Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units

Abstract

A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.

Claims

1. A substrate treating apparatus comprising: a first treating block; and a second treating block disposed adjacent to the first treating block; each of the first treating block and the second treating block including a plurality of stories arranged vertically; each of the plurality of stories including: treating units for treating substrates; and a main transport mechanism for transporting the substrates to and from the treating units; wherein the substrates are transportable between the plurality of stories of the first treating block and the plurality of stories of the second treating block at same heights as corresponding stories of the first treating block; and wherein the substrates are transportable between the plurality of stories of the first treating block and the plurality of stories of the second treating block at different heights from corresponding stories of the first treating block.

2. The apparatus according to claim 1 further comprising: a plurality of fixed receivers provided for respective stories, the plurality of fixed receivers being arranged between the first treating block and the second treating block; and a receiver transport mechanism for transporting the substrates between the plurality of fixed receivers.

3. The apparatus according to claim 2 wherein: the main transport mechanisms on the respective stories are capable of transporting the substrates to and from the plurality of fixed receivers provided for same stories as the main transport mechanisms; and the receiver transport mechanism is vertically movable between height positions of the plurality of fixed receivers provided for the respective stories.

4. The apparatus according to claim 1 wherein: each of the first treating block and the second treating block includes: an upper story; and a lower story located below the upper story; wherein the substrates are transportable between the upper story of the first treating block and the upper story of the second treating block, and between the lower story of the first treating block and the lower story of the second treating block; and the substrates are transportable between the upper story of the first treating block and the lower story of the second treating block, and between the lower story of the first treating block and the upper story of the second treating block.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) For the purpose of illustrating the invention, there are shown in the drawings several forms, it being understood, however, that the invention is not limited to the precise arrangement and instrumentalities shown.

(2) FIG. 1 is a schematic view showing an outline of a substrate treating apparatus according to an embodiment of the present invention;

(3) FIG. 2 is a schematic view showing an example of substrate transport paths through the substrate treating apparatus according to an embodiment of the present invention;

(4) FIG. 3 is a schematic view showing an example of substrate transport paths through the substrate treating apparatus according to an embodiment of the present invention;

(5) FIG. 4 is a schematic view showing an example of substrate transport paths through the substrate treating apparatus according to an embodiment of the present invention;

(6) FIG. 5 is a plan view showing an outline of the substrate treating apparatus according to an embodiment of the present invention;

(7) FIG. 6 is a schematic side view showing an arrangement of treating units included in the substrate treating apparatus;

(8) FIG. 7 is a schematic side view showing an arrangement of treating units included in the substrate treating apparatus;

(9) FIG. 8 is a view in vertical section taken on line a-a of FIG. 5;

(10) FIG. 9 is a view in vertical section taken on line b-b of FIG. 5;

(11) FIG. 10 is a view in vertical section taken on line c-c of FIG. 5;

(12) FIG. 11 is a view in vertical section taken on line d-d of FIG. 5;

(13) FIG. 12A is a plan view of coating units;

(14) FIG. 12B is a sectional view of a coating unit;

(15) FIG. 13 is a perspective view of a main transport mechanism;

(16) FIG. 14 is a control block diagram of the substrate treating apparatus according to an embodiment of the present invention;

(17) FIG. 15 is a flow chart of a series of treatments of substrates;

(18) FIG. 16 is a view schematically showing operations repeated by each transport mechanism;

(19) FIG. 17 is a view in vertical section of transporting spaces in a substrate treating apparatus in a second embodiment;

(20) FIG. 18 is a plan view of a modified substrate treating apparatus; and

(21) FIG. 19 is a view in vertical section taken on line e-e of FIG. 18.

DETAILED DESCRIPTION OF THE INVENTION

(22) Embodiments of this invention will be described in detail hereinafter with reference to the drawings.

First Embodiment

(23) An outline of this embodiment will be described first. FIG. 1 is a schematic view showing an outline of a substrate treating apparatus in this embodiment.

(24) This embodiment provides a substrate treating apparatus for forming resist film on substrates (e.g. semiconductor wafers) W, and developing exposed wafers W. This apparatus includes an indexer section (hereinafter called ID section) 1, a treating section 3, and an interface section (hereinafter called IF section) 5. The ID section 1, treating section 3 and IF section 5 are arranged adjacent one another in the stated order. An exposing machine EXP, which is an external apparatus separate from this apparatus, is disposed adjacent the IF section 5.

(25) The ID section 1 receives wafers W transported to the apparatus from outside, and transports the wafers W to the treating section 3. The treating section 3 carries out treatment for forming film on the wafers W transported from the ID section 1, and treatment for developing the wafers W. The IF section 5 transports the wafers W to and from the exposing machine EXP. The exposing machine EXP exposes the wafers W.

(26) The treating section 3 includes a coating block Ba and a developing block Bb. The coating block Ba and developing block Bb are arranged side by side between the ID section 1 and IF section 5. The coating block Ba is disposed adjacent the ID section 1, while the developing block Bb is disposed adjacent the IF section 5. The coating block Ba forms resist film on the wafers W. The developing block Bb develops the wafers W.

(27) Each of the treating blocks Ba and Bb is vertically divided into a plurality of stories K. In this embodiment, the coating block Ba has an upper story K1 and a lower story K3. Similarly, the developing block Bb has an upper story K2 and a lower story K4. The story K1 and story K2 are at the same level (height position), and the story K3 and story K4 are also at the same level (height position). The story K1 (K2) and story K3 (K4) are at different levels (height positions). In this specification, the stories in the same height position are referred to as the same stories or between the same stories where appropriate. The stories in the different height positions are referred to as different stories.

(28) The treating section 3 as a whole has a layered structure with the stories K1 and K2 forming an upper story, and the stories K3 and K4 forming a lower story.

(29) Each story K of the treating blocks Ba and Bb includes treating units for treating wafers W, and a main transport mechanism for transporting the wafers W to and from the treating units on that story. The treating units on each story K1 or K3 of the coating block Ba include coating units for forming resist film on the wafers W. The coating units are, for example, resist film coating units RESIST for applying a resist film material to the wafers W. The treating units on each story K2 or K4 of the developing block Bb include, for example, developing units DEV for developing the wafers W. FIG. 1 shows only the resist film coating units RESIST and developing units DEV. Each of the coating block Ba and developing block Bb corresponds to the treating block in this invention.

(30) The apparatus constructed in this way operates as follows. Wafers W are transported from the ID section 1 to the stories K1 and K3 of the coating block Ba, respectively. On the stories K1 and K3, treatment is carried out to form resist film on the wafers W. Upon completion of this treatment, the wafers W with resist film formed thereon are transported from the story K1 to either the story K2 or story K4. Similarly, the wafers W with resist film formed thereon are transported from the story K3 to either the story K2 or story K4.

(31) Each of the stories K2 and K4 transports the wafers W to the IF section 5. The IF section 5 transports the wafers W to the exposing machine EXP. The exposing machine EXP exposes the wafers W having resist film formed thereon. Upon completion of the exposure, the exposed wafers W are transported from the exposing machine EXP to the IF section 5.

(32) The wafers W are transported from the IF section 5 to the stories K2 and K4 of the developing block Bb. On the stories K2 and K4, treatment is carried out to develop the exposed wafers W. Upon completion of this treatment, the treated wafers W are transported from the story K2 to either the story K1 or story K3. Similarly, the treated wafers W are transported from the story K4 to either the story K1 or story K3. Each of the stories K1 and K3 transports the wafers W to the ID section 1.

(33) In this way, the wafers W can be transported between the same stories of the adjoining treating blocks Ba and Bb (between story K1 and story K2, and between story K3 and story K4). It is also possible to transport the wafers W between the different stories K of the adjoining treating blocks Ba and Bb, such as between story K1 and story K4 or between story K2 and story K3.

(34) Thus, there are four paths for transporting wafers W between the treating blocks Ba and Bb, which are story K1-story K2 (r1 in FIG. 1), story K3-story K4 (r2), story K1-story K4 (r3), and story K3-story K2 (r4). When the transport directions are distinguished, the number of paths is doubled to become eight. Consequently, even when it becomes impossible for a certain story K to treat or transport wafers W, the situation can be dealt with flexibly such as by transporting the wafers W through transport paths not including that story K. In such event, it is possible to operate the story of the other treating block B in the same height position as the abnormal story K, thereby inhibiting a significant reduction in the throughput of the entire apparatus.

(35) This apparatus can transport wafers W through two transport paths R1 and R2 as shown in FIG. 2, for example. The transport path R1 is for transporting wafers W between the same (upper) stories K1 and K2 of the treating blocks Ba and Bb. The transport path R2 is for transporting wafers W between the upper story K1 of the treating block Ba and the lower story K4 of the treating block Bb. The story K3 is included in neither of the transport paths R1 and R2. Transporting wafers W through such transport paths R1 and R2 is effective when treating units (e.g. resist film coating units RESIST) on the story K3 cannot treat wafers W, or when the main transport mechanism on the story K3 cannot transport wafers W (i.e. in an abnormal state). All the wafers W developed in the developing block Bb are transported to the story K1. This renders the quality of treatment among the wafers W more uniform than where the wafers W developed in the developing block Bb are transported to the different story K1 and story K3. The transport paths R1 and R2 allow the wafers W to receive the treatment for forming resist film on the same story K1, and receive the developing treatment on the different stories K2 and K4. This is effective also in that, by carrying out a series of treatments for the wafer W through such transport paths R1 and R2, the stories K2 and K4 can be compared and verified in respect of the quality of treatment and the like.

