Patent classifications
H10N30/872
SUBSTRATE
A substrate that includes a film-shaped member that has a first main surface and a second main surface; a first electrode that has a third main surface and a fourth main surface, the third main surface facing the second main surface of the film-shaped member, the first electrode having a first patterning region with a first part where the film-shaped member is exposed from the first electrode and a second part where the film-shaped member is not exposed from the first electrode; and an adhesive tape facing the fourth main surface of the first electrode and the second main surface of the film-shaped member such that the adhesive tape is disposed across the first part and the second part in the first patterning region.
Ultrasonic sensing module, ultrasonic sensing device and control method thereof, display device
An ultrasonic sensing module, an ultrasonic sensing device and a control method thereof, and a display device. The ultrasonic sensing module includes a first electrode layer, a piezoelectric layer, a receiving electrode layer and an emission electrode layer. The first electrode layer is on a first side of the piezoelectric layer; the receiving electrode layer and the emission electrode layer insulated from the receiving electrode layer are on a second side of the piezoelectric layer; and the second side is opposite to the first side.
Piezoelectric ceramic and method for manufacturing same, as well as piezoelectric element
A piezoelectric ceramic, which does not contain lead as a constituent element, is characterized in that: its primary component is a perovskite compound expressed by the composition formula (Bi.sub.0.5−x/2Na.sub.0.5−x/2Ba.sub.x)(Ti.sub.1−yMn.sub.y)O.sub.3 (where 0.01≤x≤0.25, 0.001≤y≤0.020); and the coefficient of variation (CV) in grain size among the grains contained therein is 35 percent or lower. The piezoelectric ceramic presents an improved dielectric loss tangent tan δ.
MAGNETOELECTRIC DEVICE
A magnetoelectric (“ME”) device is disclosed. In one aspect, the ME device includes a first piezoelectric substrate portion and a second piezoelectric substrate portion; a magnetostrictive body with a magnetization oriented in a first direction, the magnetostrictive body arranged on and extending between the first and second portions; a pair of input electrodes arranged on the first portion; and a pair of output electrodes arranged on the second portion. The input electrodes are configured to induce a fringing electric field extending between the input electrodes via the first portion, thereby causing a deformation of the first portion which in turn causes a deformation of the magnetostrictive body such that the magnetization thereof is re-oriented to a second direction due to a reverse magnetostriction. An output voltage is induced between the output electrodes by a deformation of the second portion caused by the re-orientation of the magnetization of the magnetostrictive body.
MEMS DEVICE, HEAD AND LIQUID JET DEVICE
Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrate 30 provided with a bump 32 including a primary electrode 34, and a secondary substrate 10 provided with a secondary electrode 91 on a bottom surface of a recessed portion 36 formed by an adhesive layer 35. The primary substrate 10 and the secondary substrate 30 are joined together with the adhesive layer 35, the primary electrode 34 is electrically connected to the secondary electrode 91 with the bump 32 inserted into the recessed portion 36, and part of the bump 32 and the adhesive layer 35 forming the recessed portion 36 overlap each other in a direction in which the bump 32 is inserted into the recessed portion 36.
MOTHER PIEZOELECTRIC ELEMENT, LAMINATED PIEZOELECTRIC ELEMENT, AND MANUFACTURING METHOD FOR LAMINATED PIEZOELECTRIC ELEMENT
The structure of a mother piezoelectric element allows a polarization process to be performed on the mother body before the individual piezoelectric elements are cut from the mother piezoelectric element. The mother piezoelectric element includes a plurality of first internal electrodes which are provided on at least one first surface and a plurality of second internal electrodes which are provided on at least one second surface. Each of the first and second internal electrodes is led out to any of first to fourth side surfaces of a mother piezoelectric body. The plurality of first internal electrodes are electrically connected to each other on a first surface and the plurality of second internal electrodes are electrical connected to each other on a second surface. All the first internal electrodes in the mother piezoelectric body are electrically connected to each other, and all the second internal electrodes in the mother piezoelectric body are electrically connected to each other.
LAMINATED PIEZOELECTRIC ELEMENT
Provided is a laminated piezoelectric element capable of suppressing a short circuit between piezoelectric films in a laminated piezoelectric element in which a plurality of layers of a piezoelectric film formed by interposing a piezoelectric layer between an electrode layer and a protective layer are laminated. The laminated piezoelectric element is formed by laminating a plurality of layers of piezoelectric films each having a piezoelectric layer, two electrode layers between which the piezoelectric layer is interposed, and two protective layers respectively covering the electrode layers. At least a part of each end side of the adjacent piezoelectric films is located at a different position in a plane direction.
ACOUSTIC WAVE DEVICES WITH THERMAL BYPASS
An acoustic wave device can have a plurality of coupling portions configured to electrically couple electrodes of the device to the substrate of the device to provide a bypass current pathway through the substrate for heat management. The substrate can be a semiconductor material, which can become more conductive as the temperature increases so that the bypass current pathway diverts more power through the substrate as the temperature increases. The acoustic wave device can be a surface acoustic wave device, which can have an interdigital transducer electrode that has the coupling portions on each of the bus bars and extending through the piezoelectric layer to contact the substrate. The acoustic wave device can be a bulk acoustic wave device in some implementations.
LAMINATED PIEZOELECTRIC ELEMENT AND ELECTROACOUSTIC TRANSDUCER
Provided are a laminated piezoelectric element and an electroacoustic transducer capable of obtaining high piezoelectric characteristics and easily ensuring an electric contact to an electrode layer. A plurality of layers of piezoelectric films, each of which is formed by laminating a first protective layer, a first electrode layer, a piezoelectric layer, a second electrode layer, and a second protective layer in this order, are laminated. Each of the piezoelectric layers is polarized in a thickness direction. In each of the piezoelectric films, the first electrode is disposed on an upstream side in a polarization direction of the piezoelectric layer, and the second electrode is disposed on a downstream side. Each of the plurality of piezoelectric films has a cemented portion which is cemented to an adjacent piezoelectric film and a protruding portion which is not cemented to the adjacent piezoelectric film and in which at least the first electrode layer and the first protective layer or the second electrode layer and the second protective layer protrude from the cemented portion toward the outside in a plane direction. At the protruding portion of each of the piezoelectric films, at least one of a first contact, to which the first electrode layers of the piezoelectric films are electrically connected to each other, or a second contact, to which the second electrode layers of the piezoelectric films are electrically connected to each other, is formed.
PIEZOELECTRIC SOUND GENERATION COMPONENT
A piezoelectric sound generation component is provided that includes a piezoelectric vibration plate, a case with a case body and a lid that accommodates the piezoelectric vibration plate in an inner space formed by the case body and the lid, and a pin terminal provided to the lid so that the pin terminal is abutted on the piezoelectric vibration plate. The case body has a first top wall and a first circumferential wall. The lid has a second top wall, a second circumferential wall, and a protruding portion that contacts the first circumferential wall of the case body. The protruding portion has a first surface that is abutted on a contact surface, facing the first top wall, of the first circumferential wall and a second surface that couples the first surface to the second circumferential wall and is separated from the first circumferential wall.