A method for shielding components includes the steps of providing a component and applying at least one coating region, designed to shield from a magnetic and/or an electrical field, to the component by a thermal and/or kinetic spraying method such that a first arrangement space is shielded from a second arrangement space.

The outer layer is peeled exactly a predetermined length from the end portion of the electromagnetic shielding tube. That is, the metal layer is exposed exactly a predetermined range at the end portion of the electromagnetic shielding tube. A flexible conductor is connected to the exposed metal layer. A separated portion is provided in the inner layer. The separated portion is formed along the length direction of the electromagnetic shielding tube. Additionally, a depth of the separated portion is the same value as the thickness of the inner layer. As such, the inner surface of the metal layer is exposed at the separated portion. It is preferable that the separated portion be formed at a plurality of locations in the circumferential direction. The inner layer is divided into a plurality of sections in the circumferential direction by the separated portion. The separated portion is a terminal processed portion, which mitigates the effects caused by differences in the physical properties of the inner layer and the metal layer.

An IC package includes a substrate, a first monolithic die, a second monolithic die and a third monolithic die. A processing unit circuit is formed in the first monolithic die. A plurality of SRAM arrays are formed in the second monolithic die, wherein the plurality of SRAM arrays include at least 5-20 G Bytes. A plurality of DRAM arrays are formed in the third monolithic die, wherein the plurality of DRAM arrays include at least 64-512 G Bytes. The first monolithic die, the second monolithic die and the third monolithic die are vertically stacked above the substrate. The third monolithic die is electrically connected to the first monolithic die through the second monolithic die.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

The present invention relates to a grounding method and system for providing grounding and electromagnetic shielding to a cabinet configured for containing an ozone generator.

At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.

A network communication device includes communication circuitry configured to communicate signals over a network cable, and a connector configured to connect to the network cable. The connector includes one or more signal terminals, an inner shield connection and an outer shield connection. The one or more signal terminals are configured to connect to one or more signal conductors of the network cable for communicating the signals. The inner shield connection surrounds the one or more signal terminals and is connected to a circuit ground of the communication circuitry. The outer shield connection surrounds the inner shield connection and is connected to an additional ground of the network communication device, the additional ground being different from the circuit ground.

An electrical assembly is provided with a housing cast from an aluminum material to shield from electromagnetic interference, with a cavity sized to retain electrical components, an opening, and a series of receptacles formed about a perimeter of the opening. A seal is oriented about the perimeter of the opening. A cover is formed from an aluminum sheet material to shield from electromagnetic interference and is sized to enclose the opening. A plurality of mechanical retainers is formed about a perimeter of the cover and sized to align with the series of receptacles, to be mechanically deformed into the series of receptacles to affix the cover to the housing.

A shield case including a base portion made of a nonmetal material and having a mounting surface on which the electronic component is mounted, a cover portion made of a metal material and covering surroundings of the electronic component and a metal plate abutting with an outer surface of the base portion and having an end portion projecting outward from the base portion. A side-wall end portion of the cover member includes a first end abutting with the mounting surface of the base portion, and a second end extending in a thickness direction of the base portion and abutting with the end portion of the metal plate.

A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.