A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

The outer layer is peeled exactly a predetermined length from the end portion of the electromagnetic shielding tube. That is, the metal layer is exposed exactly a predetermined range at the end portion of the electromagnetic shielding tube. A flexible conductor is connected to the exposed metal layer. A separated portion is provided in the inner layer. The separated portion is formed along the length direction of the electromagnetic shielding tube. Additionally, a depth of the separated portion is the same value as the thickness of the inner layer. As such, the inner surface of the metal layer is exposed at the separated portion. It is preferable that the separated portion be formed at a plurality of locations in the circumferential direction. The inner layer is divided into a plurality of sections in the circumferential direction by the separated portion. The separated portion is a terminal processed portion, which mitigates the effects caused by differences in the physical properties of the inner layer and the metal layer.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

The present disclosure provides a power module and a solid-state transformer system. The power module includes: a circuit module, having a voltage level; and a cabin, configured to wrap the circuit module by bending or splicing, where the cabin has a shielding structure, the shielding structure including: a first conductor layer, located at a side close to the circuit module and equipotentially connected to the circuit module; a second conductor layer, arranged apart from the first conductor layer and located at a side away from the circuit module; and a solid insulating layer, provided between the first conductor layer and the second conductor layer for electrically isolating the first conductor layer and the second conductor layer. The power module provided by the present disclosure has good insulation performance and is easy to assemble.

A method for producing a component includes incorporating a molding compound into a tool for producing the component, where the molding compound includes an artificial resin as a matrix and a filler material embedded in the matrix. The method includes compressing the molding compound by the tool and by the compressing forming the molding compound to a green product. The method further includes providing the green product while disposed in the tool with a layer in a sub-region by incorporating a liquid material for producing the layer into the tool and applying the liquid material to the sub-region. The liquid material is a metallic material and the layer is an electromagnetic shielding on the green product.

An electromagnetic wave absorber includes an electromagnetic wave-absorbing layer (10) and an adhesive layer (20). The adhesive layer (20) is disposed on at least one surface of the electromagnetic wave-absorbing layer (10). The electromagnetic wave absorber is capable of being adhered to a surface having a step in such a manner that the adhesive layer (20) is in contact with the surface. The adhesive layer (20) has a thickness equal to or greater than a reference height determined by subtracting 0.1 mm from the height of the step. In the electromagnetic wave absorber, a return loss ΔR defined by ΔR=Rt−Rr is 15 dB or more. Rt is a reflection amount of a 76-GHz electromagnetic wave and is measured for a reference specimen. Rr is a reflection amount of a 76-GHz electromagnetic wave and is measured for a specimen obtained by adhering the electromagnetic wave absorber.

The device consists of a container manufactured from a metamaterial with the property of transparency to visible light, for the holding of electrical or electronic devices, which electromagnetically protects the same and renders them electromagnetically undetectable. The purpose of the device is to guarantee user confidentiality in the use of the electromagnetic waves associated with telecommunications, by means of the use of a type of container that encloses any type of telecommunication device or appliance, with the potentiality that the insertion thereof into said container prevents the detection by means of electromagnetic waves of said appliance, and therefore makes impossible the tracing of said appliance by electromagnetic remote sensing means, including mobile telephony, radiofrequencies, or satellite telecommunication means such as GPS, Galileo, or other systems, without it being necessary to switch off said appliance beforehand.

A flexible laminate for shielding against electromagnetic radiation includes: a) at least one metal foil; and b) a sheet-like substrate made of a fiber material, film material, or foam material. The laminate includes a plurality of objects formed by incisions into a base area of the laminate. Each object of the plurality of objects is made of two or more incisions having a common initial point. The two or more incisions, or each of two adjacent incisions of the two or more decisions, define an angle of 45° to 160°.

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.