Patent classifications
H10D30/6746
THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME, AND ARRAY SUBSTRATE
Disclosed are a thin film transistor, a method of manufacturing the same, and an array substrate. The thin film transistor includes a substrate, a gate, a gate insulating layer, an active layer, an ohmic contact layer, and a source-drain electrode layer, the gate insulating layer includes at least a first gate insulating layer deposited at a low rate, a second gate insulating layer deposited at a high rate, and a third gate insulating layer deposited at a low rate, the first gate insulating layer is in contact with the gate, the third gate insulating layer is in contact with the active layer, and the first gate insulating layer and the third gate insulating layer have a density greater than a density of the second gate insulating layer.
Thin film transistor, method for manufacturing the same, and semiconductor device
In a thin film transistor, an increase in off current or negative shift of the threshold voltage is prevented. In the thin film transistor, a buffer layer is provided between an oxide semiconductor layer and each of a source electrode layer and a drain electrode layer. The buffer layer includes a metal oxide layer which is an insulator or a semiconductor over a middle portion of the oxide semiconductor layer. The metal oxide layer functions as a protective layer for suppressing incorporation of impurities into the oxide semiconductor layer. Therefore, in the thin film transistor, an increase in off current or negative shift of the threshold voltage can be prevented.
Manufacturing method of array substrate, array substrate and display device
The present invention provides an array substrate and a manufacturing method thereof and a display device. The manufacturing method comprises: forming a pattern including a pixel electrode and a source of a thin film transistor on a base substrate through a single patterning process, the pixel electrode is provided in a layer under a layer in which the source is located; forming a pattern including a drain, an active layer, a gate insulation layer and a gate of the thin film transistor through a single patterning process, the active layer covers the source and the drain, and is separated from the gate through the gate insulation layer; and forming a pattern including a passivation layer, a common electrode and a gate line through a single patterning process, the common electrode is a slit electrode and separated from the active layer and the pixel electrode through the passivation layer.
Bi-axial tensile strained GE channel for CMOS
An apparatus including a complimentary metal oxide semiconductor (CMOS) inverter including an n-channel metal oxide semiconductor field effect transistor (MOSFET); and a p-channel MOSFET, wherein a material of a channel in the n-channel MOSFET and a material of a channel in the p-channel MOSFET is subject to a bi-axial tensile strain. A method including forming an n-channel metal oxide semiconductor field effect transistor (MOSFET); forming a p-channel MOSFET; and connecting the gate electrodes and the drain regions of the n-channel MOSFET and the p-channel MOSFET, wherein a material of the channel in the n-channel MOSFET and a material of the channel in the p-channel MOSFET is subject to a bi-axial tensile strain.
Semiconductor device and manufacturing method thereof
An oxide semiconductor layer which is intrinsic or substantially intrinsic and includes a crystalline region in a surface portion of the oxide semiconductor layer is used for the transistors. An intrinsic or substantially intrinsic semiconductor from which an impurity which is to be an electron donor (donor) is removed from an oxide semiconductor and which has a larger energy gap than a silicon semiconductor is used. Electrical characteristics of the transistors can be controlled by controlling the potential of a pair of conductive films which are provided on opposite sides from each other with respect to the oxide semiconductor layer, each with an insulating film arranged therebetween, so that the position of a channel formed in the oxide semiconductor layer is determined.
Display device
Even when a light shielding film is provided between a transistor and a substrate, a threshold voltage of the transistor can be prevented or suppressed from being shifted. A display device includes light shielding films provided between a substrate and a semiconductor layer of a transistor including a gate electrode and the semiconductor layer. The semiconductor layer includes a source region and a drain region. Both of the light shielding films overlap the semiconductor layer when seen in a plan view, and are spaced apart from each other in a direction.
Peeling method and method of manufacturing semiconductor device
There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.
Array substrate and manufacturing method thereof and display apparatus
The present invention relates to an array substrate, which comprises: a display region and a drive circuit region; the drive circuit region comprises GOA units, the GOA unit comprising a substrate, a gate electrode layer, an insulation layer, an active layer and a source/drain electrode layer, and the drive circuit region further comprises a gate wire connecting to the gate electrode layer, and a source/drain layer wire at the same layer with the source/drain electrode layer, wherein the area between the portions of the gate wire and the source/drain layer wire which intercross with each other is only formed with the insulation layer. The invention further relates to a manufacturing method of an array substrate and a display apparatus comprising the array substrate.
DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
A display substrate includes a base substrate comprising a plurality of sub-pixels, a first switching element disposed on the base substrate and electrically connected to a gate line extending in a first direction and a data line extending in a second direction crossing the first direction, a color filter layer disposed on the switching element and comprising a red color filter, a green color filter, a blue color filter and a white color filter alternately disposed on the plurality of sub-pixels, respectively, a column spacer disposed on the color filter and comprising the same material as that of the white color filter, an insulation layer disposed on the color filter and the column spacer and a pixel electrode disposed on the insulation layer.
Liquid crystal display device
A liquid crystal display device includes a TFT substrate having a display region with first and second electrodes, TFTs, scanning signal lines connected to the TFTs, a counter substrate, a liquid crystal layer sandwiched between the TFT and counter substrates, and sealed by a sealant, scanning line leads connected to the scanning signal lines and formed outside of the display region, video signal line leads connected to the video signal lines and formed outside of the display region and a shield electrode formed on the TFT substrate covering the scanning line leads but not the video signal line leads. The second electrode is connected to one of the TFTs, and liquid crystal molecules of the liquid crystal layer are driven by an electric field, which is generated between the first and second electrodes. The shield electrode is electrically connected to the first electrode and overlapped with the sealant in plan view.