A photoelectric packaging structure, and a preparation method of the photoelectric packaging structure, and a camera module having the photoelectric packaging structure are provided. The photoelectric packaging structure includes a substrate module and a photosensitive chip. The substrate module includes a substrate, and the substrate module defines a plurality of channels. The photosensitive chip is located on the substrate, and includes a photosensitive area and a non-photosensitive area connected to the photosensitive area. Two ends of each of the channels extend to the substrate and the non-photosensitive area, respectively. A conductive layer is formed on an inner wall of each of the channels to form a hollow conductive channel. The hollow conductive channel is electrically connected to the substrate and the non-photosensitive area.

An image sensing module manufacturing method includes steps: forming a mold and then disposing a plurality of lenses into a barrel of the mold; after confirming the position of the plurality of lenses, adhesively combining the plurality of lenses; installing an image sensor inside the barrel; fixing the image sensor after confirming the position relationship between the plurality of lenses and the image sensor; and cutting the mold to obtain a plurality of image sensing modules.

According to a semiconductor device, it is possible to obtain a favorable heat dissipation property, prevent falling of a material from a side surface of a substrate, and prevent generation of noise such as a flare caused by light reflected from members being present around a semiconductor element. The semiconductor device includes a substrate, a semiconductor element which is electrically connected to the substrate, a connecting member which electrically connects the substrate with the semiconductor element, a support portion which is provided on the substrate and supports a transparent member being located above the semiconductor element with respect to the substrate, a first resin portion provided on the semiconductor element, and a second resin portion which fills a space between the support portion and the first resin portion and covers the connecting member.

Generation of outgassing is restrained to restrain deterioration in optical properties of a cover glass. A method for manufacturing an electronic device includes baking step of heating the cover glass on which an antireflection layer made of a cured product of a light-curing resin has been formed, an assembling step of installing the cover glass after the baking step at a position opposed to a light receiving surface of a sensor element to assemble a sensor module, and a reflow step of placing the sensor module on a mounting substrate and applying heat at a temperature of more than or equal to 250 C. to solder the sensor module to the mounting substrate. The baking step is performed before the reflow step to make a rate of generation of outgassing derived from a monomer having a monofunctional (meth)acryloyl group in outgassing generated from the antireflection layer of the cover glass in the reflow step less than or equal to 0.5% by mass relative to a mass of the antireflection layer.

A glassless wafer-level optical sensor semiconductor package is provided. A method of manufacturing a glassless wafer-level optical sensor package of an example includes: forming one or more dams at least partially surrounding one or more optical sensors on a wafer; supporting the wafer on a carrier substrate via the one or more dams; forming a wafer-level optical sensor integrated circuit for each of the one or more optical sensors on the wafer by: performing a through-silicon via process on the wafer; forming an isolation layer on the wafer; and performing a passivation operation on the wafer; removing the wafer from the carrier substrate; and singulating each wafer-level optical sensor integrated circuit.

A substrate laminate (10) includes a first substrate (11), a second substrate (12), and a cured product layer (13) interposed between the first substrate (11) and the second substrate (12). The cured product layer (13) is patterned, and includes a first layer (14) including a cured product of a first developable composition, and a second layer (15) including a cured product of a second developable composition, in this order from a first substrate (11) side. The first developable composition contains a polymerizable first curable compound and a first photopolymerization initiator and is free of a colorant. The second developable composition contains a polymerizable second curable compound, a second photopolymerization initiator, and a colorant.

A camera module with sticky epoxy and method for dislodging particles from a corresponding IR filter. Particles, formed during manufacture or use of the camera, may accumulate in the camera (e.g., on an infrared filter) causing blemishes in camera images. A sticky epoxy with characteristics for attracting and capturing particles is located in the camera. The epoxy may be located in a gap between a substrate and an outside edge of an infrared filter coupled to the substrate. The epoxy and the gap may surround the infrared filter and the epoxy may also be located on other surfaces of the camera. A process for loosening particles from the infrared filter includes driving an actuator that moves the substrate/infrared filter assembly (perhaps striking a base assembly) to loosen the particles from the infrared filter such that the particles are moved to, and trapped by, the epoxy.

An image capture device includes a plurality of independently formed camera channels. Each of the plurality of independently formed camera channels includes a respective sensor, wherein the respective sensor includes circuitry that controls an integration time of the respective sensor, and a respective lens that receives incident light and transmits the incident light to the respective sensor without transmitting the incident light to respective sensor of other camera channels within the plurality of independently formed camera channels. Further, a processor that is communicatively coupled to the respective sensor of each of the plurality of independently formed camera channels. The processor is configured to receive respective images from the respective sensor of each of the plurality of independently formed camera channels, and form a combined image by combing each of the respective images.

An electronic component includes a first support member having a third main surface and a fourth main surface, at least a partial portion of the third main surface supporting at least a partial portion of the second main surface of the semiconductor substrate, and a second support member having a fifth main surface and a sixth main surface, at least a partial portion of the fifth main surface supporting at least a partial portion of the fourth main surface of the first support member. In a case where the electronic component is seen through from a direction perpendicular to the first main surface, the semiconductor substrate has a first region and a second region adjoining an outer side of the first region, the semiconductor substrate does not overlap any of the first support member and the second support member in the first region.

An optical semiconductor package includes a first chip, a second chip, a first resin portion formed to cover a side surface of the first chip, a second resin portion formed to cover a side surface of the second chip, a first terminal provided on a first inner surface of the first chip, a second terminal provided on a second inner surface of the second chip, and a first wiring electrically connected to the first terminal, passing through an inside of the first resin portion, and extending from a first inner surface side to a first outer surface side of the first chip in a facing direction in which the first inner surface and the second inner surface face each other. The second chip is an optical element. The first resin portion and the second resin portion are integrally provided or continuously provided via another member.