(36) This apparatus can transport wafers W through two transport paths R2 and R3 as shown in FIG. 3. The transport path R3 is for transporting wafers W between the same (lower) stories K3 and K4 of the treating blocks Ba and Bb. The story K2 is included in neither of the transport paths R2 and R3. Such transport paths R2 and R3 are effective when treating units (e.g. developing units DEV) on the story K2 cannot treat wafers W, or when the main transport mechanism on the story K2 cannot transport wafers W (i.e. in an abnormal state). The transport paths R2 and R3 allow the wafers W to receive the treatment for forming resist film on the different stories K1 and K3, and receive the developing treatment on the same story K4. This is effective also in that, by carrying out a series of treatments for the wafer W through such transport paths R2 and R3, the stories K1 and K3 can be compared and verified in respect of the quality of treatment and the like.

(37) Further, this apparatus can transport wafers W through two transport paths R4 and R5 as shown in FIG. 4. The transport path R4 is for transporting wafers W from the story K3 to the story K4, and from the story K4 to the story K1. The transport path R5 is for transporting wafers W from the story K3 to the story K4, and from the story K2 to the story K1. Therefore, as seen, the wafers W are transported in one direction on each of the stories K1 and K3 of the coating block Ba. Specifically, the story K3 of the coating block Ba receives wafers W exclusively from the ID section 1, and feeds the wafers W exclusively to the developing block Bb (story K4). The story K1 of the coating block Ba receives wafers W exclusively from the developing block Bb, and feeds the wafers W exclusively to the ID section 1. Since the coating block Ba carries out treatment before the wafers W are exposed, this treatment is carried out only on the story K3 where the wafers W before exposure are transported exclusively. Such transport paths R4 and R5 are effective when the treating units on the story K1 cannot treat wafers W. That is, the main transport mechanism on the story K1 is operated to transport wafers W from the developing block Bb to the ID section 1, thereby to ease the burden of the main transport mechanism on the story K3, and increase the throughput of the entire apparatus.

(38) In this invention, the paths r for transporting wafers W between the treating blocks Ba and Bb are not limited to the four transport paths r1-r4 noted hereinbefore. That is, the paths may be any three of the transport paths r1-r4. The transport paths r1, r2 and r3 are sufficient for the example of operation illustrated in FIG. 2 through 4. Further, the transport paths r3 and r4 can transport wafers W only in one way, besides being capable of transporting wafers W bidirectionally. In the example of operation illustrated in FIG. 4, for example, the transport path r3 may transport wafers W only in one direction from the developing block Bb to the coating block Ba.

(39) The construction of each component of this embodiment will be described in greater detail hereinafter.

(40) FIG. 5 is a plan view showing an outline of the substrate treating apparatus according to this embodiment. FIGS. 6 and 7 are schematic side views showing an arrangement of the treating units included in the substrate treating apparatus. FIGS. 8 through 11 are views in vertical section taken on lines a-a, b-b, c-c and d-d of FIG. 5, respectively.

(41) ID Section 1

(42) The ID section 1 takes wafers W out of each cassette C, which stores a plurality of wafers W, and deposits wafers W in the cassette C. The ID section 1 has a cassette table 9 for receiving cassettes C. The cassette table 9 can receive four cassettes C as arranged in a row. The ID section 1 has also an ID transport mechanism T.sub.ID. The ID transport mechanism T.sub.ID transports wafers W to and from each cassette C, and transports wafers W to and from receivers PASS.sub.1 and PASS.sub.3 to be described hereinafter. The ID transport mechanism T.sub.ID has a movable base 21 for moving horizontally alongside the cassette table 9 in the direction of arrangement of the cassettes C, a lift shaft 23 vertically extendible and contractible relative to the movable base 21, and a holding arm 25 swivelable on the lift shaft 23, and extendible and retractable radially of the swivel motion, for holding a wafer W. The ID transport mechanism T.sub.ID corresponds to the indexer's transport mechanism in this invention.

(43) Treating Section 3

(44) As shown in FIGS. 5, 8 and others, main transport mechanisms T.sub.1 and T.sub.3 are arranged on the stories K1 and K3 of the coating block Ba, respectively. Main transport mechanisms T.sub.2 and T.sub.4 are arranged on the stories K2 and K4 of the developing block Bb, respectively. The treating blocks Ba and Bb will be described separately hereinafter.

(45) Treating Section 3Coating Block Ba

(46) Receivers PASS.sub.1 and PASS.sub.3 for receiving wafers W are provided between the ID section 1 and the respective stories K1 and K3 of the treating block Ba. The receiver PASS.sub.1 receives, as placed thereon, wafers W passed between the ID transport mechanism T.sub.ID and the main transport mechanism T.sub.1. Similarly, the receiver PASS.sub.3 receives, as placed thereon, wafers W passed between the ID transport mechanism T.sub.ID and the main transport mechanism T.sub.3. Seen in a sectional view, the receiver PASS.sub.1 is disposed at a height adjacent a lower part of the upper story K2, while the receiver PASS.sub.3 is disposed at a height adjacent an upper part of the lower story K3. Thus, the positions of receiver PASS.sub.1 and receiver PASS.sub.3 are relatively close to each other for allowing the ID transport mechanism T.sub.ID to move between the receiver PASS.sub.1 and receiver PASS.sub.3 through using only a small amount of vertical movement.

(47) Receivers PASS.sub.2 and PASS.sub.4 for receiving wafers W are fixedly provided for the respective stories K between the treating blocks Ba and Bb. Specifically, the receiver PASS.sub.2 is disposed between the story K1 and story K2, and the receiver PASS.sub.4 between the story K3 and story K4. The main transport mechanisms T.sub.1 and T.sub.2 transfer wafers W through the receiver PASS.sub.2, and the main transport mechanisms T.sub.3 and T.sub.4 through the receiver PASS.sub.4. Thus, the receivers PASS.sub.2 and PASS.sub.4 are used to transport wafers W between the same stories. The receivers PASS.sub.2 and PASS.sub.4 correspond to the fixed receivers in this invention.

(48) Further provided between the treating blocks Ba and Bb is a movable receiver MPASS for receiving wafers W, which is vertically movable between the upper and lower stories. Specifically, the movable receiver MPASS is vertically movable by a drive mechanism (not shown) between the receiver PASS.sub.2 and receiver PASS.sub.4. The movable receiver MPASS is movable between a height position corresponding to the story K1 (K2) and a height position corresponding to the story K3 (K4). The height position corresponding to the story K1 (K2) is slightly lower than the receiver PASS.sub.2, which is shown in solid lines in FIG. 8. The height position corresponding to the story K3 (K4) is slightly higher than the receiver PASS.sub.4, which is shown in dotted lines in FIG. 8. The main transport mechanism T.sub.1 and main transport mechanism T.sub.2 can place wafers W on the movable receiver MPASS having moved to the height position corresponding to the story K1 (K2), and can receive wafers W therefrom (that is, wafers W can be transported). Similarly, the main transport mechanism T.sub.3 and main transport mechanism T.sub.4 can transport wafers W to and from the movable receiver MPASS having moved to the height position corresponding to the story K3 (K4). Although usable to transport wafers W between the same stories, the movable receiver MPASS is used exclusively to transport wafers W between the different stories in this embodiment.

(49) The receiver PASS.sub.1 includes a plurality of receivers (two in this embodiment). These receivers PASS.sub.1 are arranged vertically adjacent each other. Similarly, each of the receivers PASS.sub.2-PASS.sub.4, each of receivers PASS.sub.5 and PASS.sub.6 to be described hereinafter, and the movable receiver MPASS, includes a plurality of receivers (two in this embodiment) arranged vertically adjacent each other. One of the pair of receivers PASS is selected according to a direction for transferring wafers W.

(50) The receiver PASS.sub.1, for example, has two receivers PASS.sub.1A and PASS.sub.1B arranged vertically adjacent each other. One of these receivers PASS.sub.1A receives wafers W passed from the ID transport mechanism T.sub.ID to the main transport mechanism T.sub.1. The other receiver PASS.sub.1B receives wafers W passed from the main transport mechanism T.sub.1 to the ID transport mechanism T.sub.ID.

(51) The receiver PASS.sub.2, for example, has two receivers PASS.sub.2A and PASS.sub.2B. The main transport mechanism T.sub.1 places wafers W on one of these receivers PASS.sub.2A, and the main transport mechanism T.sub.2 receives these wafers W. The main transport mechanism T.sub.2 places wafers W on the other receiver PASS.sub.2B, and the main transport mechanism T.sub.1 receives these wafers W.

