A receiving device of a system for inductive power transfer includes a housing, which includes a cover element and a base element, at least one reception area for a circuit board, at least one magnetic shielding element, wherein the at least one magnetic shielding element covers the at least one reception area of the cover element at least partially, and a winding structure, the magnetic shielding element is arranged below the winding structure with respect to a vertical axis of the receiving device and the vertical axis of the receiving device is oriented orthogonal to an upper surface of the cover element and a bottom surface of the base element.

An Electric and Magnetic Fields (EMF) protection device, includes: a metallic bottom; a metallic side extending from the metallic bottom; and a top opening, wherein the metallic bottom and the metallic side form a cylinder enclosure configured to substantially block a signal passing through the metallic side and the metallic bottom and allow the signal to pass only through the top opening.

An Electric and Magnetic Fields (EMF) protection device, includes: a metallic bottom; a metallic side extending from the metallic bottom; and a top opening, wherein the metallic bottom and the metallic side form a cylinder enclosure configured to substantially block a signal passing through the metallic side and the metallic bottom and allow the signal to pass only through the top opening.

A curtain for shielding an electromagnetic field may include a plurality of strip elements. A first strip element and a second strip element of the plurality of strip elements may have an electrically conductive layer. In a shielding configuration of the curtain, the electrically conductive layer of the first strip element is electrically connected to the electrically conductive layer of the second strip element and/or to an electrical connecting terminal for a reference potential. The plurality of strip elements can be variably positioned against one another.

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

The present invention relates to energy conversion device which contains one or more collection units (10) suitable for receiving environmental energy as well as a conversion unit (30) in an electrically conducting connection with the collection unit (10) with the help of a cable (20), at least one of the collection units (10) is formed by a set of metal material pipe members (11), while the conversion unit (30) has a condenser part-unit (32) consisting of metal armored plates (32a, 32a′) separated from each other by a gap (T) and located in the cover (31), as well as a frequency-setting part-unit (33) cooperating with the condenser part-unit (32), where the frequency-setting part-unit (33) has a reception space (35) located within the cover (31) of the conversion unit (30) and enclosed by a delimiting shell (34) in the vicinity of the condenser part-unit (32) and a charge (40) located in the reception space (35), and the charge (40) contains an organic component and an inorganic component distributed in a carrier medium (36).

An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

An electronic device and shield can structure are provided. The electronic device includes a housing, a circuit board disposed in the housing and one or more electronic components mounted on the circuit board, a shield can coupled to the circuit board and covering the one or more electronic components, one or more first fastening structures disposed on the circuit board and coupled to the shield can, the one or more first fastening structures having a first width, and one or more second fastening structures extending from the one or more first fastening structures, the one or more second fastening structures having a second width smaller than the first width.

A cooling appliance is proposed. A cavity (S) may be provided inside a casing (100, 200). A first heat source module (400) may be arranged in the casing (100, 200) and emit microwaves. A second heat source module (500) may be arranged at a bottom surface of the casing (100, 200) and emit magnetic fields. In addition, the second heat source module (500) may include a base plate (510) having a base hole (512) that is open at a center portion thereof, and a supporter (520) arranged below the base plate (510). A coil assembly (550) may be arranged between base plate (510) and the supporter (520). At this point, a shield filter (540) of the second heat source module (500) covers a working coil (570) of the coil assembly (550), and an outer end of the shield filter (540) may be arranged between the base plate (510) and a coil base (560).

The present disclosure provides a glass assembly, a manufacturing method thereof and a glass window. The glass assembly includes: a first glass plate and a second glass plate disposed opposite to each other, wherein inert gas is filled between the first glass plate and the second glass plate; a first electrode and a second electrode disposed between the first glass plate and the second glass plate, the inert gas is transformed into plasma in the case where an electric field is generated using the first electrode and the second electrode.