H05K9/0071

Programmable wire filaments and devices
11706908 · 2023-07-18 · ·

A switchable wire includes filaments, each of which includes a heat-activated material layer that may be indirectly heated to change its state between different states having different electrical conductivity. In an example embodiment the indirect heating may be electrically resistance heating by passing electrical current through an electrically-resistive core of the filament. The heat passing through an electrically-insulative coating around the core, and into a heat-activated material layer around the electrically-insulative coating. The heat-activated material may be a chalcogenide material that is shiftable between a crystalline electrically-conducting state and an amorphous electrically-insulating state. The state of the material may be controlled by controlling the heating profile through controlling heating in the core. Many such filaments may be twisted together to form a switchable wire. Such wires may be used in any of a variety of devices where switchable electrical conductivity is desired.

Embedded co-cured composite material with large-damping and electromagnetic wave absorbing properties and preparation method and application thereof

Disclosed are an embedded co-cured composite material with large-damping and electromagnetic wave absorbing properties and a preparation method and an application thereof, belonging to damping composite materials. The embedded co-cured composite material is formed by interlacing a plurality of electromagnetic wave absorbing prepreg layers and a plurality of electromagnetic wave absorbing damping layers. Each of the electromagnetic wave absorbing prepregs layers includes a fiber cloth, a micro-nano electromagnetic wave absorbing material and a resin. Contents of the micro-nano electromagnetic wave absorbing material in the electromagnetic wave absorbing prepreg layers and the electromagnetic wave absorbing damping layers have a gradient increase or decrease according to a sequence of the electromagnetic wave absorbing prepreg layers. Each of the electromagnetic wave absorbing damping layers includes a viscoelastic damping material and the micro-nano electromagnetic wave absorbing material.

Method of uniformly dispersing nickel-plated conductive particles of single layer within polymer film by applying magnetic field to polymer film and method of fabricating anisotropic conductive film using the same

Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD
20230103894 · 2023-04-06 · ·

A high-frequency package includes a radio wave shielding portion that shields radio waves radiated from a high-frequency component, a radio wave absorber that is arranged facing the high-frequency component and that absorbs the radio waves, and an adjusting means that enables adjustment of distance from the radio wave absorber to the high-frequency component by adjusting a position of the radio wave absorber with respect to the radio wave shielding portion.

Electronic component housing package and electronic apparatus
09847267 · 2017-12-19 · ·

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

CIRCUIT STRUCTURE, BATTERY, AND ELECTRONIC DEVICE
20230187714 · 2023-06-15 ·

Provided are a circuit structure, a battery, and an electronic device. The circuit structure comprises: a battery, comprising a first positive electrode, a first negative electrode, and a battery cell, wherein the battery cell is connected between the first positive electrode and the first negative electrode, and the battery cell is configured to generate a first induced magnetic field when a changing current flows therethrough; and an electromagnetic inductor, configured to generate a second induced magnetic field when the changing current flows therethrough, wherein the second induced magnetic field is superposed on the first induced magnetic field.

Electromagnetic wave shielding material

Provided is an electromagnetic wave shielding material that can exhibit improved electromagnetic wave shielding property, light-weight property and formability. The present invention relates to an electromagnetic wave shielding material comprising a laminate in which N number of metal foils each having a thickness of 5 to 100 μm and N+1 number of resin layers each having a thickness of 5 μm or more are alternately laminated or a laminate in which N+1 number of metal foils each having a thickness of 5 to 100 μm and N number of resin layers each having a thickness of 5 μm or more are alternately laminated, N being an integer of 2 or more, wherein thickness of the laminate is from 100 to 500 μm, and wherein, when a thickness center of the laminate is used as a reference, for all pairs of interfaces at which sequences of the resin layers and the metal foils on both upper and lower sides of the reference correspond to each other, distances from the reference to the interfaces have an error of within ±10%.

ELECTROMAGNETIC INTERFERENCE MANAGEMENT IN A POWER CONVERTER
20220039300 · 2022-02-03 ·

One or more embodiments can comprise a method, including detecting, by a power converter comprising a processor, a feedback signal level based on based on an output condition of an error amplifier. The method can further comprise, based on the feedback signal level, setting, by the power converter, a combination of a switching frequency and a magnetizing current level, wherein the combination is selected to achieve an electromagnetic interference (EMI) level for the power converter that satisfies a first condition.

Electronic apparatus and electromagnetic radiation suppression method

An electronic apparatus includes an electromagnetic radiation source structure and an electromagnetic radiation suppression structure. The electromagnetic radiation source structure is formed in at least one first semiconductor die. The electromagnetic radiation suppression structure is formed in a second semiconductor die, and is used for generating an inverse electromagnetic radiation against the electromagnetic radiation emission of the electromagnetic radiation source structure by sensing the electromagnetic radiation emission of the electromagnetic radiation source structure, to suppress the electromagnetic radiation emission of the electromagnetic radiation source structure from passing through the electromagnetic radiation suppression structure. Another electronic apparatus includes an electromagnetic radiation source structure and an electromagnetic radiation suppression structure. The electromagnetic radiation suppression structure is formed in a printed circuit board. The electromagnetic radiation source structure is formed in a semiconductor die. Associated electromagnetic radiation suppression methods are also disclosed.

Sensor mat providing shielding and heating

According to various implementations, a sensor mat includes a mat substrate, a sensor electrode, and a shield electrode. At least a portion of the sensor and shield electrodes are spaced apart from and parallel to each other on a first surface of the mat substrate. The shield electrode is electrically coupled to a voltage source to create a capacitance between the shield electrode and the sensor electrode, and the sensor electrode is used to detect a change in the capacitance. The shield electrode may also be alternately used for heating the surface of the vehicle part adjacent the mat. For example, the sensor may be disposed adjacent a portion of a steering wheel or a seat assembly and is used for sensing presence of an occupant's hands or body adjacent the steering wheel or seat assembly.