H10K71/50

MODULAR ELECTRONICS APPARATUSES AND METHODS
20180013082 · 2018-01-11 ·

An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate.

Sealed devices comprising transparent laser weld regions

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Sealed devices comprising transparent laser weld regions

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

APPARATUS AND METHOD FOR FABRICATING DISPLAY PANEL
20230231071 · 2023-07-20 ·

An apparatus for fabricating a display panel includes: a chamber; a first process driver configured to sequentially perform dispensing and coating processes on a display substrate or a light-emitting diode substrate in an internal processing space of the chamber; a second process driver configured to selectively perform at least one process selected from among moving, dipping, laminating, bonding, and laser irradiating processes on the display substrate or the light-emitting diode substrate; and a third process driver where the dipping and laminating processes on the display substrate or the light-emitting diode substrate are performed.

Display device having some edges of cover plate that do not overlap with the underlying array substrate and method for manufacturing the same

A display device and a method for manufacturing a display device are provided. The display device includes an array substrate and a cover plate. The array substrate is a silicon-based organic light-emitting diode array substrate. An orthographic projection of the array substrate in a plane parallel to the array substrate covers an orthographic projection of the cover plate in the plane, the orthographic projection of the array substrate includes a plurality of edges, the orthographic projection of the cover plate includes a plurality of edges, the plurality of edges of the array substrate are in one-to-one correspondence to the plurality of edges of the cover plate. At least two edges of the orthographic projection of the array substrate do not overlap with corresponding edges of the orthographic projection of the cover plate and are located outside the orthographic projection of the cover plate.

METHOD FOR PREPARING PEROVSKITE ELECTRONIC DEVICE

Provided is a method for preparing a perovskite electronic device including steps of: forming an electron transport layer and a second light absorption layer including a perovskite material each independently on a first substrate and a second substrate; forming a first light absorption layer including a perovskite material on the electron transport layer; coating a solvent on the surface of the first light absorption layer and the second light absorption layer; bonding the second light absorption layer on the first light absorption layer; removing the second substrate; forming a hole transport layer on the second light absorption layer; and forming an electrode on the hole transport layer.

Solar cell lamination
11696457 · 2023-07-04 · ·

The present invention relates to a solar cell sheet comprising a first and a second substrate, which first and second substrates are flexible and suitable for roll to roll printing, and the solar cell sheet further comprises one or more self-contained solar cell units, wherein each self-contained solar cell unit comprises one or more solar cell modules, and each solar cell module comprises a plurality of serially connected solar cells, wherein each of the solar cell modules comprises: a first substrate portion of the first flexible substrate and a second substrate portion of the second substrate, a plurality of first electrodes and a plurality of second electrodes arranged between the first and second substrate portions; and at least one organic active layer arranged between the plurality of first electrodes and the plurality of second electrodes; wherein, a continuous or discontinuous portion of a first adhesive material encircles each of the solar cell units. The present invention further relates to a method for producing the solar cell sheet comprising one or more self-contained solar units.

SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE

A solid-state imaging device according to an embodiment of the present disclosure includes: a plurality of photoelectric converters that is stacked on a semiconductor substrate, and has wavelength selectivities different from each other; and a wiring line that is formed on the semiconductor substrate, and is electrically coupled to the plurality of photoelectric converters. Each of the photoelectric converters includes a photoelectric conversion film, and a first electrode and a second electrode that are disposed with the photoelectric conversion film interposed therebetween. The wiring line extends in a direction normal to the semiconductor substrate, and includes a vertical wiring line formed in contact with the second electrode of each of the photoelectric converters.

Display substrate, manufacturing method thereof, display device

A display substrate, a manufacturing method thereof, and a display device are provided. The display substrate includes a base substrate, a pixel defining layer, and a first electrode layer between the base substrate and the pixel defining layer. The pixel defining layer defines a plurality of sub-pixels on the base substrate, the first electrode layer comprises a plurality of first electrodes, and the plurality of first electrodes being separated from each other by gaps, and an orthographic projection of the pixel defining layer on the base substrate covers an orthographic projection of the gap on the base substrate.

Laminated module
11532788 · 2022-12-20 · ·

The present invention relates to a method for laminating solar cell modules comprising a plurality of solar cells electrically connected in series. The method comprises: providing a first and a second flexible substrate portion suitable for roll-to-roll deposition; providing a plurality of first electronic conductors on said first substrate portion and a plurality of second electrodes on said second substrate portion, wherein said plurality of first and second electrodes are provided as stripes spatially separated such that a plurality of gaps is formed; depositing an electronic conductor on one end of the first and second electrodes and depositing a continuous or discontinuous active layer on said plurality of first electrodes or said plurality of second electrodes, wherein said continuous or discontinuous active layer is an organic active layer; laminating by means of heat and pressure said first and said second substrate portions together in a roll-to-roll process such that the electronic conductors are brought into physical contact with the respective electronic conductor arranged on the opposite substrate, and that the active layer is brought into physical contact with the other one of said plurality first electrodes or said plurality of second electrodes and such that the active layer is brought into electrical contact with said plurality of first electrodes and said plurality of second electrodes. The plurality of first electrodes is arranged off-set relative said plurality of second electrodes such that each of said plurality of gaps between said plurality of second electrodes are partly or fully covered at least in one direction by respective one of said plurality of first electrodes. The present invention also relates to a solar cell module.