Provided is a display device, which includes a flexible display panel including a display region and a peripheral region surrounding the display region; a driver integrated circuit (IC) disposed in the peripheral region; a plurality of detection circuits disposed in the peripheral region and close to the slidable region; at least one input signal line; at least one control signal line and at least one detection signal line.

A fingerprint identification module, a method for manufacturing the fingerprint identification module, a display substrate and a display device are provided. The fingerprint identification module includes a TFT, a photosensitive sensor, and a connection electrode configured to connect the TFT to the photosensitive sensor; the TFT includes an active layer; the active layer and the connection electrode are formed through a same semiconductor layer pattern, the semiconductor layer pattern includes a first semiconductor pattern and a second semiconductor pattern, the first semiconductor pattern is used as the active layer, and the second semiconductor pattern is subjected to conductor-formation treatment and used as the connection electrode.

A photoelectric conversion apparatus includes: a first substrate including an avalanche photodiode; and a second substrate, in which the first substrate and the second substrate are stacked on each other, and further includes: a temperature detection unit arranged in at least one of the first substrate and the second substrate and having an output characteristic depending on a temperature; and a temperature value generating circuit arranged outside the first substrate and configured to convert output from the temperature detection unit into a temperature value signal that is a signal indicating temperature information.

Monochromatic photosensitive devices (MPDs) having series connected photosensitive diode cell arrays in two configurations are disclosed. The MPDs employ a protection diode to bypass either one or multiple photosensitive diodes in each photosensitive diode cell should a photosensitive diode fail as an open circuit or become blocked from the monochromatic light. The protection diode is vertically (epitaxial growth direction) integrated with a photosensitive diode layer structure during epitaxial growth, thereby permitting monolithic fabrication of the one or multiple photosensitive diode cells. The bulk of the one or multiple photosensitive diodes are formed of a material having a bandgap corresponding to the wavelength of the monochromatic light, while the protection diodes are formed of a material having a bandgap greater than the wavelength of the monochromatic light. The monochromatic light passes through the protection diode before being absorbed by the one or multiple photosensitive diodes.

An optical sensor includes a substrate, a photoelectric element disposed on the substrate and that includes a first electrode, an intermediate layer disposed on the first electrode, and a second electrode disposed on the intermediate layer, a barrier layer disposed on the second electrode, an insulating layer that covers the photoelectric element and the barrier layer, and a bias electrode disposed on the insulating layer and electrically connected to the second electrode. The barrier layer is spaced apart from the first electrode.

An optical sensor system includes a thin-film transistor (TFT) optical panel including an array of TFT pixels, a charge amplifier configured to temporarily store a charge received from a TFT pixel in the array of TFT pixels and generate a voltage based on the temporarily stored charge, an analog-to-digital converter to generate a digitized value based on the voltage, an accumulator configured to store the digitized value, and a controller circuit configured to cause the temporarily stored charge in the charge amplifier to be reset based on one of the voltage and the digitized value.

The present technology relates to a light receiving device and a distance measurement system that enable light to be surely received by a reference pixel. A light receiving device includes a plurality of pixels each including a light receiving element having a light receiving surface, and a light emission source provided on an opposite side of the light receiving surface with respect to the light receiving element. The plurality of pixels includes a first pixel including a light shielding member provided between the light receiving element and the light emission source, and a second pixel including a light guiding unit that is configured to propagate a photon and is provided between the light receiving element and the light emission source. The present technology can be applied to a distance measurement system or the like that detects a distance to a subject in a depth direction, for example, for example.

Method and structural embodiments are described which provide an integrated structure using polysilicon material having different optical properties in different regions of the structure.

A low-power wireless ionizing radiation measurement system is provided that is intended to be used in a wearable dosimeter for occupational radiation monitoring.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as holes, effectively increase the absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more. Their thickness dimensions allow them to be conveniently integrated on the same Si chip with CMOS, BiCMOS, and other electronics, with resulting packaging benefits and reduced capacitance and thus higher speeds.