A display apparatus is provided. The display apparatus includes a display substrate and a plurality of pads arranged above the display substrate. Each of the plurality of pads includes a first conductive layer, at least a portion of which is covered by an insulating film, a second conductive layer arranged above the first conductive layer, and a clamping portion formed in the second conductive layer.

A display comprises a plurality of autonomous pixels on a substrate. Each autonomous pixel comprises a display element, a sensing element and a control element. The sensing element is arranged to detect an external stimulus and the control element is arranged to generate, entirely within the autonomous pixel, a control signal to drive the display element based, at least in part, on a magnitude of the external stimulus detected by the sensing element. Additionally, the control element comprises one or more groups of transistors, each group comprising two or more transistors arranged to perform the same function and connected in parallel with each other.

A display device includes a display panel and an integrated circuit chip configured with a plurality of first bonding terminals spaced apart from each other. The display panel is provided with a plurality of second bonding terminals, and a first insulating layer is disposed between the first bonding terminals and the second bonding terminals. A plurality of electrically conductive particles are provided on the second bonding terminals and penetrate the first insulating layer so that the electrically conductive particles are in contact with the first bonding terminals.

The disclosure relates generally to a display panel, which in at least some situations includes multiple separate stacked layers or components that are combined together, such as to have one emission layer component with numerous pixels that emit light, and to have at least one control logic layer component that includes integrated circuits or other logic to control the emission of light by the pixels in the emission layer. The different layers may be separate silicon chips or wafers that are connected in a stacked structure via a flip chip technique, with the emission layer using AMOLED or other OLED pixels. The display panels may be designed and/or configured for use in head mounted displays (e.g., with a fully immersive virtual reality system). The disclosure also relates generally to techniques for manufacturing, testing and/or otherwise using such a display panel in various manners.

Local passive matrix displays and methods of operation are described. In an embodiment, the display includes a pixel driver chip coupled with a matrix of rows and columns of LEDs. The pixel driver chips may be arranged in rows across the display with separate portions to operate separate matrices of LEDs.

A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

A display (100) comprising a plurality of LED chips (604), each LED chip (604) comprising a plurality of light emitting elements (606a-c). Each LED chip (604) is arranged such that a first light emitting element (606a) is configured to illuminate a sub-pixel, and a second light emitting element (606b) is configured to illuminate a sub-pixel using substantially the same wavelength of light as the first light emitting element. There is also described an LED chip, a display pixel, a controlling method, a computer device and a computer program for a display.

A method for responding to a failure of a main die of a switch data-plane device, the method may include applying a secondary packet forwarding process by multiple chiplets, following the failure of the main die and during at least a part of an execution of a synchronous graceful process that follows the failure of the main die; wherein the multiple chiplets are interconnected to each other by a secondary interconnect; wherein the multiple chiplets and are coupled to the main die by a primary interconnect; wherein the applying of the secondary packet forwarding process is less complex than a primary forwarding process applied by the main die while the main die is functional.

A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball; and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.