A quantum nano-tip (QNT) thin film, such as a silicon nano-tip (SiNT) thin film, for flash memory cells is provided to increase erase speed. The QNT thin film includes a first dielectric layer and a second dielectric layer arranged over the first dielectric layer. Further, the QNT thin film includes QNTs arranged over the first dielectric layer and extending into the second dielectric layer. A ratio of height to width of the QNTs is greater than 50 percent. A QNT based flash memory cell and a method for manufacture a SiNT based flash memory cell are also provided.

A non-volatile memory cell includes a substrate, a select gate, a floating gate, and an assistant control gate. The substrate includes a first diffusion region, a second diffusion region, a third diffusion region, and a fourth diffusion region. The select gate is formed above the first diffusion region and the second diffusion region in a polysilicon layer. The floating gate is formed above the second diffusion region, the third diffusion region and the fourth diffusion region in the polysilicon layer. The assistant control gate is formed above the floating gate in a metal layer, wherein an area of the assistant control gate overlaps with at least half an area of the floating gate.

A single-poly NVM cell includes a select transistor and a floating gate transistor serially connected to the select transistor. The select transistor includes a select gate, a select gate oxide layer, a source doping region, a first LDD region merged with the source doping region, a commonly-shared doping region, and a second LDD region merged with the commonly-shared doping region. The floating gate transistor includes a floating gate, a floating gate oxide layer, the commonly-shared doping region, a third LDD region merged with the commonly-shared doping region, and a drain doping region. A drain-side extension modified region is disposed under the spacer and in proximity to the drain doping region.

Embodiments of a simple and cost-free multi-time programmable (MTP) structure for non-volatile memory cells are presented. The memory cell includes a substrate, a first transistor having a select gate and a second transistor having a floating gate. The select and floating gates are adjacent to one another and disposed over a transistor well. The transistors include first and second S/D regions disposed adjacent to the sides of the gates. A control gate is disposed over a control well. The control gate is coupled to the floating gate and includes a control capacitor. An erase terminal is decoupled from the control capacitor and transistors.

A method of forming a memory device on a semiconductor substrate having a memory region (with floating and control gates), a first logic region (with first logic gates) and a second logic region (with second logic gates). A first implantation forms the source regions adjacent the floating gates in the memory region, and the source and drain regions adjacent the first logic gates in the first logic region. A second implantation forms the source and drain regions adjacent the second logic gates in the second logic region. A third implantation forms the drain regions adjacent the control gates in the memory region, and enhances the source region in the memory region and the source/drain regions in the first logic region. A fourth implantation enhances the source/drain regions in the second logic region.

Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.

A non-volatile memory device including a substrate and a memory cell. The memory cell includes a select transistor, a floating gate transistor, and a metal conductor. The select transistor includes a select gate structure over the substrate, a first source/drain region on a first side of the select gate structure, and a second source/drain region on a second side of the select gate structure opposite the first side. The floating gate transistor includes a floating gate structure over the substrate, the second source/drain region on a third side of the floating gate structure, and a third source/drain region on a fourth side of the floating gate structure opposite the third side. The metal conductor is over and electrically isolated from the floating gate structure. The floating gate transistor further includes a first low-voltage lightly doped drain between the floating gate structure and the third source/drain region.

In one aspect, a flash memory cell includes a well having a first-type dopant, a source having a second-type dopant and formed within the well, a drain having the second-type dopant and formed within the well, a floating gate above the well, a control gate above the floating gate, an oxide compound disposed between the floating gate and the control gate, and a tunnel oxide disposed between the floating gate and the well. The flash memory cell is configured, in one of a program mode or an erase mode, to move an electron from the source to the floating gate. The flash memory cell is configured, in the other one of the program or the erase mode, to move an electron is from the floating gate to the drain.

The present application discloses a method for manufacturing a semiconductor device, which includes the following steps: step 1: forming first gate structures on a semiconductor substrate; step 2: performing a first etching process to etch the semiconductor substrate on at least one side of each first gate structure to a certain depth and form a first groove; step 3: performing a stress memorization process, including step 31: forming a stress dielectric layer, the stress dielectric layer covering a peripheral surface of each first gate structure and being filled in the first groove; step 32: performing annealing to transfer the stress of the stress dielectric layer to a channel region; step 33: removing the stress dielectric layer. The present application can increase the effect of transferring the stress of the stress dielectric layer to the channel region, thereby increasing the mobility of channel carriers.

A semiconductor device with interleaved active and isolation regions extending in a first direction. Memory cells formed in the active regions each include first and second drain regions, first and second floating gates, word line gate, first and second control gates, and first and second erase gates. Each of the active regions includes a plurality of first drain contacts each electrically connected to one of the first drain regions in the active region, and a plurality of second drain contacts each electrically connected to one of the second drain regions in the active region. A plurality of first bit lines extend in the first direction and each is electrically connected to the first drain contacts in one of the active regions. A plurality of second bit lines extend in the first direction and each is electrically connected to the second drain contacts in two of the active regions.