The system, method and apparatus described relates generally to a device related to substrate storage and processing. In one example embodiment to methods, apparatus, and systems of a substrate storage and processing module improving upon existing devices used in one or more instances for substrate transportation, sorting, and cleaning. The single piece design system may contain and support substrates in a method, reducing strain on its contents by utilizing an innovative support system without the use of standard clamping techniques and, in this or other iterations, such stacking methods may minimize chaffing of surfaces. Thus the device is vastly improved in its ability to preserve pristine conditions of contained substrates.

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

In accordance with one aspect of the exemplary embodiments, a substrate transport apparatus is provided comprising a drive mechanism, a movable arm assembly connected to the drive mechanism, an end effector connected to the arm assembly. A chuck for holding a substrate is mounted on the end effector and having a movable edge gripper with a contact surface and an edge of the substrate may be gripped by actuating the movable edge gripper to engage the substrate with the contact surface. The apparatus further comprising a motion sensor for providing a signal to actuate the movable edge gripper to close and open the moveable edge gripper for capturing and releasing the substrate.

A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<RBL0).

Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.

A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<RBL0).

A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.

A support body includes a protrusion that protrudes in the horizontal direction from a base and passes through a notch in the vertical direction when a container is transferred, and the lateral width of the protrusion is formed to be narrower than the lateral width of the container. A small container and a large container configured to be wider than the small container in the lateral width direction exist as the container. The support body includes, as support body-side supporting parts, three support body-side small container supporting parts that support three small container supported parts located on the bottom surface of the small container, and a support body-side edge supporting part that supports an edge of the outer periphery of the bottom surface of the large container near the base.

A substrate processing apparatus having a station for loading and unloading substrates from the apparatus is provided. The station has a loading and unloading aperture, a magazine door drive for opening a substrate magazine by removing a door of a substrate magazine through the loading and unloading aperture, and a substrate magazine transport having a magazine support, the substrate magazine transport being configured to move the substrate magazine horizontally between a first position and a second position. When in the first position the substrate magazine is seated on the magazine support and communicates with the aperture and when moved to the second position the substrate magazine is offset from the first position, where the substrate magazine remains seated on the magazine support during horizontal transfer between the first and second positions and another substrate magazine is capable of being located at the first position in communication with the aperture.