The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device comprises a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. A base structure is configured to load the laminated structure, and at least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.

The present application relates to a method for producing ceramic multi-layer components (100), comprising the following steps: providing green layers (5) for the ceramic multi-layer components (100), stacking the green layers (5) into a stack and subsequently pressing the stack into a block (1), singulating the block (1) into partial blocks (3) each having a longitudinal direction (X), thermally treating the partial blocks (3) and subsequently machining surfaces of the partial blocks (3), wherein recesses (11) are produced on the surfaces of the partial blocks (3) during the machining, and singulating the partial blocks (3). The application further relates to a multi-layer component.

An electroacoustic transducer includes: a polygonal-shaped laminated piezoelectric element including alternately stacked piezoelectric layers and electrode layers, with the piezoelectric layers placed between at least one pair of electrode layers having different polarities; and a circular vibration plate on which the laminated piezoelectric element is placed. Of the piezoelectric layers sandwiched between the at least one pair of electrode layers, the total volume (V) of those effective layers that overlap the at least one pair of electrode layers as viewed from the stacking direction satisfies the condition below:

0.2πR.sup.2×ts≦V≦2.0πR.sup.2×ts

wherein π represents the ratio of the circumference of a circle to its diameter, R represents the radius of the vibration plate, and ts represents the thickness of the vibration plate.

A vibrating body includes a substrate, a piezoelectric element comprising a piezoelectric layer and electrode layers and joined to the substrate, and a ceramic layer between the substrate and the piezoelectric element. The ceramic layer comprises a first region and a second region which is adjacent to the first region in a direction perpendicular to a thickness direction of the ceramic layer. The first region has a square shape, each side of the first region having a length equal to a thickness of the ceramic layer, the second region has a square shape, each side of the second region having the length equal to the thickness of the ceramic layer, and a difference between a porosity of the first region and a porosity of the second region is not greater than 15%.

A bender beam actuator includes a first layer of piezoelectric material and a second layer of piezoelectric material overlying a portion of the first layer of piezoelectric material, where a length of the first layer of piezoelectric material is at least 2% greater than a length of the second layer of piezoelectric material.

Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

The present disclosure is of a bone conduction microphone. The bone conduction microphone comprises of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, the vibration unit deforms in response to the vibration of the base structure, and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. A resonant frequency of the bone conduction microphone is within a range of 2.5 kHz-4.5 kHz.

A piezoelectric device includes: a first electrode provided above a substrate; a piezoelectric layer provided above the first electrode; and a second electrode provided above the piezoelectric layer. The piezoelectric layer includes a plurality of layers that includes a composite oxide of a Perovskite structure containing potassium, sodium, and niobium. The piezoelectric layer has a first region and a second region in a 3 μm×3 μm region of a plane perpendicular to a thickness direction of the piezoelectric layer. The first region is a region in which the ratio of an atomic concentration (atm %) of potassium with respect to the sum of the atomic concentration (atm %) of potassium and an atomic concentration (atm %) of sodium is 0.30 to 0.45, and the second region is a region in which the ratio is 0.55 to 0.75.

Provided are a piezoelectric element having high stability, which operates with high efficiency, and a method for manufacturing the piezoelectric element. The piezoelectric element (10) has a laminate structure in which a first electrode (14), a first piezoelectric film (16), a second electrode (18), an adhesion layer (20), an interlayer (22), a third electrode (24), a second piezoelectric film (26), and a fourth electrode (28) are laminated in this order on a silicon substrate (12). The interlayer (22) is formed of a material different from that of the second electrode (18) and has a thickness of 0.4 μm to 10 μm. A device having a diaphragm structure or a cantilever structure is formed by removing a part of the silicon substrate (12). The respective layers (14 to 28) laminated on the silicon substrate (12) can be formed using a thin film formation method represented by a vapor phase epitaxial method.

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.