Disclosed are an electronic device and a manufacturing method of an electronic device. The manufacturing method includes the following. A first substrate is provided. The first substrate includes a plurality of chips. A second substrate is provided. A transfer process is performed to sequentially transfer a first chip and a second chip among the chips to the second substrate. The second chip is adjacent to the first chip. A first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate. A second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate. The first angle is different from the second angle.

A flexible display device and an electronic device, applied to the technical field of display, are provided and aim at solving the technical problem in the related art that a driving IC is prone to rupture and/or breakage following bending of a flexible display panel. The flexible display device may include a flexible display panel, a flexible circuit board, and a driving IC. The flexible circuit board may include a body portion including an element arrangement region and a reserved region, and a connecting portion protruding from the reserved region and extending toward the flexible display panel, and is connected to the flexible display panel. A separation space is defined among the body portion, the connecting portion, and the flexible display panel. The driving IC is electrically installed in the element arrangement region.

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball; and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.

The present disclosure provides a display substrate and a display device. The display substrate includes: a driver chip, a display area and a peripheral area surrounding the display area, the driver chip is located in the peripheral area, the driver chip is close to a first side of the display area; the display substrate further includes: a cathode layer extending from the display area to the peripheral area; a cathode auxiliary layer extending from the display area to the peripheral area, and the cathode auxiliary layer is coupled to the cathode layer in the display area; a power line layer located in the peripheral area, the power line layer includes a first power line pattern, and the first power line pattern is close to the first side of the display area; the first power line pattern is coupled to the cathode auxiliary layer.

A novel heterocyclic compound is provided. In particular, a novel heterocyclic compound which can improve the element characteristics of a light-emitting element is provided. A novel light-emitting element with high emission efficiency and high heat resistance is provided. A heterocyclic compound represented by General Formula (G1). A represents any of a dibenzothiophenyl group, a dibenzofuranyl group, and a carbazolyl group. DBq represents a dibenzo[f,h]quinoxalinyl group. In addition, n is 0 or 1. Each of Ar1 to Ar4 independently represents a substituted or unsubstituted arylene group having 6 to 10 carbon atoms. In Ar1 to Ar4, the adjacent arylene groups may be bonded to each other to form a ring. When the adjacent arylene groups in Ar1 to Ar4 form a fluorene skeleton, the fluorene skeleton may have a substituent. ##STR00001##

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball, and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.

A light emitting device comprising a plurality of pixels arranged on a substrate to form a plurality of columns parallel to a first direction and a plurality of rows parallel to a second direction orthogonal to the first direction is provided. Each of the plurality of pixels includes a light emitting element, and a driving circuit configured to drive the light emitting element, the substrate includes a transistor region in which a plurality of transistors that form the driving circuit are arranged, the plurality of pixels include a first pixel and a second pixel, which are adjacent to each other in the first direction, and a virtual line parallel to the second direction, which passes through the transistor region of the first pixel, passes through the transistor region of the second pixel.

A stretchable substrate metal structure includes a patterned insulating structure, conductive wires, display elements, and covering layers. The patterned insulating structure includes device portions and circuit portions. The surface of each device portion has at least one first groove. At least two of the device portion are separated by a recess. A width of each circuit portion is less than a width of each device portion. Adjacent device portions are connected via corresponding circuit portions. The conductive wires are located in the circuit portions. The display elements are located on the device portions. The at least one first groove of each device portion at least partially surrounds a corresponding display element. Each covering layer is located on a corresponding device portion and covers the corresponding display element.

A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.

Local passive matrix displays and methods of operation are described. In an embodiment, the display includes a pixel driver chip coupled with a matrix of rows and columns of LEDs. The pixel driver chips may be arranged in rows across the display with separate portions to operate separate matrices of LEDs.