(52) The movable receiver MPASS, for example, has movable receivers MPASS.sub.A and MPASS.sub.B. The main transport mechanism T.sub.1 or main transport mechanism T.sub.3 places wafers W on one of these movable receivers MPASS.sub.A, and the main transport mechanism T.sub.2 or main transport mechanism T.sub.4 receives these wafers W. The main transport mechanism T.sub.2 or main transport mechanism T.sub.4 places wafers W on the other movable receiver MPASS.sub.B, and the main transport mechanism T.sub.1 or main transport mechanism T.sub.3 receives these wafers W.

(53) Each of the receivers PASS.sub.1-PASS.sub.E and movable receiver MPASS has a plurality of support pins projecting therefrom, for receiving a wafer W in a substantially horizontal position on these support pins. Each of the receivers PASS.sub.1-PASS.sub.E and movable receiver MPASS has also a sensor (not shown) for detecting presence or absence of a wafer W. Detection signals of each sensor are inputted to a control section 90 described hereinafter. Based on the detection signals of each sensor, the control section 90 determines whether or not a wafer W is placed on the receiver PASS or MPASS, and controls the main transport mechanisms T in transferring wafers W through the receiver PASS or MPASS.

(54) The story K1 will now be described. The treating units on the story K1 are coating units 31 and heat-treating units 41 for forming resist film on wafers W. The main transport mechanism T.sub.1 transports the wafers W to and from the coating units 31 and heat-treating units 41. The main transport mechanism T.sub.1 is movable in a transporting space A1 extending substantially through the center of the story K1 and parallel to the direction of transport. The coating units 31 are arranged on one side of the transporting space A.sub.1, while the heat-treating units 41 are arranged on the other side thereof.

(55) The coating units 31 are arranged vertically and horizontally, each facing the transporting space A.sub.1. In this embodiment, four coating units 31 in total are arranged in two columns and two rows.

(56) The coating units 31 include anti-reflection film coating units BARC for forming anti-reflection film on the wafers W, and resist film coating units RESIST for forming resist film on the wafers W (i.e. carrying out resist film forming treatment).

(57) The anti-reflection film coating units BARC apply a treating solution for anti-reflection film to the wafers W. The resist film coating units RESIST apply a resist film material to the wafers W. The plurality of (two) anti-reflection film coating units BARC are arranged at substantially the same height in the lower row. The plurality of (two) resist film coating units RESIST are arranged at substantially the same height in the upper row. No dividing wall or partition is provided between the anti-reflection film coating units BARC. That is, all the anti-reflection film coating units BARC are only housed in a common chamber, and the atmosphere around each anti-reflection film coating unit BARC is not blocked off (i.e. is in communication). Similarly, the atmosphere around each resist film coating unit RESIST is not blocked off.

(58) Reference is made to FIGS. 12A and 12B. FIG. 12A is a plan view of the coating units 31. FIG. 12B is a sectional view of a coating unit 31. Each coating unit 31 includes a spin holder 32 for holding and spinning a wafer W, a cup 33 surrounding the wafer W, and a supply device 34 for supplying a treating solution to the wafer W.

(59) The supply device 34 includes a plurality of nozzles 35, a gripper 36 for gripping one of the nozzles 35, and a nozzle moving mechanism 37 for moving the gripper 36 to move one of the nozzles 35 between a treating position above the wafer W and a standby position away from above the wafer W. Each nozzle 35 has one end of a treating solution pipe 38 connected thereto. The treating solution pipe 38 is arranged movable (flexible) to permit movement of the nozzle 35 between the standby position and treating position. The other end of each treating solution pipe 38 is connected to a treating solution source (not shown). Specifically, in the case of anti-reflection film coating units BARC, the treating solution sources supply different types of treating solution for anti-reflection film to the respective nozzles 35. In the case of resist film coating units RESIST, the treating solution sources supply different types of resist film material to the respective nozzles 35.

(60) The nozzle moving mechanism 37 has first guide rails 37a and a second guide rail 37b. The first guide rails 37a are arranged parallel to each other and opposed to each other across the two cups 33 arranged sideways. The second guide rail 37b is slidably supported by the two first guide rails 37a and disposed above the two cups 33. The gripper 36 is slidably supported by the second guide rail 37b. The first guide rails 37a and second guide rail 37b take guiding action substantially horizontally and in directions substantially perpendicular to each other. The nozzle moving mechanism 37 further includes drive members (not shown) for sliding the second guide rail 37b, and sliding the gripper 36. The drive members are operable to move the nozzle 35 gripped by the gripper 36 to the treating positions above the two spin holders 32.

(61) The plurality of heat-treating units 41 are arranged vertically and horizontally, each facing the transporting space A.sub.1. In this embodiment, three heat-treating units 41 can be arranged horizontally, and five heat-treating units 41 can be stacked vertically. Each heat-treating unit 41 has a plate 43 for receiving a wafer W. The heat-treating units 41 include cooling units CP for cooling wafers W, heating and cooling units PHP for carrying out heating and cooling treatments continually, and adhesion units AHL for heat-treating wafers W in an atmosphere of hexamethyldisilazane (HMDS) vapor in order to promote adhesion of coating film to the wafers W. As shown in FIG. 5, each heating and cooling unit PHP has two plates 43, and a local transport mechanism (not shown) for moving a wafer W between the two plates 43. The various types of heat-treating units CP, PHP and AHL are arranged in appropriate positions.

(62) The main transport mechanism T.sub.1 will be described specifically. Reference is made to FIG. 13. FIG. 13 is a perspective view of the main transport mechanism T.sub.1. The main transport mechanism T.sub.1 has two third guide rails 51 for providing vertical guidance, and a fourth guide rail 52 for providing horizontal guidance. The third guide rails 51 are fixed opposite each other at one side of the transporting space A.sub.1. In this embodiment, the third guide rails 51 are arranged at the side adjacent to the coating units 31. The fourth guide rail 52 is slidably attached to the third guide rails 51. The fourth guide rail 52 has a base 53 slidably attached thereto. The base 53 extends transversely, substantially to the center of the transporting space A.sub.1. Further, drive members (not shown) are provided for vertically moving the fourth guide rail 52, and horizontally moving the base 53. The drive members are operable to move the base 53 to positions for accessing the coating units 31 and heat-treating units 41 arranged vertically and horizontally.

(63) The base 53 has a turntable 55 rotatable about a vertical axis Q. The turntable 55 has two holding arms 57a and 57b horizontally movably attached thereto for holding wafers W, respectively. The two holding arms 57a and 57b are arranged vertically close to each other. Further, drive members (not shown) are provided for rotating the turntable 55, and extending and retracting the holding arms 57a and 57b. The drive members are operable to move the turntable 55 to positions opposed to the coating units 31, heat-treating units 41, receivers PASS.sub.1 and PASS.sub.2, and movable receiver MPASS, having moved to the height position corresponding to the story K1 (K2), and to extend and retract the holding arms 57a and 57b to and from the coating units 31 and so on.

(64) The story K3 will be described next. Like reference numerals are used to identify like parts which are the same as in the story K1, and will not be described again. The layout (arrangement) in plan view of the main transport mechanism T.sub.3 and various treating units on the story K3 is substantially the same as on the story K1. Thus, the arrangement of the various treating units of the story K3 as seen from the main transport mechanism T.sub.3 is substantially the same as the arrangement of the various treating units of the story K1 as seen from the main transport mechanism T.sub.1. The coating units 31 and heat-treating units 41 of the story K3 are stacked under the coating units 31 and heat-treating units 41 of the story K1, respectively.

(65) In the following description, when distinguishing the resist film coating units RESIST in the stories K1 and K3, subscripts 1 and 3 will be affixed (for example, the resist film coating units RESIST in the story K1 will be referred to as resist film coating units RESIST.sub.1).

(66) The other aspects of the treating block Ba will be described. As shown in FIGS. 8 and 9, each of the transporting spaces A.sub.1 and A.sub.3 has a first blowout unit 61 for blowing out a clean gas, and an exhaust unit 62 for sucking in the gas. Each of the first blowout unit 61 and exhaust unit 62 is in the form of a flat box having substantially the same area as the transporting space A.sub.1 in plan view. Each of the first blowout unit 61 and exhaust unit 62 has first blowout openings 61a or exhaust openings 62a formed in one surface thereof. In this embodiment, the first blowout openings 61a or exhaust openings 62a are in the form of numerous small bores f (see FIG. 13). The first blowout units 61 are arranged over the transporting spaces A.sub.1 and A.sub.3 with the first blowout openings 61a directed downward. The exhaust units 62 are arranged under the transporting spaces A.sub.1 and A.sub.3 with the exhaust openings 62a directed upward. The atmosphere in the transporting space A.sub.1 and the atmosphere in the transporting space A.sub.3 are blocked off by the exhaust unit 62 of the transporting space A.sub.1 and the first blowout unit 61 of the transporting space A.sub.3. Thus, each of the stories K1 and K3 has the atmosphere blocked off from the other.

