A light-emitting device with a sensing function is provided. The light-emitting device includes a substrate, a first light-emitting-diode die, and a first photosensitive element. The first light-emitting-diode die is disposed on the substrate and includes a main light-emitting top surface and a side light-emitting surface surrounding the main light-emitting top surface. The first photosensitive element is disposed on the substrate and includes a photosensitive surface. The photosensitive surface is parallel to the main light-emitting top surface. A distance between the main light-emitting top surface and the substrate is greater than a distance between the photosensitive surface and the substrate distance.

Various emitters and emitter systems are disclosed. For instance, in various embodiments, an emitter can comprise a substrate, an insulator bonded to the substrate, a graphene layer bonded to the insulator, and a first electrical contact and a second electrical contact. The first electrical contact can be bonded over a first portion of the graphene layer, and the second electrical contact can be bonded over a second portion of the graphene layer. The graphene layer electrically couples the first electrical contact and the second electrical contact and is configured to receive the application of a pulsed input voltage between the first electrical contact and the second electrical contact and to radiate radio frequency (RF) energy. An emitter system can comprise a plurality of emitters, each disposed on a single integrated circuit.

Various emitters and emitter systems are disclosed. For instance, in various embodiments, an emitter can comprise a substrate, an insulator bonded to the substrate, a graphene layer bonded to the insulator, and a first electrical contact and a second electrical contact. The first electrical contact can be bonded over a first portion of the graphene layer, and the second electrical contact can be bonded over a second portion of the graphene layer. The graphene layer electrically couples the first electrical contact and the second electrical contact and is configured to receive the application of a pulsed input voltage between the first electrical contact and the second electrical contact and to radiate radio frequency (RF) energy. An emitter system can comprise a plurality of emitters, each disposed on a single integrated circuit.

A photo relay includes an illuminating unit, a photoelectric conversion IC, a first MOS IC and a second MOS IC. The illuminating unit receives an input signal to generate an illuminating signal. The photoelectric conversion IC receives the illuminating signal to generate a voltage control signal accordingly. The second MOS IC is reversely stacked on the first MOS IC, such that the source electrodes of the two MOS ICs are electrically connected, and the gate electrodes of the two MOS ICs are electrically connected through a gate connection structure for receiving the voltage control signal, and the drain electrodes of the two MOS ICs generate an output signal according to the received voltage control signal.

Process for manufacturing a photovoltaic module placed on an emissive display device, said photovoltaic module comprising an array containing a plurality of photovoltaic cells and a plurality of transparent zones called orifices, and said photovoltaic module comprising an array of optical elements able to focus, by refraction or reflection, the light emitted by the device into the orifices.

According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.

A photo relay includes an illuminating unit, a photoelectric conversion IC, a first MOS IC and a second MOS IC. The illuminating unit receives an input signal to generate an illuminating signal. The photoelectric conversion IC receives the illuminating signal to generate a voltage control signal accordingly. The second MOS IC is reversely stacked on the first MOS IC, such that the source electrodes of the two MOS ICs are electrically connected, and the gate electrodes of the two MOS ICs are electrically connected through a gate connection structure for receiving the voltage control signal, and the drain electrodes of the two MOS ICs generate an output signal according to the received voltage control signal.

An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.

A display device includes a first region and a second region adjacent to the first region. A display element included in the first region has a function of reflecting visible light and a function of emitting visible light. A display element included in the second region has a function of emitting visible light. In an electronic device including the display device, the first region is located on a first surface (e.g., top surface) on which a main image is displayed, and the second region is located on a second surface (e.g., side surface) on which an auxiliary image is displayed.

An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.