One embodiment of the present invention can provide a system for fabrication of a photovoltaic structure. The system can include a physical vapor deposition tool configured to sequentially deposit a transparent conductive oxide layer and a metallic layer on an emitter layer formed in a first surface of a Si substrate, without requiring the Si substrate to be removed from the physical vapor deposition tool after depositing the transparent conductive oxide layer. The system can further include an electroplating tool configured to plate a metallic grid on the metallic layer and a thermal annealing tool configured to anneal the transparent conductive oxide layer.

Methods for forming a photovoltaic device include forming a buffer layer between a transparent electrode and a p-type layer. The buffer layer includes a work function that falls substantially in a middle of a barrier formed between the transparent electrode and the p-type layer to provide a greater resistance to light induced degradation. An intrinsic layer and an n-type layer are formed over the p-type layer.

A chipset with light energy harvester, includes a substrate, a functional element layer, and a light energy harvesting layer, both are stacked vertically on the substrate, and an interconnects connected between the functional element layer and the light energy harvesting layer.

An array substrate, a manufacture method of the array substrate, and a display panel are configured to achieve a combination of solar energy technology and the OLED display technology. The array substrate includes substrate, scanning lines, data lines, a thin film transistor (TFT), a common electrode and a pixel electrode. The array substrate further includes a light-emitting structure configured to provide a backlight source, a solar cell structure and a power output line. The light-emitting structure is provided between the common electrode and the pixel electrode. The solar cell structure is provided between the substrate and the common electrode. The power output line is provided in a same layer as the common electrode and is electrically connected to the solar cell structure so as to transmit electric energy generated by the solar cell structure to an external circuit.

A device including at least one photovoltaic cell and at least one nanowire configured to electrically stimulate a biological material in response to radiation.

A solid-state imaging device with high productivity and improved dynamic range is provided. In the imaging device including a photoelectric conversion element having an i-type semiconductor layer, functional elements, and a wiring, an area where the functional elements and the wiring overlap with the i-type semiconductor in a plane view is preferably less than or equal to 35%, further preferably less than or equal to 15%, and still further preferably less than or equal to 10% of the area of the i-type semiconductor in a plane view. Plural photoelectric conversion elements are provided in the same semiconductor layer, whereby a process for separating the respective photoelectric conversion elements can be reduced. The respective i-type semiconductor layers in the plural photoelectric conversion elements are separated by a p-type semiconductor layer or an n-type semiconductor layer.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

The present invention relates to a solar cell (10) comprising a substrate (100) made of a transparent material and intended to be exposed to light radiation, a first electrode (110) formed on the substrate (100), and a unit solar cell (130) arranged between this first electrode (110) and a second electrode (120), the first and second electrodes (110, 120) being made of an electrically conductive and transparent material, the unit solar cell (130) being adapted to absorb light radiation and to generate an electric current therefrom at the terminals of said first and second electrodes (110, 120), the second electrode (120) and the unit solar cell (130) being perforated so as to allow light radiation to pass through said solar cell (10).

Photovoltaic devices with very high breakdown voltages are described herein. Typical commercial silicon photovoltaic devices have breakdown voltages below 50-100 volts (V). Even though such devices have bypass diodes to prevent photovoltaic cells from going into breakdown, the bypass diodes have high failure rates, leading to unreliable devices. A high-efficiency silicon photovoltaic cell is provided with very high breakdown voltages. By combining a device architecture with very low surface recombination and silicon wafers with high bulk resistivity (above 10 ohms centimeter (-cm)), embodiments described herein achieve breakdown voltages close to 1000 V. These photovoltaic cells with high breakdown voltages improve the reliability of photovoltaic devices, while reducing their design complexity and cost.