(67) Referring to FIG. 9, the first blowout units 61 of the transporting spaces A.sub.1 and A.sub.3 are connected to a common, first gas supply pipe 63. The first gas supply pipe 63 extends laterally of the receivers PASS.sub.2 and PASS.sub.4 from an upper position of the transporting space A.sub.1 to a lower position of the transporting space A.sub.3, and is bent below the transporting space A.sub.3 to extend horizontally. The other end of the first gas supply pipe 63 is connected to a gas source not shown. Similarly, the exhaust units 62 of the transporting spaces A.sub.1 and A.sub.3 are connected to a common, first gas exhaust pipe 64. The first gas exhaust pipe 64 extends laterally of the receivers PASS.sub.2 and PASS.sub.4 from a lower position of the transporting space A.sub.1 to a lower position of the transporting space A.sub.3, and is bent below the transporting space A.sub.3 to extend horizontally. As the gas is blown out of each first blowout opening 61a and sucked and exhausted through each exhaust opening 62a of the transporting spaces A.sub.1 and A.sub.3, gas currents are formed to flow from top to bottom of the transporting spaces A.sub.1 and A.sub.3, thereby keeping each of the transporting spaces A.sub.1 and A.sub.3 in a clean state.

(68) As shown in FIGS. 5, 10 and 12A, each coating unit 31 of the stories K1 and K3 has a pit portion PS extending vertically. The pit portion PS accommodates a second gas supply pipe 65 extending vertically for supplying the clean gas, and a second gas exhaust pipe 66 extending vertically for exhausting the gas. Each of the second gas supply pipe 65 and second gas exhaust pipe 66 branches at a predetermined height in each coating unit 31 to extend substantially horizontally from the pit portion PS. A plurality of branches of the second gas supply pipe 65 are connected to second blowout units 67 for blowing out the gas downward. A plurality of branches of the second gas exhaust pipe 66 are connected for communication to the bottoms of the respective cups 33. The other end of the second gas supply pipe 65 is connected to the first gas supply pipe 63 below the story K3. The other end of the second gas exhaust pipe 66 is connected to the first gas exhaust pipe 64 below the story K3. As the gas is blown out of the second blowout units 67 and exhausted through the second exhaust pipes 62a, the atmosphere inside each cup 33 is constantly maintained clean, thereby allowing for excellent treatment of the wafer W held by the spin holder 32.

(69) The pit portions PS further accommodate piping of the treating solutions, electric wiring and the like (not shown). Thus, with the pit portions PS accommodating the piping and electric wiring provided for the coating units 31 of the stories K1 and K3, the piping and electric wiring can be reduced in length.

(70) The treating block Ba has one housing 75 for accommodating the main transport mechanisms T.sub.1 and T.sub.3, coating units 31 and heat-treating units 41 described hereinbefore. The treating block Bb described hereinafter also has a housing 75 for accommodating the main transport mechanisms T.sub.2 and T.sub.4 and the various treating units of the treating block Bb. The housing 75 of the treating block Ba and the housing 75 of the treating block Bb are separate entities. Thus, with each of the treating blocks Ba and Bb having the housing 75 accommodating the main transport mechanisms T and various treating units en bloc, the treating section 3 may be manufactured and assembled simply. The main transport mechanisms T.sub.1 and T.sub.3 correspond to the first main transport mechanisms in this invention.

(71) Treating Section 3Developing Block Bb

(72) The story K2 will be described. Like reference numerals are used to identify like parts which are the same as in the story K1 and will not be described again. The story K2 has a transporting space A2 formed as an extension of the transporting space A.sub.1.

(73) The treating units on the story K2 are developing units DEV for developing wafers W, heat-treating units 42 for heat-treating the wafers W, and an edge exposing unit EEW for exposing peripheral regions of the wafers W. The developing units DEV are arranged at one side of the transporting space A.sub.2, and the heat-treating units 42 and edge exposing unit EEW are arranged at the other side of the transporting space A.sub.2. Preferably, the developing units DEV are arranged at the same side as the coating units 31. It is also preferable that the heat-treating units 42 and edge exposing unit EEW are arranged in the same row as the heat-treating units 41.

(74) The number of developing units DEV is four, and sets of two units DEV arranged horizontally along the transporting space A.sub.2 are stacked one over the other. As shown in FIGS. 5 and 10, each developing unit DEV includes a spin holder 77 for holding and spinning a wafer W, and a cup 79 surrounding the wafer W. The two developing units DEV arranged at the lower level are not separated from each other by a partition wall or the like. A supply device 81 is provided for supplying developers to the two developing units DEV. The supply device 81 includes two slit nozzles 81a having a slit or a row of small bores for delivering the developers. The slit or row of small bores, preferably, has a length corresponding to the diameter of wafer W. Preferably, the two slit nozzles 81a are arranged to deliver developers of different types or concentrations. The supply device 81 further includes a moving mechanism 81b for moving each slit nozzle 81a. Thus, the slit nozzles 81a are movable, respectively, over the two spin holders 77 juxtaposed sideways.

(75) The plurality of heat-treating units 42 are arranged sideways along the transporting space A.sub.2, and stacked one over the other. The heat-treating units 42 include heating units HP for heating wafers W, cooling units CP for cooling wafers W, and heating and cooling units PHP for successively carrying out heating treatment and cooling treatment.

(76) The plurality of heating and cooling units PHP are vertically stacked in the column closest to the IF section 5, each having one side facing the IF section 5. The heating and cooling units PHP on the story K2 have transport ports formed in the sides thereof for passage of wafers W. IF transport mechanisms T.sub.IF to be described hereinafter transport wafers W through the above transport ports to the heating and cooling units PHP. The heating and cooling units PHP arranged on the story K2 carry out post-exposure baking (PEB) treatment for exposed wafers W. Similarly, the heating and cooling units PHP arranged on the story K4 carry out post-exposure baking (PEB) treatment for exposed wafers W.

(77) The single edge exposing unit EEW is disposed in a predetermined position. The edge exposing unit EEW includes a spin holder (not shown) for holding and spinning a wafer W, and a light emitter (not shown) for exposing edges of the wafer W held by the spin holder.

(78) The receiver PASS.sub.5 is formed on top of the heating and cooling units PHP on the story K2. Through the receiver PASS.sub.5, the main transport mechanism T.sub.2 and IF transport mechanisms T.sub.IF to be described hereinafter transfer wafers W.

(79) The main transport mechanism T.sub.2 is disposed substantially centrally of the transporting space A.sub.2 in plan view. The main transport mechanism T.sub.2 has the same construction as the main transport mechanism T.sub.1. The main transport mechanism T.sub.2 transports wafers W to and from the receiver PASS.sub.2, movable receiver MPASS having moved to the height position corresponding to the story K1 (K2), developing units DEV, various heat-treating units 42, edge exposing unit EEW and receiver PASS.sub.5.

(80) The story K4 will be described briefly. The relationship in construction between story K2 and story K4 is similar to that between stories K1 and K3. The treating units U on the story K4 are developing units DEV, heat-treating units 42 and an edge exposing unit EEW. The heat-treating units 42 on the story K4 include heating units HP, cooling units CP and heating and cooling units PHP. The receiver PASS.sub.6 is formed on top of the heating and cooling units PHP on the story K4. The main transport mechanism T.sub.4 and IF transport mechanisms T.sub.IF described hereinafter transfer wafers W through the receiver PASS.sub.6. The heating and cooling units PHP on the story K4 also correspond to the PEB units in this invention.

(81) In the following description, when distinguishing the developing units DEV, edge exposing units EEW and so on provided on the stories K2 and K4, subscripts 2 and 4 will be affixed (for example, the heating units HP on the story K2 will be referred to as heating units HP.sub.2).

(82) Each of the transporting spaces A.sub.2 and A.sub.4 of the stories K2 and K4 also has constructions corresponding to the first blowout unit 61 and exhaust unit 62. Each developing unit DEV of the stories K2 and K4 also has constructions corresponding to the second blowout unit 67 and second gas exhaust pipe 66.

(83) Each of the main transport mechanism T.sub.2 and main transport mechanism T.sub.4 corresponds to the second main transport mechanism in this invention.

(84) IF Section 5

(85) The IF section 5 transfers wafers W between the treating section 3 (more particularly, the stories K2 and K4 of the developing block Bb) and the exposing machine EXP. The IF section 5 has IF transport mechanisms T.sub.IF for transporting wafers W. IF transport mechanisms T.sub.IF include an IF first transport mechanism T.sub.IFA and an IF second transport mechanism T.sub.IFB that can transfer wafers W to and from each other. IF first transport mechanism T.sub.IFA transports wafers W mainly to and from the developing block Bb. IF second transport mechanism T.sub.IFB transports wafers W mainly to and from the exposing machine EXP.

(86) As shown in FIG. 5, IF first transport mechanism T.sub.IFA and IF second transport mechanism T.sub.IFB are arranged in a transverse direction substantially perpendicular to the direction of arrangement of the main transport mechanisms T on each story. IF first transport mechanism T.sub.IFA is disposed at the side where the heat-treating units 42 and so on of the treating block Bb are located. IF second transport mechanism T.sub.IFB is disposed at the side where the developing units DEV of the treating block Bb are located.

