The present disclosure relates to a semiconductor device and a fabricating method thereof, includes a substrate, a gate structure, a plug hole, a plug spacer, a metal silicide layer, and a plug. The gate structure is disposed on the substrate. The plug hole is disposed within a dielectric layer to partially extended into the substrate. The plug spacer is disposed on a sidewall of the plug hole to partially expose the substrate. The metal silicide layer is disposed at a bottom of the plug hole, wherein a portion of the substrate is sandwiched between the metal silicide layer and the plug spacer. The plug is disposed in the plug hole to physically contact the portion of the substrate. Accordingly, through forming the plug spacer to precisely define the forming location and the depth of the metal silicide layer, thereby achieving the function on improving the performance of the semiconductor device.

A semiconductor device includes a semiconductor substrate, a first gate oxide layer, and a first source/drain doped region. The first gate oxide layer is disposed on the semiconductor substrate, and the first gate oxide layer includes a main portion and an edge portion having a sloping sidewall. The first source/drain doped region is disposed in the semiconductor substrate and located adjacent to the edge portion of the first gate oxide layer. The first source/drain doped region includes a first portion and a second portion. The first portion is disposed under the edge portion of the first gate oxide layer in a vertical direction, and the second portion is connected with the first portion.

A semiconductor structure includes a first field effect transistor including a first gate spacer having first laterally-straight bottom edges that coincide with top edges of first laterally-straight sidewalls of the first gate dielectric. The semiconductor structure further includes a second field effect transistor including a second gate dielectric that includes at least one discrete gate-dielectric opening that overlies a respective second active region, and a second gate spacer including a contoured portion that overlies and laterally surrounds a second gate electrode, and at least one horizontally-extending portion that overlies the second active region and including at least one discrete gate-spacer openings. The second field effect transistor may have a symmetric or non-symmetric configuration.

Techniques are disclosed for forming transistor devices having reduced parasitic contact resistance relative to conventional devices. The techniques can be implemented, for example, using a standard contact stack such as a series of metals on, for example, silicon or silicon germanium (SiGe) source/drain regions. In accordance with one example such embodiment, an intermediate boron doped germanium layer is provided between the source/drain and contact metals to significantly reduce contact resistance. Numerous transistor configurations and suitable fabrication processes will be apparent in light of this disclosure, including both planar and non-planar transistor structures (e.g., FinFETs), as well as strained and unstrained channel structures. Graded buffering can be used to reduce misfit dislocation. The techniques are particularly well-suited for implementing p-type devices, but can be used for n-type devices if so desired.

A semiconductor structure includes a substrate having thereon a dielectric layer. An opening is formed in the dielectric layer. The opening includes a bottom surface and a sidewall surface. A diffusion barrier layer is conformally disposed along the sidewall surface and the bottom surface of the opening. A nucleation metal layer is conformally disposed on the diffusion barrier layer. A bulk metal layer is disposed on the nucleation metal layer. A film-growth retarding layer is disposed between the nucleation metal layer and the bulk metal layer.

A semiconductor device and the method of manufacturing the same are provided. The semiconductor device comprises a well region, a first doped region, a drain region, a source region and a gate electrode. The first doped region of a first conductivity type is located at a first side within the well region. The drain region of the first conductivity type is within the first doped region. The source region of the first conductivity type is at a second side within the well region, wherein the second side being opposite to the first side. The gate electrode is over the well region and between the source region and the drain region. A surface of the drain region and a surface of the source region define a channel and the surface of the source region directly contacts the well region.

The present disclosure provides a method for forming a semiconductor structure. The method includes providing a semiconductor substrate; forming a first active region, a second active region, a third active region, and a fourth active region in the semiconductor substrate; and forming a middle-voltage P well region (MVPW) in each of the first active region and the second region simultaneously and forming a middle-voltage N well (MVNW) region in each of the third active region and the fourth active region simultaneously.

Deterioration in reliability is prevented regarding a semiconductor device. The deterioration is caused when an insulating film for formation of a sidewall is embedded between gate electrodes at the time of forming sidewalls having two kinds of different widths on a substrate. A sidewall-shaped silicon oxide film is formed over each sidewall of a gate electrode of a low breakdown voltage MISFET and a pattern including a control gate electrode and a memory gate electrode. Then, a silicon oxide film beside the gate electrode is removed, and a silicon oxide film is formed on a semiconductor substrate, and then etchback is performed. Accordingly, a sidewall, formed of a silicon nitride film and the silicon oxide film, is formed beside the gate electrode, and a sidewall, formed of the silicon nitride film and the silicon oxide films, is formed beside the pattern.

Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes using a first mask to pattern a gate material forming a plurality of first and second features. The first features form gate electrodes of the semiconductor devices, whereas the second features are dummy electrodes. Based on the location of these dummy electrodes, selected dummy electrodes are removed using a second mask. The use of the method provides greater flexibility in tailoring individual devices for different objectives.

Provided is a semiconductor device having improved performance. Over a semiconductor substrate, a dummy control gate electrode is formed via a first insulating film. Over the semiconductor substrate, a memory gate electrode for a memory cell is formed via a second insulating film having an internal charge storage portion so as to be adjacent to the dummy control gate electrode. At this time, the height of the memory gate electrode is adjusted to be lower than the height of the dummy control gate electrode. Then, a third insulating film is formed so as to cover the dummy control gate electrode and the memory gate electrode. Then, the third insulating film is polished to expose the dummy control gate electrode. At this time, the memory gate electrode is not exposed. Then, the dummy control gate electrode is removed and replaced with a metal gate electrode.