickness as the fan portion ventilation holes.

An electronic apparatus includes: a chassis formed of a conductive member and including an opening; a radiation source arranged in the chassis and radiating noise electric waves; and a conductor formed of a conductive member and arranged on a same side of the radiation source as the opening with at least a part of the conductor overlapping the opening in a plan view of the opening. The conductor has one end electrically connected to the chassis and the other end as an electrically open end.

A housing wall comprises at least one air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure is coextensively arranged with the second mesh structure. The first layer and the second layer are electrically conductively coupled. The first mesh structure includes a first plurality of through-holes. The second mesh structure includes a second plurality of through-holes. The through-holes of the first plurality of through-holes are misaligned compared to through-holes of the second plurality of through-holes such that a nonuniform total through-hole configuration of the air grid is provided.

A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated and an optical state detector. The optical state detector obtains electromagnetic radiation from the internal volume while the internal volume is EMI isolated and makes a determination that a device disposed in the internal volume has an optical state associated with the electromagnetic radiation.

A thermal management device includes a fin pack and a plurality of channels. The fin pack has a hot side and a cold side, and the plurality of channels in the fin pack provide fluid communication from the hot side to the cold side. The channels have a transverse dimension and a longitudinal dimension, and the longitudinal dimension is at least 2.5 times the transverse dimension.

In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.

Embodiments include systems and methods for integrated control of environmental conditions in an equipment enclosure. For example, a novel airflow inlet structure can be installed into a primary airflow path of the equipment enclosure. The airflow inlet structure can include an integrated electrostatic filter sub-structure and an integrated electromagnetic radiation (EMR) control sub-structure. During operation of equipment within the enclosure, air drawn through the equipment enclosure can flow through the primary airflow path in such a way as to flow through the electrostatic filter sub-structure; and the EMR control sub-structure can control EMR emitted by the equipment, such that EMR leaving the enclosure is attenuated to below a threshold level.