(87) As shown in FIG. 11, IF first transport mechanism T.sub.IFA includes a fixed base 83, lift shafts 85 vertically extendible and contractible relative to the base 83, and a holding arm 87 swivelable on the lift shafts 85, and extendible and retractable radially of the swivel motion, for holding a wafer W. IF second transport mechanism T.sub.IFB also has a base 83, lift shafts 85 and a holding arm 87.

(88) Stacked in multiples stages between IF first and second transport mechanisms T.sub.IFA and T.sub.IFB are a receiver PASS-CP for receiving and cooling wafers W, a receiver PASS.sub.7 for receiving wafers W, and buffers BF.sub.IF for temporarily storing wafers W. The buffers BF.sub.IF are divided into a send buffer BF.sub.IFS for temporarily storing wafers W to be sent to the exposing machine EXP, and a return buffer BF.sub.IFR for temporarily storing wafers W to be returned to the treating section 3. The return buffer BF.sub.IFR stores exposed wafers W having received post-exposure baking (PEB) treatment.

(89) IF first transport mechanism T.sub.IFA transports wafers W to and from the receivers PASS.sub.5 and PASS.sub.E, heating and cooling units PHP on the stories K2 and K4, receiver PASS-CP, receiver PASS.sub.7 and buffer BF.sub.IF. IF second transport mechanism T.sub.IFB transports wafers W to and from the exposing machine EXP, receiver PASS-CP and receiver PASS.sub.7. IF first and second transport mechanisms T.sub.IFA and T.sub.IFB transfer wafers W therebetween through the receiver PASS-CP and receiver PASS.sub.7. IF transport mechanisms T.sub.IF correspond to the interface's transport mechanisms in this invention.

(90) A control system of this apparatus will be described next. FIG. 14 is a control block diagram of the substrate treating apparatus according to the invention. As shown, the control section 90 of this apparatus includes a main controller 91 and first to seventh controllers 93, 94, 95, 96, 97, 98 and 99.

(91) The main controller 91 performs overall control of the first to seventh controllers 93-99. Further, the main controller 91 can communicate through a host computer with an exposing machine controller provided for the exposing machine EXP. The first controller 93 controls substrate transport by the ID transport mechanism T.sub.ID. The second controller 94 controls substrate transport by the main transport mechanism T.sub.1, and substrate treatment in the resist film coating units RESIST.sub.1, anti-reflection film coating units BARC.sub.1, cooling units CP.sub.1, heating and cooling units PHP.sub.1 and adhesion units AHL.sub.1. The third controller 95 controls substrate transport by the main transport mechanism T.sub.2, and substrate treatment in the edge exposing unit EEW.sub.2, developing units DEV.sub.2, heating units HP.sub.2 and cooling units CP.sub.2. The controls by the fourth and fifth controllers 96 and 97 correspond to those by the second and third controllers 94 and 95, respectively. The sixth controller 98 controls substrate transport by IF first transport mechanism T.sub.IFA, and substrate treatment in the heating and cooling units PHP.sub.2 and PHP.sub.4. The seventh controller 99 controls substrate transport by IF second transport mechanism T.sub.IFB. Further, each of the second to fifth controllers 94-97 controls vertical movement of the movable receiver MPASS. The first to seventh controllers 93-99 carry out the controls independently of one another.

(92) Each of the main controller 91 and the first to seventh controllers 93-99 is realized by a central processing unit (CPU) which performs various processes, a RAM (Random Access Memory) used as the workspace for operation processes, and a storage medium such as a fixed disk for storing a variety of information including a predetermined processing recipe (processing program). The processing recipe includes also information on the transport paths for transporting wafers W.

(93) Next, operation of the substrate treating apparatus in this embodiment will be described. The examples of operation according to the various transport paths shown in FIGS. 2 through 4 are realized by combinations of operation of the respective transport mechanisms. Therefore, the following description will be made separately for each transport mechanism. FIG. 15 is a flow chart of a series of treatments of wafers W, indicating the treating units and receivers to which the wafers W are transported in order. FIG. 16 is a view schematically showing operations repeated by each transport mechanism, and specifying an order of treating units, receivers and cassettes accessed by the transport mechanisms.

(94) ID Transport Mechanism T.sub.ID

(95) The ID transport mechanism T.sub.ID moves to a position opposed to one of the cassettes C, holds with the holding arm 25a wafer W to be treated and takes the wafer W out of the cassette C. The ID transport mechanism T.sub.ID swivels the holding arm 25, vertically moves the lift shaft 23, moves to a position opposed to the receiver PASS.sub.1, and places the wafer W on the receiver PASS.sub.1A (which corresponds to step S1a in FIG. 15; only step numbers will be indicated hereinafter). At this time, a wafer W usually is present on the receiver PASS.sub.1B, and the ID transport mechanism T.sub.ID receives this wafer W and stores it in a cassette C (step S23). When there is no wafer W on the receiver PASS.sub.1B, step S23 is omitted. Then, the ID transport mechanism T.sub.ID accesses the cassette C, and transports a wafer W from the cassette C to the receiver PASS.sub.3A (step S1b). Here again, if a wafer W is present on the receiver PASS.sub.3B, the ID transport mechanism T.sub.ID will store this wafer W in a cassette C (step S23). The ID transport mechanism T.sub.ID repeats the above operation.

(96) This operation of the ID transport mechanism T.sub.ID is controlled by the first controller 93. As a result, the wafers W in the cassette C are fed to the story K1, and the wafers W delivered from the story K1 are stored in the cassette C. Similarly, the wafers W in the cassette C are fed to the story K3, and the wafers W delivered from the story K3 are stored in the cassette C.

(97) Main Transport Mechanisms T.sub.1, T.sub.3

(98) Since operation of the main transport mechanism T.sub.3 is substantially the same as operation of the main transport mechanism T.sub.1, only the main transport mechanism T.sub.1 will be described. That is, operation on the story K1 will be described. The main transport mechanism T.sub.1 moves to a position opposed to the receiver PASS.sub.1. At this time, the main transport mechanism T.sub.1 holds, on one holding arm 57 (e.g. 57b), a wafer W received immediately before from the receiver PASS.sub.2B. The main transport mechanism T.sub.1 places this wafer W on the receiver PASS.sub.1B (step S22), and holds the wafer W present on the receiver PASS.sub.1A with the other holding arm 57 (e.g. 57a).

(99) The main transport mechanism T.sub.1 accesses a predetermined one of the cooling units CP.sub.1. There is a different wafer W having already received a predetermined heat treatment (cooling) in the cooling unit CP.sub.1. The main transport mechanism T.sub.1 holds the different wafer W with the unloaded holding arm 57 (holding no wafer W), takes it out of the cooling unit CP.sub.1, and loads into the cooling unit CP.sub.1 the wafer W having been received from the receiver PASS.sub.1A. Then, the main transport mechanism T.sub.1, holding the cooled wafer W, moves to one of the anti-reflection film coating units BARC.sub.1. The cooling unit CP.sub.1 starts heat treatment (cooling) of the wafer W loaded therein (step S2). The following description assumes that wafers W having received predetermined treatments are present also in the other, different heat-treating units 41 and coating units 31 when the main transport mechanism T.sub.1 makes access thereto.

(100) Accessing the anti-reflection film coating unit BARC.sub.1, the main transport mechanism T.sub.1 takes a wafer W having anti-reflection film formed thereon from the anti-reflection film coating unit BARC.sub.1, and places the cooled wafer W on the spin holder 32 of the anti-reflection film coating unit BARC.sub.1. Then, the main transport mechanism T.sub.1, holding the wafer W having anti-reflection film formed thereon, moves to one of the heating and cooling units PHP.sub.1. The anti-reflection film coating unit BARC.sub.1 starts treatment of the wafer W placed on the spin holder 32 (step S3).

(101) Specifically, the spin holder 32 spins the wafer W in horizontal posture, the gripper 26 grips one of the nozzles 35, the nozzle moving mechanism 37 moves the gripped nozzle 35 to a position above the wafer W, and the treating solution for anti-reflection film is supplied from the nozzle 35 to the wafer W. The treating solution supplied spreads all over the wafer W, and is scattered away from the wafer W. The cup 33 collects the scattering treating solution. In this way, the treatment is carried out for forming anti-reflection film on the wafer W.

(102) Accessing the heating and cooling unit PHP.sub.1, the main transport mechanism T.sub.1 takes a wafer W having received heat treatment out of the heating and cooling unit PHP.sub.1, and loads the wafer W having anti-reflection film formed thereon into the heating and cooling unit PHP.sub.1. Then, the main transport mechanism T.sub.1, holding the wafer W taken out of the heating and cooling unit PHP.sub.1, moves to one of the cooling units CP.sub.1. The heating and cooling unit PHP.sub.1 receives a wafer W successively on the two plates 43, to heat the wafer W on one of the plates 43 and then to cool the wafer W on the other plate 43 (step S4).

