A method of manufacturing microstructure array, a microstructure array, a micro-light-emitting diode, and a method for manufacturing the same, and a display device. The method of manufacturing microstructure array includes: preparing a red light-emitting perovskite precursor solution, a green light-emitting perovskite precursor solution, and a blue light-emitting perovskite precursor solution; coating the red light-emitting perovskite precursor solution, the green light-emitting perovskite precursor solution, and the blue light-emitting perovskite precursor solution, on a substrate having partitioned first, second, and third regions to form a red light-emitting perovskite precursor film, a green light-emitting perovskite precursor film, and a blue light-emitting perovskite precursor film, respectively; disposing a mold having a plurality of concave micropatterns on the red light-emitting perovskite precursor film, the green light-emitting perovskite precursor film, and the blue light-emitting perovskite precursor film, respectively; heat-treating the red light-emitting perovskite precursor film, the green light-emitting perovskite precursor film, and the blue light-emitting perovskite precursor film in a plurality of concave micropatterns to obtain each of red light-emitting perovskite nanocrystals, green light-emitting perovskite nanocrystals, and blue light-emitting perovskite nanocrystals, and removing the mold to form a microstructure array.

The present application provides a display screen, a display device and a method of manufacturing the display screen, and relates the field of display technology. The display screen includes an array substrate, an anode layer, a light-emitting layer and a cathode layer which are stacked in sequence; the light-emitting layer includes a plurality of light-emitting units and a pixel definition layer separating the light-emitting units from each other, and the pixel definition layer is a transparent layer; the cathode layer is provided with a hollow-out area corresponding to the pixel definition layer, the hollow-out area has a semitransparent portion and a light transmitting portion penetrating through the cathode layer. The present application can improve the transmittance of the cathode layer corresponding to the pixel definition layer by disposing the light transmitting portion, thereby improving an effect of the photosensitive element acquiring an image.

An electroluminescent display panel, a method for manufacturing the same, and a display device are disclosed, wherein the electroluminescent display panel comprises a bending region and a non-bending region, a plurality of first pixels arranged in an array are provided in the non-bending region, a plurality of second pixels arranged in an array are provided in the bending region, and an open area of the second pixels is smaller than that of the first pixels; in the bending region, at least one elastic region with an extending direction consistent with a bending axis direction is provided at a gap of the second pixels along a direction perpendicular to the bending axis direction, a groove is provided in an insulating composite film layer in each of the elastic region, and the insulating composite film layer comprises a planarization layer and a pixel definition layer positioned over the planarization layer; an elastic member is filled in the groove, which has an elastic modulus greater than that of the planarization layer.

A display device has a display area with a plurality of light emitting areas and a non-light emitting area between the light emitting areas and a non-display area around a periphery of the display area. The display device includes: a base substrate having a first surface and an opposite second surface; a light emitting element in each of the light emitting areas on the first surface; a light blocking pattern in the non-light emitting area and in a light blocking area of the non-display area; a printed circuit film attached to a pad area of the non-display area on the first surface; and a light blocking layer on the light blocking pattern and the printed circuit film. The pad area is nearer to an end of the base substrate than the light blocking area is, and the light blocking layer includes a black resin and overlaps the light blocking pattern.

A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness R.sub.a in a range from 0.1 μm to 10 μm, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 μm to 100 μm, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.

An example provides a method for forming an apparatus including a substrate imprinted with a pattern for forming isolated device regions. A method may include imprinting an unpatterned area of a substrate with a pattern to form a patterned substrate having a plurality of recessed regions at a first level and a plurality of elevated regions at a second level, and depositing a first layer of conductive material over the patterned substrate with a plurality of breaks to form a plurality of bottom electrodes. The method may include depositing a layer of an active stack, with a second layer of conductive material, over the plurality of bottom electrodes to form a plurality of devices on the plurality of recessed regions isolated from each other by the plurality of elevated regions.

The invention relates to a method for manufacturing an optoelectronic component substrate (12) comprising a stack of layers, the method comprising a step of: preforming a substrate (12) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate (12) with a face of a reference element (22) having a surface roughness less than or equal to 50 nanometers.

The invention relates to an organic light-emitting device (OLED) comprising at least: a first electrode; a second electrode; an organic light emissive layer arranged between said first electrode and said second electrode; and an organic charge transport layer arranged between said first electrode and said emissive layer, wherein i) the charge transport layer is patterned or provided with a periodic surface structure on a surface of the charge transport layer facing the emissive layer, and/or ii) an alignment layer which allows for charge transport to the emissive layer is provided between said charge transport layer and said emissive layer, which alignment layer promotes alignment of the optical dipoles of molecules of said light emissive layer towards a common preferred direction of the molecular axes. The use of the patterned or structured charge transport layer and/or the alignment layer provides improved light out coupling from the OLED layer stack, i.e. increased external quantum efficiency.

An organic substrate and method of making with optimal thermal warp characteristics is disclosed. The organic substrate has one or more top layers and one or more bottom layers. A chip footprint region is a surface region on each of the top and bottom layers that is defined as the projection of one or more semiconductor chips (chips) on the surface of each of the top and bottom layers. One or more top removal patterns are located on and may or may not remove material from the surface of one or more of the top layers within the chip footprint region of the respective top layer. One or more bottom removal patterns are located on and remove material from the surface of one or more of the bottom layers outside the chip footprint region of the respective bottom layer. The removal of the material from one or more of the top layers and/or bottom layers changes and optimizes a thermal warp of the organic substrate. In some embodiments, a Shape Inversion Temperature (SIT) of the substrate is made equal to or above a reflow temperature.

A display panel and a manufacturing method thereof of the present disclosure provide a substrate including a non-display area, a display area disposed around the non-display area, a light-converging structure disposed on the substrate of the non-display area, and a functional layer disposed on the substrate and provided with a through-hole corresponding to the non-display area, wherein the through-hole penetrates the functional layer, thereby reducing the loss of light transmitted to the camera, greatly increasing an amount of light that enters the camera, and improving the image quality of the camera.