According to one embodiment, a pattern inspection method includes detecting a region of a photomask having a pattern that differs from a corresponding design, acquiring an exposure focus shift information including an exposure focus shift amount of a portion of a substrate corresponding to the detected region of the photomask. The exposure focus shift amount for the detected region is acquired from the exposure focus shift information, and then a pass/fail determination for the detected region is performed based on an estimated pattern to be formed on the substrate.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

A method of manufacturing an organic light-emitting display apparatus includes: forming a lift-off layer on a substrate including a first electrode, the lift-off layer including a fluoropolymer; forming a pattern layer on the lift-off layer; etching the lift-off layer between patterns of the pattern layer by utilizing a first solvent to expose the first electrode; forming an organic functional layer on the first electrode and the pattern layer, the organic functional layer including an emission layer; removing remaining portions of the lift-off layer by utilizing a second solvent; and forming a second electrode on the organic functional layer.

A method of forming a semiconductor structure is provided. A layout of a substrate is provided. The layout includes a surface having an inner region and an outer region surrounding the inner region. An under bump metallurgy (UBM) pad region within the outer region is defined. The UBM pad region is partitioned into a first zone and a second zone, wherein the first zone faces towards a center of the substrate, and the second zone faces away from the center of the substrate. The substrate is provided according to the layout, wherein the providing of the substrate includes forming a conductive via in the substrate. The conductive via is disposed outside the second zone and at least partially overlaps the first zone from a top view perspective. A UBM pad is formed over the conductive via and within the UBM pad region.

An oriented magnetic core lamination technique and a method of producing circular lamination cores. The method includes cutting rectangular strips with teeth pointing in a single direction (may not be the traverse or rolling direction) from the steel sheet plane, as opposed to directly punching circular laminates from the steel sheet with the teeth pointing in all directions. The strips are cut in such a way that the short side is aligned to the direction that has the best magnetic properties. The strips can then be bent into a donut or toroidal shape, either inwardly (with teeth pointing to the circle center) or outwardly (with teeth pointing out of the center) depending on the design of the lamination core. The direction with the best magnetic properties may be determined by non-destructive methods such as magnetic Barkhausen noise (MBN) analysis, x-ray diffraction (XRD), or electron backscatter diffraction (EBSD).

A system for monitoring cutting devices in a packaging production line having a line for supplying a material to be cut, an area of a predetermined type of cutting device, and a packaging output line is provided. The system includes means for counting cutting actions of the cutting device, configured to provide a time series of cutting action counting data, a video camera to frame an area of the output line, the video camera configured to provide video data of packaging elements in the output line, first code means, configured to run, on a computer, a first algorithm for recognizing cutting defects starting from video data, the first algorithm providing defect recognition data, and second code means, configured to run, on the computer, a trained expert algorithm to predict cutting performance degradation based on historical defect recognition data, time series of cutting action counting data, and type of cutting device.

The present teachings relate to a method comprising a plurality of sensors, and one or more functionally connected processing units, the method comprising: providing, at any of the one or more processing units, time-series residual data of a sensor object; the sensor object being a group of at least some of the sensors from the plurality of sensors, and wherein the residual data comprises, for each of the sensors of the sensor object, a residue signal which is a difference between the sensor's measured output and the sensor's expected output, monitoring, via any of the one or more processing units, a level signal; wherein the level signal is indicative of a collective time-based variation of the time-series residual data, monitoring, via any of the one or more processing units, an association signal; wherein the association signal is indicative of the variation and/or association structure of the time-series residual data, generating, via any of the one or more processing units, an anomaly event signal when at a given time a value of the level signal and/or a value of the association signal changes from an expected value of the respective signal at or around that time. The present teachings also relate to a monitoring and/or control system for a plant comprising a plurality of sensors, wherein the system comprises one or more processing units configured to perform the method steps of any of the steps herein disclosed, and a computer software product.

Semiconductor devices having metallization structures including crack-inhibiting structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a metallization structure formed over a semiconductor substrate. The metallization structure can include a bond pad electrically coupled to the semiconductor substrate via one or more layers of conductive material, and an insulating material—such as a low-κ dielectric material—at least partially around the conductive material. The metallization structure can further include a crack-inhibiting structure positioned beneath the bond pad between the bond pad and the semiconductor substrate. The crack-inhibiting structure can include a barrier member extending vertically from the bond pad toward the semiconductor substrate and configured to inhibit crack propagation through the insulating material.

The present invention addresses the problem of providing novel techniques for manufacturing a SiC substrate that enables reduced material loss when a strained layer is removed. The present invention is a method for manufacturing a SiC substrate 30 which includes a strained layer thinning step S1 for thinning a strained layer 12 of a SiC substrate body 10 by moving the strained layer 12 to a surface side. Including such a strained layer thinning step S1 in which the strain layer is moved to (concentrated toward) the surface side makes it possible to reduce material loss L when removing the strained layer 12.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.