An adhesive-bonded attachment device includes a mounting base including a mounting surface, a structural adhesive disposed on the mounting surface, and a pressure-sensitive adhesive disposed on the mounting surface bordering the structural adhesive, wherein the structural adhesive and the pressure-sensitive adhesive define a bonding surface configured to be bonded to a contact surface of a structure, and an attachment feature disposed on said mounting base.

An adhesive-bonded attachment device includes a mounting base including a mounting surface, a structural adhesive disposed on the mounting surface, and a pressure-sensitive adhesive disposed on the mounting surface bordering the structural adhesive, wherein the structural adhesive and the pressure-sensitive adhesive define a bonding surface configured to be bonded to a contact surface of a structure, and an attachment feature disposed on said mounting base.