Methods and systems for reducing dark current in a photodiode include heating a photodiode above room temperature. A reverse bias voltage is applied to the heated photodiode to reduce a dark current generated by the photodiode.

Systems for reducing dark current in a photodiode include a heater configured to heat a photodiode above room temperature. A reverse bias voltage source is configured to apply a reverse bias voltage to the heated photodiode to reduce a dark current generated by the photodiode.

A device, method and process of fabricating an interdigitated multicell thermo-photo-voltaic component that is particularly efficient for generating electrical energy from photons in the red and near-infrared spectrum received from a heat source in the near field. Where the absorbing region is germanium, the device is capable of generating electrical energy by absorbing photon energy in the greater than 0.67 electron volt range corresponding to radiation in the infrared and near-infrared spectrum. Use of germanium semiconductor material provides a good match for converting energy from a low temperature heat source. The side that is opposite the photon receiving side of the device includes metal interconnections and dielectric material which provide an excellent back surface reflector for recycling below band photons back to the emitter. Multiple cells may be fabricated and interconnected as a monolithic large scale array for improved performance.

Examples of the various techniques introduced here include, but not limited to, a mesa height adjustment approach during shallow trench isolation formation, a transistor via first approach, and a multiple absorption layer approach. As described further below, the techniques introduced herein include a variety of aspects that can individually and/or collectively resolve or mitigate one or more traditional limitations involved with manufacturing PDs and transistors on the same substrate, such as above discussed reliability, performance, and process temperature issues.

Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as holes, effectively increase the absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more. Their thickness dimensions allow them to be conveniently integrated on the same Si chip with CMOS, BiCMOS, and other electronics, with resulting packaging benefits and reduced capacitance and thus higher speeds.

Methods are described that include reacting a starting nanocrystal that includes a starting nanocrystal core and a covalently bound surface species to create an ion-exchangeable (IE) nanocrystal that includes a surface charge and a first ion-exchangeable (IE) surface ligand ionically bound to the surface charge, where the starting nanocrystal core includes a group IV element.

A structure includes a silicon substrate; silicon readout circuitry disposed on a first portion of a top surface of the substrate and a radiation detecting pixel disposed on a second portion of the top surface of the substrate. The pixel has a plurality of radiation detectors connected with the readout circuitry. The plurality of radiation detectors are composed of at least one visible wavelength radiation detector containing germanium and at least one infrared wavelength radiation detector containing a Group III-V semiconductor material. A method includes providing a silicon substrate; forming silicon readout circuitry on a first portion of a top surface of the substrate and forming a radiation detecting pixel, on a second portion of the top surface of the substrate, that has a plurality of radiation detectors formed to contain a visible wavelength detector composed of germanium and an infrared wavelength detector composed of a Group III-V semiconductor material.

A process for impurification of semiconductor materials, comprising adjacent compensated codoping comprising: (a) providing a multicomponent host material AEGJ . . . ; (b) selecting two impurities Q and X codopants elements under the following scheme: (i) considering the host A and G, impurity Q is the chemical element with atomic number Z.sub.A1 and impurity X is the chemical element with atomic number Z.sub.G+1; or impurity Q is the chemical element with atomic number Z.sub.A+1 and impurity X is the chemical element with atomic number Z.sub.G1; or (ii) considering the host A and G, impurity Q is the chemical element with atomic number Z.sub.A2 and impurity X is the chemical element with atomic number Z.sub.G+2; or impurity Q is the chemical element with atomic number Z.sub.A+2 and impurity X is the chemical element with atomic number Z.sub.G2; or (iii) considering the host A and G, impurity Q is the chemical element with atomic number Z.sub.A1 and impurity X is the chemical element with atomic number Z.sub.G+2; or impurity Q is the chemical element with atomic number Z.sub.A+2 and impurity X is the chemical element with atomic number Z.sub.G1; and (c) performing the host adjacent codoping process with the selected impurities.

A photonic device includes a substrate, a P-type doped component disposed over the substrate, an N-type doped component disposed over the substrate, an optical absorption layer disposed over the substrate, and a charging layer disposed over the substrate. The optical absorption layer is disposed between the P-type doped component and the N-type doped component. The optical absorption layer and the substrate have different material compositions. A charging layer is disposed between the P-type doped component and the N-type doped component. The charging layer has a first side surface that is substantially linear. The first side surface is in direct contact with the optical absorption layer.