Patent classifications
H05K9/0064
Camera module and electronic device including the same
An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.
A SYSTEM AND METHOD FOR PROTECTING CABINETS FROM EMI
The present invention relates to a grounding method and system for providing grounding and electromagnetic shielding to a cabinet configured for containing an ozone generator.
COOLING APPARATUS AND COOLING SYSTEM
A cooling apparatus includes a cold plate made of a metal, a casing, a pump, a ground wire, and a conductive component. The pump includes a motor to drive an impeller, and a circuit board to control the motor. The circuit board is connected to the ground wire. The conductive component electrically connects the cold plate to the ground wire.
Automotive network communication devices and cabling with electromagnetic shielding
A network communication device includes communication circuitry configured to communicate signals over a network cable, and a connector configured to connect to the network cable. The connector includes one or more signal terminals, an inner shield connection and an outer shield connection. The one or more signal terminals are configured to connect to one or more signal conductors of the network cable for communicating the signals. The inner shield connection surrounds the one or more signal terminals and is connected to a circuit ground of the communication circuitry. The outer shield connection surrounds the inner shield connection and is connected to an additional ground of the network communication device, the additional ground being different from the circuit ground.
INVERTER MOUNTING STRUCTURE
The present disclosure relates to an inverter mounting structure having improved ease of assembly and durability, and capable of simplifying the structure of an inverter. According to one aspect of the present invention, provided is an inverter mounting structure comprising: a bracket fixed to an enclosure or a wall surface and forming an inverter accommodation space in which the inverter is accommodated and coupled; and an option case coupled to the outside of the bracket.
Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
DISPLAY SUBSTRATE AND DISPLAY DEVICE
The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.
ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
Tuner device
Provided is a tuner device including: a box-shaped metal tuner case; a plurality of connectors which are attached to one surface of the tuner case; a plurality of connection pins for signal transmission, the pins being provided on the other surface of the tuner case; and at least one foot electrode which is provided in the vicinity of the connection pins and is grounded.
ELECTRIC FENCE ENERGIZERS AND METHODS FOR EARTHING SAME
A portable electric fence energizer is described, having a housing and an electric pulse generating circuit located within the housing. The energizer further includes a post securing mechanism configured to secure the housing relative to an electrically conductive post. The post securing mechanism includes at least one electrical contact configured to contact the post when secured by the post securing mechanism. A conductive link between the electrical contact and the electric pulse generating circuit may be used to provide an earth connection for the energiser, or an output connection between the electric pulse generating circuit and a wire of the electric fence.