(103) Having moved to the cooling unit CP.sub.1, the main transport mechanism T.sub.1 takes a wafer W out of the cooling unit CP.sub.1, and loads the wafer W held by the transport mechanism T.sub.1 into the cooling unit CP.sub.1. The cooling unit CP.sub.1 cools the wafer W loaded therein (step S5).

(104) Then, the main transport mechanism T.sub.1 moves to one of the resist film coating units RESIST.sub.1. The main transport mechanism T.sub.1 takes a wafer W having resist film formed thereon from the resist film coating unit RESIST.sub.1, and loads the wafer W held by the main transport mechanism T.sub.1 into the resist film coating unit RESIST.sub.1. The resist film coating unit RESIST.sub.1 supplies the resist film material while spinning the wafer W loaded therein, to form resist film on the wafer W (step S6).

(105) The main transport mechanism T.sub.1 further moves to one of the heating and cooling units PHP.sub.1 and one of the cooling units CP.sub.1. The main transport mechanism T.sub.1 loads the wafer W having resist film formed thereon into the heating and cooling unit PHP.sub.1, transfers a wafer W treated in the heating and cooling unit PHP.sub.1 to the cooling unit CP.sub.1, and receives a wafer W treated in the cooling unit CP.sub.1. The heating and cooling unit PHP.sub.1 and cooling unit CP.sub.1 carry out predetermined treatments of newly loaded wafers W, respectively (steps S7 and S8).

(106) The main transport mechanism T.sub.1, depending on a transport path for the wafer W it is holding, transports the wafer W to the receiver PASS.sub.2 or movable receiver MPASS. As a result, this wafer W is fed from the coating block Ba (story K1) to either the story K2 or story K4 of the developing block Bb. The transport path for the wafer W held is set to the processing recipe beforehand.

(107) Specifically, the following action takes place. When transporting the wafer W from the story K1 to the story K2 (corresponding to r1 in FIG. 1), the main transport mechanism T.sub.1 moves to the position opposed to the receiver PASS.sub.2. Then, the main transport mechanism T.sub.1 places the wafer W it is holding on the receiver PASS.sub.2A (step S9a).

(108) When transporting the wafer W from the story K1 to the story K4 (corresponding to r3 in FIG. 1), the movable receiver MPASS moves to the height position corresponding to the story K1 (K2), and the main transport mechanism T.sub.1 moves to the position opposed to the movable receiver MPASS. Then, the main transport mechanism T.sub.1 places the wafer W it is holding on the movable receiver MPASS.sub.A (step S9c). When the wafer W has been placed on the movable receiver MPASS.sub.A, the latter moves down to the position corresponding to the destination story K3 (K4).

(109) Then, depending on a transport path for a wafer W to receive from the developing block Bb, the main transport mechanism T.sub.1 receives the wafer W present on the receiver PASS.sub.2 or movable receiver MPASS. The transport path for this wafer W also is set to the processing recipe beforehand.

(110) Specifically, the following action takes place. When the story K1 is to receive a wafer W fed from the story K2 (corresponding to r1 in FIG. 1), the main transport mechanism T.sub.1 receives the wafer W present on the receiver PASS.sub.2B (step S21a). When the story K1 is to receive a wafer W fed from the story K4 (corresponding to r3 in FIG. 1), the main transport mechanism T.sub.1 receives the wafer W present on the movable receiver MPASS.sub.B (step S21c).

(111) Subsequently, the main transport mechanism T.sub.1 accesses the receiver PASS.sub.1 again, and repeats the above operation. This operation is controlled by the second controller 94. As a result, the main transport mechanism T.sub.1 receives a wafer W from the receiver PASS.sub.1 and transports the wafer W to a predetermined treating unit (a cooling unit CP 1 in this embodiment), and takes a treated wafer W from this treating unit. Subsequently, the main transport mechanism T.sub.1 transports the wafer W taken out to a different treating unit, and takes a treated wafer W from the different treating unit. In this way, the treatment is carried out in parallel for a plurality of wafers W by transferring a treated wafer W from each treating unit to a new treating unit. Starting with a wafer W first placed on the receiver PASS.sub.1, the wafers W are successively transported from the story K1 to the developing block Bb.

(112) When transporting a wafer W from the story K1 to the developing block Bb, and feeding the wafer W to the same story K2 as the story K1, the main transport mechanism T.sub.1 places the wafer W on the receiver PASS.sub.2. When feeding the wafer W to the story K4 different from the story K1, the main transport mechanism T.sub.1 places the wafer W on the movable receiver MPASS.

(113) When receiving a wafer W fed from the developing block Bb, a wafer W fed from the same story K2 as the story K1 is placed on the receiver PASS.sub.2, and therefore the main transport mechanism T.sub.1 receives the wafer W from the receiver PASS.sub.2. Since a wafer W fed from the story K4 different from the story K1 is placed on the movable receiver MPASS, the main transport mechanism T.sub.1 receives the wafer W from the movable receiver MPASS. In this way, the main transport mechanism T.sub.1 feeds the wafer W received from either the receiver PASS.sub.2 or movable receiver MPASS to the ID section 1.

(114) Main Transport Mechanisms T.sub.2, T.sub.4

(115) Since operation of the main transport mechanism T.sub.4 is substantially the same as operation of the main transport mechanism T.sub.2, only the main transport mechanism T.sub.2 will be described. That is, operation on the story K2 will be described. Depending on a transport path for a wafer W to receive from the coating block Ba, the main transport mechanism T.sub.2 receives the wafer W present on the receiver PASS.sub.2 or movable receiver MPASS. The transport path for this wafer W also is set to the processing recipe beforehand.

(116) Specifically, the following action takes place. When receiving a wafer W fed from the story K1 (corresponding to r1 in FIG. 1), the main transport mechanism T.sub.2 receives the wafer W present on the receiver PASS.sub.2 (step S9a). When receiving a wafer W fed from the story K3 (corresponding to r4 in FIG. 1), the main transport mechanism T.sub.2 receives the wafer W present on the movable receiver MPASS.sub.A (step S9c).

(117) At this time, the main transport mechanism T.sub.2 is holding a wafer W received from a cooling unit CP.sub.2 accessed immediately before. The main transport mechanism T.sub.2 places this wafer W on the receiver PASS.sub.2 or movable receiver MPASS, depending on a transport path for the wafer W. Specifically, when the wafer W is to be transported from the story K2 to the story K1, the main transport mechanism T.sub.2 places the wafer W on the receiver PASS.sub.2. When the wafer W is to be transported from the story K2 to the story K3, the main transport mechanism T.sub.2 places the wafer W on the movable receiver MPASS. In this way, the wafer W is fed from the story K2 to either the story K1 or story K3 of the coating block Ba.

(118) Specifically, the following action takes place. When transporting the wafer W from the story K2 to the story K1 (corresponding to r1 in FIG. 1), the main transport mechanism T.sub.2 places the wafer W it is holding on the receiver PASS.sub.2B (step S21a). When transporting the wafer W from the story K2 to the story K3 (corresponding to r4 in FIG. 1), the main transport mechanism T.sub.2 places the wafer W it is holding on the movable receiver MPASS.sub.B (step S21c). When the wafer W has been placed on the movable receiver MPASS, the latter moves down to the position corresponding to the destination story K3 (K4).

(119) After the substrate transport in step S9a or S9c, the main transport mechanism T.sub.2 accesses the edge exposing unit EEW.sub.2. Then, the main transport mechanism T.sub.2 receives a wafer W having undergone a predetermined treatment in the edge exposing unit EEW.sub.2, and loads the cooled wafer W into the edge exposing unit EEW.sub.2. While spinning the wafer W loaded therein, the edge exposing unit EEW.sub.2 irradiates peripheral regions of the wafer W with light from the light emitter not shown, thereby exposing the peripheral regions of the wafer W (step S10).

(120) The main transport mechanism T.sub.2, holding the wafer W received from the edge exposing unit EEW.sub.2, accesses the receiver PASS.sub.5. The main transport mechanism T.sub.2 places the wafer W on the receiver PASS.sub.5A (step S11), and holds a wafer W present on the receiver PASS.sub.5B (step S16).

(121) The main transport mechanism T.sub.2 moves to one of the cooling units CP.sub.2, and replaces a wafer W in the cooling unit CP.sub.2 with the wafer W held by the main transport mechanism T.sub.2. The main transport mechanism T.sub.2 holds the wafer W having received cooling treatment, and accesses one of the developing units DEV.sub.2. The cooling unit CP.sub.2 starts treatment of the newly loaded wafer W (step S17).

(122) The main transport mechanism T.sub.2 takes a developed wafer W from the developing unit DEV.sub.2, and places the cooled wafer W on the spin holder 77 of the developing unit DEV.sub.2. The developing unit DEV.sub.2 develops the wafer W placed on the spin holder 77 (step S18). Specifically, while the spin holder 77 spins the wafer W in horizontal posture, the developer is supplied from one of the slit nozzles 81a to the wafer W, thereby developing the wafer W.

