The present invention relates to a method for producing piezoelectric multi-layered components (2), which comprises the following steps: applying an electrode material (5) to green sheets (3) containing a piezoelectric material, applying a layer of a first auxiliary material (9) to at least one green sheet (3) containing the piezoelectric material, forming a stack (1), in which the green sheets (3), to which electrode material (5) is applied, are arranged one on top of another, wherein at least one ply of the green sheet (3), to which the layer of the first auxiliary material (9) is applied, is arranged in the stack (1), sintering the stack (1), wherein the layer of the first auxiliary material (9) is thinned, and firing the stack (1), wherein the stack (1) is singulated along the at least one ply into at least two multi-layered components (2).

A process for producing a piezoelectric sensor includes the following steps: a step of providing a housing made of stainless steel; a step of producing a solution of a compound comprising a metal or metalloid element; a step of depositing a layer of the solution over at least one inner surface of the housing; a step of oxidizing the deposited layer of solution; a step of placing a piezoelectric element inside the housing; a step of closing the housing. A piezoelectric sensor obtained by such a process and comprising a closed steel housing, a piezoelectric element arranged inside the housing and a layer of a solution of a compound comprising a metal or metalloid element that is arranged over at least one inner surface of the housing.

A process for producing a piezoelectric sensor includes the following steps: a step of providing a housing made of stainless steel; a step of producing a solution of a compound comprising a metal or metalloid element; a step of depositing a layer of the solution over at least one inner surface of the housing; a step of oxidizing the deposited layer of solution; a step of placing a piezoelectric element inside the housing; a step of closing the housing. A piezoelectric sensor obtained by such a process and comprising a closed steel housing, a piezoelectric element arranged inside the housing and a layer of a solution of a compound comprising a metal or metalloid element that is arranged over at least one inner surface of the housing.

A preparation method tor a piezoelectric fiber is provided including a piezoelectric functional layer and an insulating layer coated on the piezoelectric functional layer. The piezoelectric functional layer includes a piezoelectric composite layer of a spiral winding structure, and the piezoelectric composite layer includes a first piezoelectric layer, a conductive layer and a second piezoelectric layer that are sequentially stacked. The preparation method piezoelectric composite layer in a direction perpendicular to the winding axis to form the piezoelectric functional layer, wherein turns of winding the piezoelectric composite layer are greater than 5, coating the piezoelectric functional layer with the insulating layer, and vacuum heating to consolidate, to prepare a preform rod.

A preparation method tor a piezoelectric fiber is provided including a piezoelectric functional layer and an insulating layer coated on the piezoelectric functional layer. The piezoelectric functional layer includes a piezoelectric composite layer of a spiral winding structure, and the piezoelectric composite layer includes a first piezoelectric layer, a conductive layer and a second piezoelectric layer that are sequentially stacked. The preparation method piezoelectric composite layer in a direction perpendicular to the winding axis to form the piezoelectric functional layer, wherein turns of winding the piezoelectric composite layer are greater than 5, coating the piezoelectric functional layer with the insulating layer, and vacuum heating to consolidate, to prepare a preform rod.

A vibration generating device 10 includes: a diaphragm 11; and a first piezoelectric actuator 12 and a second piezoelectric actuator 13 attached on an upper surface 11a and a lower surface 11b of the diaphragm 11, respectively, so as to sandwich the diaphragm 11 therebetween in a vicinity of an end surface of the diaphragm 11, wherein, in a top view of the upper surface 11a of the diaphragm 11, the first piezoelectric actuator 12 is disposed at a position shifted with respect to the second piezoelectric actuator 13.

An ultrasound probe has an acoustic window (10) or lens (20) through which ultrasound is transmitted and received by a transducer array (30) located behind the lens or window inside a probe enclosure. The external, patient-contacting surface (24) of the acoustic lens or window is textured. The texturing of the surface of the lens or window better retains gel spread over the lens or window for an ultrasound procedure, reduces reverberation artifacts, and diminishes the appearance of scratches on the lens or window.

An ultrasound probe has an acoustic window (10) or lens (20) through which ultrasound is transmitted and received by a transducer array (30) located behind the lens or window inside a probe enclosure. The external, patient-contacting surface (24) of the acoustic lens or window is textured. The texturing of the surface of the lens or window better retains gel spread over the lens or window for an ultrasound procedure, reduces reverberation artifacts, and diminishes the appearance of scratches on the lens or window.

In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.

In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.