Patent classifications
H10K59/123
DISPLAY APPARATUS
A display apparatus includes a substrate, a first data line, a second data line, and a bridge line. The substrate includes a display area and a peripheral area outside the display area. The first data line is disposed over the substrate and crosses the display area. The second data line is disposed over the substrate and is disposed in a first direction from the first data line. The second data line crosses the display area. The bridge line includes one end electrically connected to the second data line and crosses, on a different layer from a layer on which the first data line is disposed, the first data line in the display area. A length of the first data line is greater than a length of the second data line.
THIN FILM TRANSISTOR AND DISPLAY APPARATUS INCLUDING THE SAME
Provided are a thin film transistor capable of minimizing the level of a leakage current and a display apparatus including the same. The thin film transistor includes a buffer layer disposed over a substrate, and a semiconductor layer disposed over the buffer layer, wherein the semiconductor layer includes a first area doped with a first conductivity type and disposed adjacent to an upper surface of the semiconductor layer, a second area spaced apart from the first area, doped with the first conductivity type, and disposed adjacent to the upper surface of the semiconductor layer, a third area doped with a second conductivity type different from the first conductivity type and disposed under the first area, and a fourth area doped with the second conductivity type and disposed under the second area.
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
A display apparatus includes: a substrate; a first semiconductor layer disposed over the substrate; a first insulating layer disposed on the first semiconductor layer; a second insulating layer disposed on the first insulating layer; a first oxide material layer disposed between the substrate and the second insulating layer; and a first conductive layer disposed on the second insulating layer and electrically connected to the first semiconductor layer through a first contact hole defined in the first insulating layer, the second insulating layer, and the first oxide material layer.
ELECTRONIC DEVICE INCLUDING UNDER DISPLAY CAMERA AND DISPLAY INCLUDED IN THE SAME
An electronic device according to various embodiments disclosed herein may include: a display panel including a light-emitting layer in which multiple light-emitting parts are arranged and a circuit layer in which multiple circuit parts electrically connected to at least some of the multiple light-emitting parts are arranged, the display panel including a first area, a second area adjacent to the first area, and a third area other than the first area and the second area, and a camera disposed on or under a rear surface of a display including the display panel such that a lens of the camera faces the first area of the display panel, wherein the first area of the display panel may be an area in which the circuit parts are not present, and an area in which a first light-emitting part connected to a circuit part positioned in the second area is disposed, the second area of the display panel may be an area in which second light-emitting parts connected to the circuit part positioned in the second area and a dummy light-emitting part not connected to the circuit part are arranged, and the third area of the display panel may be an area in which a fourth light-emitting part connected to a circuit part disposed in the third area is disposed.
ELECTRONIC DEVICE INCLUDING CAMERA MODULE
An example electronic device includes a camera module, wherein the electronic device may include a display panel and the camera module is disposed under the display panel. The display panel may include a first region having a first pixel density and overlapping the camera module, and a second region having a second pixel density greater than the first pixel density. The first region may include a transmissive region through which light is transmitted and which includes first pixels, and a non-transmissive region which is disposed around the transmissive region and in which a first driving circuit configured to drive the first pixels is arranged. Connection wires connecting the first pixels and the first driving circuit to each other may be arranged in the transmissive region, the connection wires may include at least one curved region.
DISPLAY SUBSTRATE AND DISPLAY APPARATUS
A display substrate and a display device are provided. The display substrate includes a display region. The first connection line is electrically connected to the first pixel sub-circuit and an anode of the first light-emitting sub-element. The anode of the first light-emitting sub-element is electrically connected to the first connection line through a first hole penetrating the first insulation layer and the second insulation layer. A shape of a cross section of the first hole in a plane perpendicular to the display substrate is an inverted convex shape, and in the first hole, a diameter of an opening of the second insulation layer is larger than a diameter of an opening of the first insulation layer. The anode of the first light-emitting sub-element includes a first groove structure located in the first hole, and a bottom of the first groove structure is in contact with the first connection line.
ORGANOMETALLIC COMPOUND AND LIGHT-EMITTING DEVICE INCLUDING THE SAME
An organometallic compound represented by Formula 1 emits deep blue light. A light-emitting device including the organometallic compound, and an electronic apparatus including the light-emitting device may have excellent or suitable driving voltage, luminescence efficiency, color conversion efficiency, and/or lifespan characteristics:
##STR00001##
In Formula 1, X.sub.1 to X.sub.4 are each independently C or N, Y.sub.11 is C(Z.sub.11) or N, and Y.sub.12 is C(Z.sub.12) or N.
DISPLAY PANEL, MANUFACTURING METHOD FOR DISPLAY PANEL, AND DISPLAY APPARATUS
The present application provides a display panel, a manufacturing method for a display panel, and a display apparatus. The display panel includes an array substrate including a planarization layer, the planarization layer being provided with a groove; a pixel definition layer (PDL) arranged on the planarization layer and filling the groove, the PDL being provided with a pixel opening; and an anode arranged between the planarization layer and the PDL, an end of the anode being placed in the groove, and a middle portion of the anode being exposed in the pixel opening.
DISPLAY APPARATUS
The display apparatus includes a substrate including an auxiliary circuit area and an auxiliary display area, an auxiliary pixel circuit on the auxiliary circuit area, an auxiliary display element on the auxiliary display area, and a connection line extending from the auxiliary circuit area to the auxiliary display area and configured to connect the auxiliary pixel circuit to the auxiliary display element. The connection line includes a first sub-line and a second sub-line which are on different layers, and the first sub-line is electrically connected to the second sub-line through a contact portion.
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A display device is provided. The display device comprises a substrate, at least one thin-film transistor disposed on the substrate, a planarization layer disposed on the thin-film transistor, a first metal layer disposed on the planarization layer and connected to the thin-film transistor, a first electrode disposed on the first metal layer, partitioning walls disposed on the planarization layer and spaced apart from the first electrode, wherein each of the partitioning walls includes a second metal layer and a first conductive layer, a pixel defining layer disposed on the first electrode and the partitioning walls, an organic layer disposed on the first electrode and the pixel defining layer, and a second electrode disposed on the organic layer, wherein the second metal layer is disposed under the first conductive layer and has an undercut beneath the first conductive layer, wherein at least portion of the organic layer is discontinuous between the partitioning walls.