A hybrid transistor circuit is disclosed for use in III-Nitride (III-N) semiconductor devices, comprising a Silicon (Si)-based Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), a Group III-Nitride (III-N)-based Field-Effect Transistor (FET), and a driver unit. A source terminal of the III-N-based FET is connected to a drain terminal of the Si-based MOSFET. The driver unit has at least one input terminal, and two output terminals connected to the gate terminals of the transistors respectively. The hybrid transistor circuit is turned on through the driver unit by switching on the Silicon-based MOSFET first before switching on the III-N-based FET, and is turned off through the driver unit by switching off the III-N-based FET before switching off the Silicon-based MOSFET. Also disclosed are integrated circuit packages and semiconductor structures for forming such hybrid transistor circuits. The resulting hybrid circuit provides power-efficient and robust use of III-Nitride semiconductor devices.

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, and at least a doped region formed in the source region. The source region and the drain region include a first conductivity type, and the doped region includes a second conductivity type complementary to the first conductivity type. The doped region is electrically connected to a ground potential.

A semiconductor device according to an embodiment is provided with a plurality of active barrier sections each of which is enclosed by a plurality of element isolation sections each of which is configured of a closed pattern. Namely, the plurality of active barrier sections are electrically isolated from each other.

A transistor cell includes a drift region, a source region, a body region, and a drain region that is laterally spaced apart from the source region. A gate electrode is adjacent the body region. A field electrode is arranged in the drift region. A source electrode is connected to the source region and the body region, and a drain electrode is connected to the drain region. An avalanche bypass structure is coupled between the source electrode and the drain electrode and includes a first semiconductor layer of the first doping type, a second semiconductor layer of the first doping type, and a pn-junction arranged between the first semiconductor layer and the source electrode. The second semiconductor layer has a higher doping concentration than the first semiconductor layer and is arranged between the second semiconductor layer and the drift region. The drain electrode is electrically connected to the second semiconductor layer.

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, and at least a first doped region formed in the drain region. The source region and the drain region include a first conductivity type, and the first doped region includes a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other. The first doped region is electrically connected to a ground potential.

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, and at least a first doped region formed in the drain region. The source region and the drain region include a first conductivity type, and the first doped region includes a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other. The first doped region is electrically connected to a ground potential.

The present disclosure introduces semiconductor devices that include a first doped region having a first dopant type, a second doped region having a second dopant type different from the first dopant type, and third and fourth doped regions. The third and fourth doped regions have the first dopant type, contact corresponding opposite sides of the second doped region, and are electrically connected to the second doped region. The present disclosure also introduces diode implementations of such semiconductor devices, as well as methods of manufacturing such semiconductor devices.

A power conversion circuit includes a high-side transistor, a low-side transistor, and a driving circuit. The high-side transistor provides an input voltage to a switch node based on a first signal. The low-side transistor couples the switch node to a ground based on a second signal, and is deposited in an isolation layer. The driving circuit generates the first signal, the second signal, and the third signal, provides a third signal to the isolation layer, and generates the third signal based on the first signal and the second signal.

A semiconductor device includes a first node having a first conductivity type in a semiconductor layer, a second node having a first region with a second, opposite, conductivity type in the semiconductor layer, and a second region adjacent to the first region in the semiconductor layer, and a minority carrier collector having the first conductivity type in the second region of the second node in the semiconductor layer. Another semiconductor device includes an anode in a semiconductor layer, a cathode spaced apart from the anode in the semiconductor layer, and a minority carrier collector adjacent the cathode in the semiconductor layer and having P-type dopants.

A transistor assembly with gate current shunting capability includes first field effect transistor (FET), a first pull-up current source, a first pull-down current source, a first switching device, a control circuit, a capacitor, and a second FET. The first FET is an N-channel FET including a first gate, a first drain, and a first source. The first drain is electrically coupled to a first power supply. Each of the pull-up current source and the pull-down current source is electrically coupled to the first gate. The first switching device is electrically coupled in series with the first pull-down current source and is controlled by a first control signal. The control circuit is at least partially powered by a second power supply and generates the first control signal. The capacitor and the second FET collectively shunt current away from the first gate during a pre-power operating state of the transistor assembly.