Patent classifications
H10F19/85
PHOTOVOLTAIC PACKAGING, AND A METHOD FOR MANUFACTURING SUCH A PHOTOVOLTAIC PACKAGING
The present teachings relate to a photovoltaic packaging comprising a polymer back layer, photovoltaic cells electrically connected to each other, a polymer front layer which is transparent to light, and which is configured to be connected to the polymer back layer by means of welding, wherein the photovoltaic cells are located between the front and back layer, the front and back layer being connected to each other by means of a welded connection, such that the photovoltaic cells is completely enclosed between the front layer and the back layer by the welded connection, surrounding the photovoltaic cells, and wherein each individual cell is separated from the remaining of the photovoltaic cells by the welded connection. The present teachings also relate to a method of manufacturing, and to a solar panel.
PHOTOVOLTAIC MODULE
A photovoltaic module includes a front protective layer, a back protective layer, a plurality of solar cells, and a filler. The front protective layer is transmissive to light and has a first surface and a second surface opposite to the first surface. The back protective layer faces the second surface. The plurality of solar cells are between the second surface and the back protective layer. The filler is between the front protective layer and the plurality of solar cells and covers the plurality of solar cells. The filler includes a material with a chemical structure to generate a free acid. The front protective layer includes a weather-resistance resin. At least a part of the first surface is exposed to a space external to the photovoltaic module.
PHOTOVOLTAIC CELLS
An example of an apparatus to generate electricity from light with photovoltaic cells is provided. The apparatus includes a plurality of photovoltaic cells. The plurality of photovoltaic cells is to form a module. Furthermore, the apparatus includes an electro-conductive backsheet to connect the plurality of photovoltaic cells. The electro-conductive backsheet is to collect current from the plurality of photovoltaic cells. Each photovoltaic cell of the plurality of photovoltaic cells is formed on a silicon wafer by cutting along a {100} plane to provide a substantially square wafer and cleaving the substantially square wafer along a preferred cleavage plane.
SOLAR PANEL USING BACK-CONTACTED SOLAR CELLS
The invention relates to a solar panel comprising: a transparent plate. back-contacted solar cells adhered to the transparent plate. a back-contact foil (302) electrically and mechanically connected to the solar cells, the back-contact foil equipped with a metallisation pattern facing the solar cells, a laminate attached to the back-contact foil. characterized in that the back-contact foil shows one or more flaps (304), the end of the flaps more removed from the transparent plate than from the laminate. The back-contact foil is embedded in encapsulant. By adding flaps to the back-contact foil, it is possible to have the end of the flaps extending out of the encapsulant. This enables, for example, the use of connectors for making electric contact to the end of the flaps.
SOLAR BATTERY MODULE
A solar battery module capable of suppressing a large load from being applied on a cut end section of a solar battery cell. This solar battery module has a curved surface shape and comprises flat solar battery cells arranged using a singling method. Each of the solar battery cells is a half-cut cell obtained by cutting a predetermined-sized substrate into two pieces, has a cut end section and a non-cut end section as two end sections facing each other in the arrangement direction of the solar battery cells, and has, as two main surfaces, a convex-side main surface on the convex side of a curved surface of the solar battery module and a concave-side main surface on the concave side of the curved surface of the solar battery module. The solar battery cells adjacent to each other overlap.
BIPV-APPLICABLE HIGH-POWER SHINGLED PHOTOVOLTAIC MODULE AND MANUFACTURING METHOD THEREFOR
Disclosed are a BIPV-applicable high-power shingled photovoltaic module and a manufacturing method therefor, the module comprising: a solar panel having a shingled array structure; a first sealant stacked on the solar panel so as to protect the solar panel; a second sealant stacked under the solar panel in order to protect the solar panel; a front cover through which the sunlight passes, and which is stacked on the first sealant so as to protect the first sealant; and a first back sheet stacked under the second sealant in order to protect the solar panel from the outside environment, and thus aesthetic impression and reflectance reduction of a high-power shingled photovoltaic module are increased so that use as an external design element of a building is possible.
Flexible solar panel module, an installated structure thereof and method for fabricating the same
A flexible solar panel module is provided having a plurality of non-flexible solar panels, a plurality of non-flexible covers and a flexible back sheet. Each of the non-flexible solar panels has a photoreactive device layer, a positive ribbon and a negative ribbon. The non-flexible covers correspond to the non-flexible solar panels respectively and are disposed on front surfaces of the non-flexible solar panels. Each of the non-flexible covers is bigger in size than each of the non-flexible solar panels. The flexible back sheet is disposed under back surfaces of the non-flexible solar panels and has a plurality of openings therein. A first water-resistant sealant is disposed between adjacent non-flexible covers and physically contacts the flexible back sheet. A second water-resistant sealant is disposed between the non-flexible covers and the flexible back sheet and covers sidewalls of the non-flexible solar panels. The non-flexible solar panels are laminated with the flexible back sheet and regions between adjacent non-flexible solar panels are flexible/bendable regions of the flexible solar panel module.
Encapsulant film
Embodiments of the present application relate to an encapsulant film, a method for manufacturing an encapsulant film, an optoelectronic device, and a method for manufacturing an optoelectronic device, and can provide superior adhesive force with a front substrate and a back sheet, and specifically having long-term adhesive and heat resistance properties. Also, the present application can provide the encapsulant which does not have a negative effect on parts, such as optoelectronic elements or wire electrodes encapsulated in the optoelectronic devices, and on a working environment, and which can maintain superior workability and economic feasibility in device manufacturing.
Half-cell photovoltaic modules
The present invention relates a photovoltaic module comprising 126, 138 or 150 back-contact half-cells. In an embodiment, the half-cells are divided into 3 groups of each 2 parallel strings with each string containing of the total number of half-cells. The module comprises an additional row of 6 back-contact half-cells, relative to known half-cell modules.
Half-cell photovoltaic modules
The present invention relates a photovoltaic module comprising 126, 138 or 150 back-contact half-cells. In an embodiment, the half-cells are divided into 3 groups of each 2 parallel strings with each string containing of the total number of half-cells. The module comprises an additional row of 6 back-contact half-cells, relative to known half-cell modules.