What is specified is: an optoelectronic semiconductor component (1) comprising a carrier (5) and a semiconductor body (2), wherein the semiconductor body is fastened on the carrier and has a semiconductor layer sequence having an active region (20) provided for generating and/or receiving radiation, a first semiconductor layer (21) and a second semiconductor layer (22). The active region is arranged between the first semiconductor layer and the second semiconductor layer. The carrier is electrically conductive and is divided into a first carrier body (51) and a second carrier body (52), wherein the first carrier body and the second carrier body are electrically insulated from one another. The first carrier body has a first external contact (61) of the semiconductor component on the side remote from the semiconductor body, wherein the first contact is electrically conductively connected to the first semiconductor layer via the first carrier body. The second carrier body has a second external contact (62) of the semiconductor component on the side remote from the semiconductor body, wherein the second contact is electrically conductively connected to the second semiconductor layer via the second carrier body. The invention furthermore relates to a method for producing semiconductor components.

In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.

A light emitting diode includes: at least one light emitting chip; a substrate including lead frames electrically connected to electrodes of the at least one light emitting chip; a lens disposed on the substrate and enclosing the at least one light emitting chip; and an oil disposed in the lens and the substrate.

Described herein are devices, systems, and methods for delivering phototherapy to a subject. A phototherapy light engine is combined with other components to form a phototherapy system that provides phototherapy treatment to a subject. A phototherapy system may be implemented as a hand held system comprising the light engine that is configured to communicate with a remote computing device.

A phase-change heat dissipating device includes a heat absorbing body, a heat dissipation body and two tubes. The heat absorbing body is filled with a working fluid. A light source and the heat dissipation body are disposed on a same side of the heat absorbing body. The heat dissipation body has a light transmitting space which is corresponding to the light source. The tubes connect the heat absorbing body and the heat dissipation body. When the heat dissipation body is located higher than the heat absorbing body and the working fluid absorbs the heat energy generated from the light source, the working fluid is evaporated from liquid phase to gas phase and flows into the heat dissipation body through the tubes. The working fluid locating in the heat dissipation body is condensed from gas phase into liquid phase and flows to the heat absorbing body through the tubes.

An LED module includes a base portion, a first reflector portion secured to a first side of the base portion, a second reflector portion secured to a first side of the base portion; and an LED package disposed along the first side of the base portion. The LED package can be secured on a first end between the base portion and the first reflector portion, and on a second end between the base portion and a second reflector portion. Coolant channels can be defined through the base and reflector portions. A connector can electrically connect negative and positive terminals of adjacently located and oppositely oriented LED elements in the LED package. The reflector portions can be exchanged for other reflector portions that have a different reflector profile.

Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.

A display device and a display panel. The display device includes a driving circuit configured to drive the display panel. The display panel includes a plurality of light-emitting elements. The display panel includes a first substrate with the driving circuit being provided on a first surface thereof, a second substrate with the light-emitting elements being disposed on a top portion thereof, and a heat dissipation sheet disposed between the first substrate and the second substrate. The heat dissipation sheet includes a path pattern allowing liquid metal to flow therethrough.

A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed below the first LED sub-unit, and a planarization layer disposed between the first and second LED sub-units and being light transmissive, in which the electrode pads include a common electrode pad electrically connected in common to the first, second, and third LED sub-units, first, second, and third electrode pads connected to the first, second, and third LED sub-units, respectively, the first, second, and third LED sub-units are independently drivable, light generated in the first LED sub-unit is configured to be emitted to the outside through the second and third LED sub-units, and light generated in the second LED sub-unit is configured to be emitted to the outside through the third LED sub-unit.

The present disclosure provides a display module and a vehicle terminal. The display module includes a display panel and a heat-dissipation part. The heat-dissipation part at least includes a main-heat-dissipation portion and a sub-heat-dissipation portion; and along a direction perpendicular to a plane of the display panel, the main-heat-dissipation portion is at least partially overlapped with the display panel; along a direction in parallel with the plane of the display panel, the sub-heat-dissipation portion is at least on a side of the main-heat-dissipation portion; and the sub-heat-dissipation portion includes a blade structure; and the main-heat-dissipation portion is connected to the blade structure of the sub-heat-dissipation portion.