A solar cell module includes an upper substrate, a lower substrate opposite the upper substrate, a solar cell panel positioned between the upper substrate and the lower substrate, the solar cell panel including a plurality of solar cells which are arranged in a matrix form and are connected to one another through a wiring member, a passivation layer configured to package the solar cell panel, a frame configured to surround an outer perimeter of the solar cell panel, a connection terminal configured to connect two adjacent strings in the solar cell panel, and a cover member configured to cover the connection terminal.

Each of at least three solar cell strings has a first end and a second end in a first direction each including a connector. At the first end and the second end, a wire member is provided to which the connector of the first end of each of at least two solar cell strings out of the at least three solar cell strings and the connector of the second end thereof are connected. A first sheet member is provided to allow the wire member at the first end to be located in a specific positional relationship with the wire member at the second end, and a second sheet member is provided to allow the wire member at the second end to be located in a specific positional relationship with the wire member at the first end.

Systems and methods are provided for wirelessly transferring power to a multi junction photovoltaic cell of a space apparatus via a light emission system. The light emission system uses multiple lasers emitting different wavelengths and/or photon energies to produce electron-hole pairs in each layer of the multi junction photovoltaic cell to prompt power generation by the multi junction photovoltaic cell. The light emission system may be located on Earth or on another space apparatus. The multi junction photovoltaic cell can convert sunlight and the light emitted by the light emission system into electrical energy.

A photovoltaic module and a method for manufacturing photovoltaic module. The photovoltaic module includes a solar cell, a pad, fasteners, and a solder strip. The pad is arranged on the solar cell and includes first, second, and third parts, the first part is connected to the third part through the second part, and along a length direction of the solder strip, a width of the second part is less than a width of the first part and a width of the third part. The fasteners are arranged on a side of the first part facing away from the solar cell and a side of the third part facing away from the solar cell, the solder strip is provided between the fastener in the first part and the fastener in the third part, and the solder strip is connected to the pad through the fastener to form a solar cell string.

One embodiment can provide a system for curing conductive paste applied on photovoltaic structures. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and a heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The heater can be positioned above the wafer carrier. The heater can include a heated radiation surface that does not directly contact the photovoltaic structures.

A solar cell module includes: two solar cells, each including: a first main face and a second main face; a first electrode on the first main face, comprising a bus-bar electrode having at least one of an opening portion, notch portion, and gap portion; and a second electrode on the first or second main face having a polarity opposite to that of the first electrode; a wiring member that electrically connects the first electrode of one solar cell to the second electrode of another solar cell; and an electrically conductive connection layer that contacts the wiring member and the first main face.

The present invention relates a photovoltaic module comprising 126, 138 or 150 back-contact half-cells. In an embodiment, the half-cells are divided into 3 groups of each 2 parallel strings with each string containing of the total number of half-cells. The module comprises an additional row of 6 back-contact half-cells, relative to known half-cell modules.

An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

A wearable power management system includes: a bottom coating layer; a bottom center layer disposed above the bottom coating layer; a circuit layer disposed above the bottom center layer; a top center layer disposed above the circuit layer, and a top coating layer disposed above the top center layer. The bottom center layer and the top center layer are made of an ultra-low Young's modulus material. The Young's modulus of the bottom coating layer and the top coating layer is greater than the Young's modulus of the bottom center layer and the top center layer. The circuit layer includes a device layer and a connection layer disposed above the device layer.

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.