Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

Disclosed are one or more preferred geometric configurations for a device communicably coupled to a power transmission line and capable of launching transverse electromagnetic waves onto the transmission line. The waves propagate data received from a data source and may include a reflector and a coupler adjacent to each other through a transverse magnetic wave that propagates longitudinally along the surface of the transmission line.

A network communication device includes communication circuitry configured to communicate signals over a network cable, and a connector configured to connect to the network cable. The connector includes one or more signal terminals, an inner shield connection and an outer shield connection. The one or more signal terminals are configured to connect to one or more signal conductors of the network cable for communicating the signals. The inner shield connection surrounds the one or more signal terminals and is connected to a circuit ground of the communication circuitry. The outer shield connection surrounds the inner shield connection and is connected to an additional ground of the network communication device, the additional ground being different from the circuit ground.

Disclosed is an EMI shielding material. The EMI shielding material comprises a resin material and metal particles mixed with each other, wherein the surface of the metal particles has an insulating protective layer. Further disclosed is a communication module product, comprising a module element arranged on a substrate, wherein the periphery of the module element that requires EMI shielding is filled with said shielding material. Further disclosed is an EMI shielding process, comprising the following steps: a. preparing a communication module on which a module element is provided; and b. applying said shielding material to a region of the module element that needs to be EMI shielded on the communication module. The shielding material can shield a chip region in a wrapping manner, that is, the shielding material can wrap and shield all six surfaces or six directions of the chip, and can provide shielding between chips. The shielding material, when combined with an existing shielding process, can achieve good shielding from low frequencies to high frequencies, and has very low process costs.

The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.

An on-board telematic device intended to be attached to a metal part (3) of a body of a motor vehicle comprises, according to the invention, a housing (1) integrating a printed circuit board (5), a face of which supports at least one electronic power component (6), a radiofrequency antenna (7), intended to extend through an opening of the metal part (3), and a metal screen (9) interposed between a lower part of the antenna (7), on the one hand, and the printed circuit board (5) and said at least one component, on the other hand, in order to isolate the antenna from parasitic emissions. The component (6) is placed in line with the metal screen (9) and in thermal contact with a portion of said screen, and said screen (9) is made of a thermally conductive material so as to form a thermal transfer means between the electronic power component (6) and the metal part (3).

Disclosed is a signal conductor formed as a metal oxide varistor (MOV), the MOV having a first MOV and a second MOV separated by an insulator. In some embodiments, the disclosed signal conductor may be used in a system communicably coupled to a power transmission distribution network, the system capable of launching transverse electromagnetic waves onto a transmission line, where the electromagnetic waves propagating a data signal conveyed to the system by the MOV.

A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.