(123) The main transport mechanism T.sub.2 holds the developed wafer W, and accesses one of the heating units HP.sub.2. The main transport mechanism T.sub.2 takes a wafer W out of the heating unit HP.sub.2, and loads the wafer W it is holding into the heating unit HP.sub.2. Then, the main transport mechanism T.sub.2 transports the wafer W taken out of the heating unit HP.sub.2 to one of the cooling units CP.sub.2, and takes out a wafer W already treated in this cooling unit CP.sub.2. The heating unit HP.sub.2 and cooling unit CP.sub.2 carry out predetermined treatments for the newly loaded wafers W, respectively (steps S19 and S20).

(124) Subsequently, the main transport mechanism T.sub.2 accesses the receiver PASS.sub.2 and/or movable receiver MPASS again, and repeats the above operation. This operation is controlled by the third controller 95. As a result, the wafers W are forwarded to the receiver PASS.sub.5A in the order of receipt from the receiver PASS.sub.2A or movable receiver MPASS.sub.A. Similarly, the wafers W are forwarded to the receiver PASS.sub.2B or movable receiver MPASS.sub.B in the order in which they are placed on the receiver PASS.sub.5B.

(125) At this time, the wafers W are fed through the receiver PASS.sub.2 for transport to the same story K1 as the story K2. The wafers W are fed through the movable receiver MPASS for transport to the story K4 different from the story K2.

(126) IF Transport Mechanisms T.sub.IFIF First Transport Mechanism T.sub.IFA

(127) IF first transport mechanism T.sub.IFA accesses the receiver PASS.sub.5, and receives the wafer W present on the receiver PASS.sub.SA (step S11a). IF first transport mechanism T.sub.IFA, holding the wafer W received, moves to the receiver PASS-CP, and loads the wafer W on the receiver PASS-CP (step S12).

(128) Next, IF first transport mechanism T.sub.IFA receives a wafer W from the receiver PASS.sub.7 (step S14), and moves to a position opposed to one of the heating and cooling units PHP.sub.2. IF first transport mechanism T.sub.IFA takes a wafer W having received post-exposure baking treatment (PEB) treatment from the heating and cooling unit PHP.sub.2, and loads the wafer W received from the receiver PASS.sub.7 into the heating and cooling unit PHP.sub.2. The heating and cooling unit PHP.sub.2 carries out heat treatment for the newly loaded wafer W (step S15a).

(129) IF first transport mechanism T.sub.IFA transports the wafer W taken out of the heating and cooling unit PHP.sub.2 to the receiver PASS.sub.SB. Subsequently, IF first transport mechanism T.sub.IFA transports a wafer W from the receiver PASS.sub.6A to the receiver PASS-CP (Step S11b, S12). Next, IF first transport mechanism T.sub.IFA transports a wafer W from the receiver PASS.sub.7 to one of the heating and cooling units PHP.sub.4. At this time, IF first transport mechanism T.sub.IFA takes out a wafer W having received the post-exposure baking treatment (PEB) treatment in the heating and cooling unit PHP.sub.4, and places the wafer W on the receiver PASS.sub.6B (steps S14, S15b, S16b).

(130) Subsequently, IF first transport mechanism T.sub.IFA accesses the receiver PASS.sub.5 again and repeats the above operation. This operation is controlled by the sixth controller 98.

(131) IF Transport Mechanisms T.sub.IFIF Second Transport Mechanism T.sub.IFB

(132) IF second transport mechanism T.sub.IFB takes a wafer W out of the receiver PASS-CP, and transports it to the exposing machine EXP. Then, IF second transport mechanism T.sub.IFB receives an exposed wafer W from the exposing machine EXP, and transports it to the receiver PASS.sub.7 (step S13).

(133) Subsequently, IF second transport mechanism T.sub.IFB accesses the receiver PASS-CP again and repeats the above operation.

(134) As described above, the substrate treating apparatus according to the first embodiment includes the movable receiver MPASS disposed between the adjoining coating block Ba and developing block Bb to be vertically movable between the upper story K1 (K2) and lower story K3 (K4). This allows wafers W to be transported between different stories of the coating block Ba and developing block Bb.

(135) Since the range of vertical movement of the movable receiver MPASS covers all the stories (the upper story and lower story in this embodiment) of the treating blocks Ba and Bb, each of the stories K1 and K3 of the coating block Ba can transport wafers W to and from all the stories K2 and K4 of the developing block Bb. Conversely, each of the stories K2 and K4 of the developing block Bb can transport wafers W to and from all the stories K1 and K3 of the coating block Ba. That is, the movable receiver MPASS allows wafers W to be transported through four paths r1-r4 between the respective stories of the treating blocks Ba and Bb. When the transport directions are considered, the number of paths is eight.

(136) Since wafers W can be transported flexibly between the treating blocks Ba and Bb as described above, even when one of the main transport mechanisms T falls into an abnormal state, the wafers W can be transported through the transport paths which do not include the abnormal main transport mechanism T. A series of treatments is carried out for the wafers W by efficiently operating the normal main transport mechanisms T and the treating units. This can prevent a significant reduction in the throughput of this apparatus.

(137) Since wafers W can be transported flexibly between the treating blocks Ba and Bb, a flexible selection can be made from among the transport paths for the wafers W of the entire apparatus described with reference to FIGS. 2 to 4. This enables a comparison of the quality of treatment between the stories K1 and K3 of the coating block Ba, and between the stories K2 and K4 of the developing block Bb.

(138) Since the receivers PASS.sub.2 and PASS.sub.4 are fixedly provided between the treating blocks Ba and Bb, wafers W can be transported between the same stories K1 and K2 and between the same stories K3 and K4 of the treating blocks Ba and Bb. The burden and amount of movement of the movable receiver MPASS can be reduced by using the movable receiver MPASS exclusively for transporting wafers W between different stories, and using the receivers PASS.sub.2 and PASS.sub.4 exclusively for transporting wafers W between the same stories. As a result, wafers W can be transported smoothly even between the different stories of the treating blocks Ba and Bb. The movable receiver MPASS can also be controlled with increased ease.

Second Embodiment

(139) The second embodiment of this invention will be described with reference to the drawings. In the second embodiment, the movable receiver MPASS is omitted from the substrate treating apparatus described in the first embodiment, and the construction of the main transport mechanisms T.sub.2 and T.sub.4 in the developing block Bb described in the first embodiment has been changed. Thus, the following description will be made centering on main transport mechanisms T.sub.2M and T.sub.4M of the second embodiment.

(140) FIG. 17 is a view in vertical section of each transporting space in the substrate treating apparatus according to the second embodiment. As seen, there is no first blowout unit 61 or exhaust unit 62 between the transporting spaces A.sub.2 and A.sub.4 on the stories K2 and K4 of the developing block Bb. Therefore, the transporting space A.sub.2 and transporting space A.sub.4 are in communication.

(141) Both the main transport mechanisms T.sub.2M and T.sub.4M are vertically movably supported by a common strut 101. The main transport mechanism T.sub.2M is disposed over the main transport mechanism T.sub.4M. The strut 101 extends vertically from the upper end of the transporting space A.sub.2 to the lower end of the transporting space A.sub.4. Each of the main transport mechanisms T.sub.2M and T.sub.4M includes a lift member 103, a base 105, a turntable 55 and two holding arms 57a and 57b. The lift member 103 is attached to the strut 101 to be vertically movable along the strut 101. The base 105 is connected to the lift member 103. The turntable 55 is supported by the base 103 to be rotatable about a vertical axis. The two holding arms 57a and 57b are horizontally extendible and retractable relative to the turntable 55.

(142) The main transport mechanism T.sub.2M transports wafers W to and from the treating units arranged on the story K2 and the receivers PASS.sub.2 and PASS.sub.5. Further, the main transport mechanism T.sub.2M can descend to the story K4 to transport wafers W to and from the receiver PASS.sub.4. At this time, the main transport mechanism T.sub.4M moves to a lower position on the story K4 to avoid interference with the main transport mechanism T.sub.2M. Thus, the main transport mechanism T.sub.2M is constructed vertically movable between the stories K2 and K4 in the developing block Bb to transfer wafers W to and from the main transport mechanisms T.sub.1 and T.sub.3 on the stories K1 and K3 of the adjoining coating block Ba.

(143) Similarly, the main transport mechanism T.sub.4M transports wafers W to and from the treating units arranged on the story K4 and the receivers PASS.sub.4 and PASS.sub.E. Further, the main transport mechanism T.sub.4M can ascend to the story K2 to transport wafers W to and from the receiver PASS.sub.2. At this time, the main transport mechanism T.sub.2M moves to an upper position on the story K2 to avoid interference with the main transport mechanism T.sub.4M. Thus, the main transport mechanism T.sub.4M also is constructed vertically movable between the stories K2 and K4 in the developing block Bb to transfer wafers W to and from the main transport mechanisms T.sub.1 and T.sub.3 on the stories K1 and K3 of the adjoining coating block Ba.

