A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

A device and method for absorbing electromagnetic waves can include a honeycomb sheet formed by a plurality of interconnected hexagon cells arranged in rows. The hexagon cells are made up of sidewalls, each sidewall formed by two surfaces that converge at a top of the sidewall and diverge from the top to a bottom of the sidewall such that a thickness of the sidewalls increases from top to bottom and an angle forms between the two surfaces at the top of the sidewall. In an example, the angle is about 8 degrees. The honeycomb sheet can be coated with a magnetic, composite coating to increase electromagnetic shielding. An example coating includes magnetic multi-granular nanoclusters (MGNC) and multi-walled carbon nanotubes (MWCNT). A base layer can be attached to the honeycomb sheet for mechanical stability and additional absorption. The device is suitable for radar absorbing materials (RAM) for aerospace and military applications.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

A technique for an AMR-based sensing circuit allows current measurements over a wide frequency range. This is accomplished by folding the current carrying trace around the AMR sensor to concentrate and normalize the magnetic field generated by the current over a wide frequency range. Experimental results show that the sensor, when implemented with the proposed method, has an improved bandwidth of >10 MHz and enhanced sensitivity to high frequency currents evinced by the sensor output at DC or lower frequencies. The method is applicable for example in high frequency power converters where inductor current is used to control the ripple and transient response.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 μm, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.

A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.