An RF integrated circuit device can includes a substrate and a High Electron Mobility Transistor (HEMT) device on the substrate including a ScAlN layer configured to provide a buffer layer of the HEMT device to confine formation of a 2DEG channel region of the HEMT device. An RF piezoelectric resonator device can be on the substrate including the ScAlN layer sandwiched between a top electrode and a bottom electrode of the RF piezoelectric resonator device to provide a piezoelectric resonator for the RF piezoelectric resonator device.

An ultrasonic sensing module, an ultrasonic sensing device and a control method thereof, and a display device. The ultrasonic sensing module includes a first electrode layer, a piezoelectric layer, a receiving electrode layer and an emission electrode layer. The first electrode layer is on a first side of the piezoelectric layer; the receiving electrode layer and the emission electrode layer insulated from the receiving electrode layer are on a second side of the piezoelectric layer; and the second side is opposite to the first side.

A piezoelectric device includes a connection section including a first coupling portion, a second coupling portion, and a bridging portion. The first coupling portion extends along a slit and is connected to one of a pair of beam sections. The second coupling portion extends along the slit and is connected to another of the pair of beam sections. The bridging portion is located between the slit and an opening and is connected to both of the first coupling portion and the second coupling portion. The beam sections are connected to each other in a circumferential direction of a base having an annular shape via the connecting section while each of the beam sections is interposed between the slits extending in intersecting directions.

A film bulk acoustic resonator includes: a first electrode disposed on a substrate; a piezoelectric body disposed on the first electrode and including AlN to which a dopant is added; and a second electrode disposed on the piezoelectric body and facing the first electrode such that the piezoelectric body is interposed between the second electrode and the first electrode, wherein the dopant includes either one of 0.1 to 24 at % of Ta and 0.1 to 23 at % of Nb.

A method of manufacture and resulting structure for a single crystal electronic device with an enhanced strain interface region. The method of manufacture can include forming a nucleation layer overlying a substrate and forming a first and second single crystal layer overlying the nucleation layer. This first and second layers can be doped by introducing one or more impurity species to form a strained single crystal layers. The first and second strained layers can be aligned along the same crystallographic direction to form a strained single crystal bi-layer having an enhanced strain interface region. Using this enhanced single crystal bi-layer to form active or passive devices results in improved physical characteristics, such as enhanced photon velocity or improved density charges.

A lithium tantalate single crystal substrate for a surface acoustic wave device that is a rotated Y-cut LiTaO3 substrate whose crystal orientation has a Y-cut angle of not smaller than 36° and not larger than 49° and which has such a Li concentration profile after diffusion of Li into the substrate from the surface thereof that the Li concentration at the surface of the substrate differs from that inside the substrate. A shear vertical type elastic wave whose main components are vibrations in the thickness direction and in the propagation direction and which is among those elastic waves which propagate in the X axis direction within the surface of this LiTaO3 substrate has an acoustic velocity of not lower than 3140 m/s and not higher than 3200 m/s.

A method of transducing electrical energy to sound is disclosed which includes providing a transducer, the transducer includes lead zirconate titanate (PZT) particles mixed with graphene nanoplatelets (GNPs) in a flexible substrate aligned in a first direction, forming a transducer subsystem, a first conductive protective electrode having a width and a length configured to provide a first electrical connectivity to an external circuit, and a second conductive protective electrode having the width and the length and configured to provide a second electrical connectivity to the external circuit, wherein the transducer subsystem is sandwiched between the first and second conductive protective electrodes, and providing an external circuit configured to provide an electrical signal to the first and second conductive protective electrodes to thereby transduce the electrical signal to sound.

A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members. An angle θ1 formed between the first imaginary line and a second imaginary line passing through the first bonding member and the second bonding member is 100°<θ1<140°.

A CMOS-compatible actuator platform for implementing phase, amplitude, and frequency modulation in silicon nitride photonic integrated circuits via piezo-optomechanical coupling using tightly mechanically coupled aluminum nitride actuators is disclosed. The platform, which may be fabricated in a CMOS foundry, enables scalable active photonic integrated circuits for visible wavelengths, and the piezoelectric actuation functions without performance degradation down to cryogenic operating temperatures. A number of devices are possible, including ring modulator devices, phase shifter devices, Mach-Zehnder interferometer devices, directional coupler devices (including tunable directional coupler devices), and acousto-optic modulator and frequency shifter devices, each of which can employ the same AlN actuator platform. As all of these devices can be built on the same AlN actuator platform, numerous optical functions can be implemented on a single die.

An electronic device may include a first electrode, a first piezoelectric layer electrically coupled to the first electrode, a first magnetostrictive layer above the first piezoelectric layer, a first tunnel barrier layer above the first magnetostrictive layer, and a ferromagnetic layer above the first ferroelectric layer. The electronic device may further include a second electrode electrically coupled to the ferromagnetic layer a second tunnel barrier layer above the ferromagnetic layer, a second magnetostrictive layer above the second tunnel barrier layer, a second piezoelectric layer above the second magnetostrictive layer, and a third electrode electrically coupled to the second piezoelectric layer. The first piezoelectric layer may be strained responsive to voltage applied across the first and second electrodes, and the second piezoelectric layer may be strained responsive to voltage applied across the second and third electrodes.