(144) With the main transport mechanism T.sub.2M transporting wafers W to and from the receiver PASS.sub.4, the wafers W can be transported between the story K2 and story K3 (corresponding to r4 in FIG. 1). With the main transport mechanism T.sub.4M transporting wafers W to and from the receiver PASS.sub.2, the wafers W can be transported between the story K1 and story K4 (corresponding to r3 in FIG. 1).

(145) Thus, with the substrate treating apparatus according to the second embodiment, the main transport mechanism T.sub.2M on the story K2 can transfer wafers W to and from the main transport mechanism T.sub.1 on the same story K1 through the receiver PASS.sub.2, and to and from the main transport mechanism T.sub.3 on the different story K3 through the receiver PASS.sub.4. Similarly, the main transport mechanism T.sub.4M on the story K4 can transfer wafers W to and from the main transport mechanism T.sub.3 on the same story K3 through the receiver PASS.sub.4, and to and from the main transport mechanism T.sub.1 on the different story K1 through the receiver PASS.sub.2. Therefore, as in the first embodiment, wafers W can be transported through four paths r1-r4 between the respective stories of the treating blocks Ba and Bb. When the transport directions are considered, the number of paths is eight.

(146) Thus, the apparatus in the second embodiment, as in the first embodiment, allows transport paths R for transporting wafers W to be selected and changed in various ways, to carry out a series of treatments for the wafers W conveniently.

(147) The main transport mechanisms T.sub.2M and T.sub.4M transfer wafers W to and from the main transport mechanisms T.sub.1 and T.sub.3 through the fixed receivers PASS.sub.2 and PASS.sub.4. This construction does not require, besides the four main transport mechanisms T.sub.1-T.sub.4, any additional mechanism for moving wafers W, such as the movable receiver MPASS described in the first embodiment. It is therefore possible to simplify the construction of the apparatus and the transport control of wafers W.

(148) This invention is not limited to the foregoing embodiments, but may be modified as follows:

(149) (1) The first embodiment described above provides the movable receiver MPASS, but the invention is not limited to this. Reference is made to FIGS. 18 and 19. FIG. 18 is a plan view of a modified substrate treating apparatus. FIG. 19 is a view in vertical section taken on line e-e of FIG. 18. Like reference numerals are used to identify like parts which are the same as in the first embodiment and will not be described again.

(150) As shown in FIGS. 18 and 19, a receiver transport mechanism T.sub.P is disposed laterally of the receivers PASS.sub.2 and PASS.sub.4. The receiver transport mechanism T.sub.P transports wafers W between the receivers PASS.sub.2 and PASS.sub.4. The receiver transport mechanism T.sub.P has a lift base 111 and a holding arm 113. The lift base 111 is vertically movable by a drive mechanism (not shown) between the height positions of the receivers PASS.sub.2 and PASS.sub.4. The holding arm 113 is horizontally extendible and retractable relative to the lift base 111 for holding wafers W.

(151) The receiver transport mechanism T.sub.P transports to the receiver PASS.sub.4 a wafer W placed on the receiver PASS.sub.2 by the main transport mechanism T.sub.1 on the story K1. Then, the main transport mechanism T.sub.4 on the story K4 can receive this wafer W. Conversely, the receiver transport mechanism T.sub.P transports to the receiver PASS.sub.2 a wafer W placed on the receiver PASS.sub.4 by the main transport mechanism T.sub.4. Then, the main transport mechanism T.sub.1 on the story K1 can receive this wafer W. Thus, with the receiver transport mechanism T.sub.P transporting wafers W between the receiver PASS.sub.2 and receiver PASS.sub.4, the wafers W can be transported between the story K1 and story K4 (transport path r3 in FIG. 1). When transporting wafers W between the same stories, the receiver transport mechanism T.sub.P is not required to transport the wafers W between the receiver PASS.sub.2 and PASS.sub.4.

(152) The receivers' transport mechanism T.sub.P transports to the receiver PASS.sub.2 a wafer W placed on the receiver PASS.sub.4 by the main transport mechanism T.sub.3 on the story K3. Then, the main transport mechanism T.sub.2 on the story K2 can receive this wafer W. Conversely, the receivers' transport mechanism T.sub.P transports to the receiver PASS.sub.4 a wafer W placed on the receiver PASS.sub.2 by the main transport mechanism T.sub.2. Then, the main transport mechanism T.sub.3 on the story K3 can receive this wafer W. Thus, with the receivers' transport mechanism T.sub.P transporting wafers W between the receiver PASS.sub.2 and receiver PASS.sub.4, the wafers W can be transported between the story K2 and story K3 (transport path r4 in FIG. 1).

(153) (2) The first embodiment described above provides the receivers PASS.sub.2 and PASS.sub.4, but the invention is not limited to this. A change may be made to transport wafers W between the same stories through the movable receiver MPASS. Such modification can omit the receivers PASS.sub.2 and PASS.sub.4.

(154) (3) In the second embodiment described above, each of the main transport mechanisms T.sub.2M and T.sub.4M can transport wafers W to and from both the receivers PASS.sub.2 and PASS.sub.4. The invention is not limited to this construction. For example, each of the main transport mechanisms T.sub.1 and T.sub.3 of the coating block Ba may be modified to have the same construction as the main transport mechanism T.sub.2M or T.sub.4M, to transport wafers W to and from both the receivers PASS.sub.2 and PASS.sub.4. Further, each of the main transport mechanism T.sub.2M and T.sub.4M may be modified to have the same construction as the main transport mechanism T.sub.2 or T.sub.4 in the first embodiment, so that only each main transport mechanism T.sub.1 or T.sub.3 of the coating block Ba may be able to transport wafers W to and from both the receivers PASS.sub.2 and PASS.sub.4.

(155) (4) In the second embodiment described above, each of the main transport mechanisms T.sub.2M and T.sub.4M of the developing block Bb can transport wafers W to and from both the receivers PASS.sub.2 and PASS.sub.4. The invention is not limited to this construction. The construction may be modified such that, for example, while the main transport mechanism T2M can transport wafers W to and from both the receivers PASS.sub.2 and PASS.sub.4, the main transport mechanism T.sub.4M can transport wafers W to and from only the receiver PASS.sub.4 and not the receiver PASS.sub.2. In this case also, wafers W can be transported between the story K2 and story K3. Conversely, the construction may be modified such that, while the main transport mechanism T.sub.4M can transport wafers W to and from both the receivers PASS.sub.2 and PASS.sub.4, the main transport mechanism T.sub.2M cannot transport wafers W to and from the receiver PASS.sub.4. In this case also, wafers W can be transported between the story K4 and story K1.

(156) (5) In the second embodiment described above, each of the main transport mechanisms T.sub.2M and T.sub.4M is constructed vertically movable. The invention is not limited to this. As long as both the receivers PASS.sub.2 and PASS.sub.4 are accessible, each of the main transport mechanisms T.sub.2M and T.sub.4M may be modified to be a vertically extendible and contractible mechanism.

(157) (6) In each embodiment described above, each treating block Ba or Bb has two stories. The invention is not limited to this. For example, each treating block Ba or Bb may be modified to have three or more stories.

(158) Even where three or more stories are arranged vertically, at least one transport path r that can transport wafers W between different stories of the coating block Ba and developing block Bb will serve the purpose. Take the construction in the first embodiment, for example. Where each of the treating blocks Ba and Bb is divided into three or more stories, what is required is just to construct the movable receiver MPASS to be vertically movable between two or more stories. It is possible, of course, to modify so that each story of the coating block Ba may transfer wafers W to and from all the stories of the developing block Bb. Specifically, the movable receiver MPASS may be constructed vertically movable to all the stories.

(159) Where the construction of the second embodiment has each treating block Ba or Bb divided into the three or more stories, each of the main transport mechanisms T.sub.2M and T.sub.4M may be constructed vertically movable to two or more stories in the developing block Bb. It is possible, of course, to modify so that each of the main transport mechanisms T.sub.2M and T.sub.4M may be vertically movable to all the stories.

(160) (7) In each embodiment described above, the treating section 3 includes two treating blocks Ba and Bb in juxtaposition. The invention is not limited to this construction. For example, the treating section 3 may be modified to include three or more treating blocks.

(161) Where three or more treating blocks are juxtaposed, the treating blocks adjoin in two or more locations. However, wafers W may be transported between different stories in at least one of such locations. It is possible, of course, to modify so that wafers W be transported between different stories in all the locations where the treating blocks adjoin.

(162) (8) In each embodiment described above, the treating blocks are exemplified by the coating block Ba and developing block Bb. The invention is not limited to this. A different treating block may be employed as appropriate, for performing other treatment for wafers W such as cleaning Depending on the type of treatment given by the treating section 3, it is possible to omit the exposing machine EXP provided separately from and adjacent the subject apparatus.

(163) (9) The constructions of each embodiment and each modification described above may be combined as appropriate.

(164) This invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof and, accordingly, reference should be made to the appended claims, rather than to the foregoing specification, as indicating the scope of the invention.