A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

The outer layer is peeled exactly a predetermined length from the end portion of the electromagnetic shielding tube. That is, the metal layer is exposed exactly a predetermined range at the end portion of the electromagnetic shielding tube. A flexible conductor is connected to the exposed metal layer. A separated portion is provided in the inner layer. The separated portion is formed along the length direction of the electromagnetic shielding tube. Additionally, a depth of the separated portion is the same value as the thickness of the inner layer. As such, the inner surface of the metal layer is exposed at the separated portion. It is preferable that the separated portion be formed at a plurality of locations in the circumferential direction. The inner layer is divided into a plurality of sections in the circumferential direction by the separated portion. The separated portion is a terminal processed portion, which mitigates the effects caused by differences in the physical properties of the inner layer and the metal layer.

An electrical distribution center includes a housing formed of an electrically nonconductive material, an electromagnetic housing shield formed of an electrically conductive material disposed within a cavity in the housing, a cover enclosing the cavity having an electromagnetic cover shield formed of the electrically conductive material and in electrical contact with the housing shield, and a plurality of shielded electrical connectors interconnected to one another through electrical components contained within the cavity. The electrical components are mounted on a plurality of standoffs defined by an inner surface of the housing. The plurality of standoffs extends through a plurality of apertures defined in the housing shield.

A method for producing a component includes incorporating a molding compound into a tool for producing the component, where the molding compound includes an artificial resin as a matrix and a filler material embedded in the matrix. The method includes compressing the molding compound by the tool and by the compressing forming the molding compound to a green product. The method further includes providing the green product while disposed in the tool with a layer in a sub-region by incorporating a liquid material for producing the layer into the tool and applying the liquid material to the sub-region. The liquid material is a metallic material and the layer is an electromagnetic shielding on the green product.

The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.

A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.

A power converter includes a semiconductor modules, a capacitor, a housing, a shield layer and a collar member. The capacitor is electrically connected to the semiconductor modules. The housing houses at least the semiconductor modules and the capacitor. The shield layer is electrically conductive and provided on and covers at least one of inner and outer surfaces of the housing. The collar member is electrically conductive and integrated with the housing. The collar member is configured to allow a fastener to be inserted through the collar member such that the housing is fixed to a vehicle-side member via the fastener. The collar member is electrically conductively joined to the shield layer.

A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.

A system includes a hopper that is a faraday cage configured to receive multiple bins capable of holding one or more parts, each bin having a wirelessly readable identifier tag with a unique digital ID. An antenna is positioned within the hopper to receive wireless signals representative of the unique digital ID of each bin placed within the hopper.