Disclosed are devices and methodologies for cleaning wafers in wafer processing operations such as solvent cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and solvent cleaning operations are disclosed.

A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

An apparatus for fixing an optical fiber hole insert in coordinate measurement, is provided. The apparatus includes a main body and a cover plate. The main body includes a front side surface, a back side surface and a support surface, a plurality of first grooves formed in the support surface and exposed at the front side surface, a plurality of second grooves formed in the support surface and exposed at the back side surface, and a through hole defined in the support surface. The first grooves are aligned with the respective second grooves, the first and second grooves communicate with the through hole and are configured for cooperatively receiving the optical fiber hole insert. The cover plate is configured for covering the support surface and making contact with the optical fiber hole insert. A method for measuring the optical fiber hole insert using the apparatus is also provided.