An ultrasonic sensing module, an ultrasonic sensing device and a control method thereof, and a display device. The ultrasonic sensing module includes a first electrode layer, a piezoelectric layer, a receiving electrode layer and an emission electrode layer. The first electrode layer is on a first side of the piezoelectric layer; the receiving electrode layer and the emission electrode layer insulated from the receiving electrode layer are on a second side of the piezoelectric layer; and the second side is opposite to the first side.

An ultrasonic device according to an aspect of the present disclosure includes a substrate in which an opening section piercing through the substrate in a thickness direction is provided, a vibration plate provided on the substrate to close the opening section, a piezoelectric element provided in a position corresponding to the opening section on a first surface at the opposite side of the substrate side of the vibration plate, and an elastic layer provided in contact with a second surface at the substrate side of the vibration plate at the inner side of the opening section of the substrate. The elastic layer includes a curved surface recessed to the vibration plate side at the opposite side of the vibration plate side.

A composite sensor includes a first sensor outputting a first sensor signal, a second sensor outputting a second sensor signal, a circuit board electrically connected to the first and second sensors, and a mount member having one surface on which the first and second sensors and the circuit board are disposed. The first and second sensors have respective input terminals to which respective input signals are inputted, and have respective output terminals from which the first and second sensor signals are outputted. When a virtual straight line passing respective centers of the first and second sensors parallel to an arrangement direction of the sensors is defined, the respective input terminals of the first and second sensors are disposed in one of two regions divided by the virtual line, and the respective output terminals of the first and second sensors are disposed in a remaining one of the two regions.

The force sensing device (1) comprising: a sheet (2) of piezoelectric; at least a first and a second interdigitated electrodes (5, 50) located on a first main face (3) and at least a third and fourth interdigitated electrodes (6, 60) located on a second main face (4) of the sheet (2), the first and third electrodes (5, 6) being aligned to each other along a normal stress direction (N), the second and fourth electrodes (50, 60) being aligned to each other along the normal stress direction (N); the piezoelectric material comprising first portions (100) facing the first and third electrodes (5, 6) interposed with second portions (101) facing the second and fourth electrodes (50, 60), the first portions (100) having bulk electric polarization with vector field (E) mostly oriented in alignment with the normal stress direction (N), the second portions (101) having bulk electric polarization with vector field (E) mostly oriented transversally to the normal stress direction (N).

A display device includes a touch panel; a display panel under the touch panel and displaying an image; a piezoelectric element under the touch panel and including an upper electrode, a lower electrode and a piezoelectric layer; and a rectifying circuit connected to the piezoelectric element.

An ultrasonic dry coupled wheel probe with radial transducers emit ultrasound in substantially all radial directions relative to a longitudinal axis. The probe does not require normalization and is efficient in directing ultrasound to a surface being inspected. The probe has a wheel composed of rubber or other materials for acoustically dry coupling the transducer to the surface. A first transducer is composed of a piezoelectric material so that the transducer receives an electrical signal, vibrates, and generates and transmits sound, such as ultrasound. Similarly, a second transducer receives sound such as ultrasound, vibrates, and generates a corresponding electrical signal. The transducer arrangement both transmits ultrasound to the surface and receives the reflection of the ultrasound from the surface. An acoustic barrier separates the transmitting component from the receiving component. The transducer has annular electroplates adjacent to the piezoelectric material. The two transducers can comprise a single, integrated transducer module.

A deformation detection sensor that includes a conductive member, a plurality of thermoplastic resin layers, and a piezoelectric film. At least one of the thermoplastic resin layers has a main surface, and the conductive member is formed on the main surface thereof. The plurality of thermoplastic resin layers are laminated and integrally formed by hot pressing into a laminated body. A transmission line is formed form a first portion of the conductive member and the thermoplastic resin in the laminated body. The piezoelectric film is attached to the laminated body to form a piezoelectric element made of a second portion of the conductive member, the thermoplastic resin in the laminated body, and the piezoelectric film.

A process for producing a piezoelectric sensor includes the following steps: a step of providing a housing made of stainless steel; a step of producing a solution of a compound comprising a metal or metalloid element; a step of depositing a layer of the solution over at least one inner surface of the housing; a step of oxidizing the deposited layer of solution; a step of placing a piezoelectric element inside the housing; a step of closing the housing. A piezoelectric sensor obtained by such a process and comprising a closed steel housing, a piezoelectric element arranged inside the housing and a layer of a solution of a compound comprising a metal or metalloid element that is arranged over at least one inner surface of the housing.

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

A suspended piezoelectric ultrasonic transducer includes a semiconductor substrate and a piezoelectric ultrasonic sensing element. The semiconductor substrate includes a columnar arrangement area, a peripheral wall, and one or more bridge portions. A cavity is between the columnar arrangement area and the peripheral wall. The cavity surrounds the columnar arrangement area, and the bridge portion is connected to the columnar arrangement area and the peripheral wall. The piezoelectric ultrasonic sensing element is disposed on the columnar arrangement area. Through providing the cavity and the bridge portion on the semiconductor substrate, the resonance frequency, the acoustic pressure, and the emitting angle of the transducer can be adjusted, thereby providing a greater manufacturing tolerance for the transducer.