A superconducting junction comprises: a first layer and a second layer of superconducting material; a tunneling layer of insulating material disposed between the first layer and the second layer of the superconducting material; and a layer of thermally conducting, non-superconducting material disposed between the first layer and the second layer of the superconducting material, the non-superconducting layer being in contact with either the first layer or the second layer of superconducting material.

A quantum device capable of preventing contacts from being displaced is provided. A quantum device includes a quantum element in which a quantum circuit is provided, a socket including contacts and a housing, the contacts being in contact with a terminal of the quantum element, and the housing supporting the contacts, and a board including a board substrate. At least one of the housing and the board substrate includes a hole, another one of the housing and the board substrate includes a fixing part disposed inside the hole and a body part other than the fixing part, and the fixing part and the body part are integrally formed.

The problem is to attain a joint for multi-core superconducting wires having a high critical current property. The joint for superconducting wires of the present invention has a first sintered body containing MgB.sub.2 configured to fix a plurality of superconducting wires, and a second sintered body containing MgB.sub.2 configured to joint the superconducting wires.

A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.

Josephson junctions (JJ) based on bilayers of azimuthally misaligned two-dimensional materials having superconducting states are provided. Also provided are electronic devices and circuits incorporating the JJs as active components and methods of using the electronic devices and circuits. The JJs are formed from bilayers composed of azimuthally misaligned two-dimensional materials having a first superconducting segment and a second superconducting segment separated by a weak-link region that is integrated into the bilayer.

Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip (10) is flip-chip mounted on an interposer (20) by a bump (30). A coplanar line (12) coupling adjacent quantum bits is formed on the quantum chip (10). A gap (22) is provided, in the interposer (20), at a location facing a center conductor (12a) of the coplanar line (12). A second ground electrode (24) is formed around gap (22). The interposer (20) has a connection electrode (40) connecting the second ground electrode (24) around the gap (22). A bump (30A) formed in the vicinity of the connection electrode (40) is connected to the first ground electrode (12b) and the second ground electrode (24).

Methods of forming superconducting integrated circuits are discussed. The method includes depositing a first superconducting metal layer to overlie at least a portion of a substrate, depositing a dielectric layer to cover a first region of the first superconducting metal layer, pattering the dielectric layer to expose at least a portion of the first region of the first superconducting metal layer and form an opening, and depositing a second superconducting metal layer at an ambient temperature that is less than a melting temperature of the second superconducting metal layer such that the second superconducting metal layer fills the opening and conductively contacts the at least a portion of the first region of the first superconducting metal layer.

Methods of forming superconducting integrated circuits are discussed. The method includes depositing a first superconducting metal layer to overlie at least a portion of a substrate, depositing a dielectric layer to cover a first region of the first superconducting metal layer, pattering the dielectric layer to expose at least a portion of the first region of the first superconducting metal layer and form an opening, and depositing a second superconducting metal layer at an ambient temperature that is less than a melting temperature of the second superconducting metal layer such that the second superconducting metal layer fills the opening and conductively contacts the at least a portion of the first region of the first superconducting metal layer.

A multiple functioning superconductive device was invented based on Toroidal Josephson Junction (FFTJJ) array with 3D-cage structure self-assembled organo-metallic superlattice membrane. The device not only mimics the structure and function of an activated Matrix Metalloproteinase-2 (MMP-2) protein, but also mimics the cylinder structure of the Heat Shock Protein (HSP60) protein, that works at room temperature under a normal atmosphere, and without external electromagnetic power applied. The device enabled direct rapid real-time monitoring atto-molarity concentration ATP in biological specimens and was able to define the anti-inflammatory and pro-inflammatory status revealed a transitional range of ATP concentration under antibody-free, tracer-free and label-free conditions.

The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.