A flexible packaging laminate is formed to have a built-in opening and reclose feature by forming the laminate as a two-part structure having an outer structure joined in face-to-face relation with an inner structure. Score lines are formed in both structures to enable an opening to be formed through the laminate by lifting an opening portion (e.g., a flap or the like) of the two structures out of the plane of the laminate. The score line through the outer structure defines a larger opening than the score line through the inner structure, such that a marginal region of the outer structure extends beyond the edge of the opening portion of the inner structure. A pressure-sensitive adhesive is used to re-adhere the marginal region to an underlying surface of the inner structure adjacent the opening through the laminate.

A method of cutting a wafer of composite core from a bulk composite core including the steps of placing the bulk composite core in a container, the bulk composite core having a plurality of tube members; depositing a potting compound in contact with an outer surface of the bulk composite core; curing the potting compound; and after curing of the potting compound, cutting through each of the tube members. A method of cutting a wafer of composite core from a bulk composite core, the method comprising the steps of stabilizing the bulk composite core by wrapping an exterior of the bulk composite core with a composite wrap, the bulk composite core having a plurality of tube members; curing the composite wrap; and cutting through each of the tube members.

A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.

The invention relates to a method for producing a multi-layer assembly. The method according to the invention comprises at least the following steps: providing a donor substrate (2) for removing a solid layer (4), in particular a wafer; producing modifications (12), in particular by means of laser beams (10), in the donor substrate (2) in order to specify a crack course; providing a carrier substrate (6) for holding the solid layer (4); bonding the carrier substrate (6) to the donor substrate (2) by means of a bonding layer (8), wherein the carrier substrate (6) is provided for increasing the mechanical strength of the solid layer (4) for the further processing, which solid layer is to be removed; arranging or producing a stress-producing layer (16) on the carrier substrate (6); thermally loading the stress-producing layer (16) in order to produce stresses in the donor substrate (2), wherein a crack is triggered by the stress production, which crack propagates along the specified crack course in order to remove the solid layer (4) from the donor substrate (2) such that the solid layer (4) is removed together with the bonded carrier substrate (6).

A method of cutting a wafer of composite core from a bulk composite core including the steps of placing the bulk composite core in a container, the bulk composite core having a plurality of tube members; depositing a potting compound in contact with an outer surface of the bulk composite core; curing the potting compound; and after curing of the potting compound, cutting through each of the tube members. A method of cutting a wafer of composite core from a bulk composite core, the method comprising the steps of stabilizing the bulk composite core by wrapping an exterior of the bulk composite core with a composite wrap, the bulk composite core having a plurality of tube members; curing the composite wrap; and cutting through each of the tube members.

A flexible packaging laminate is formed to have a built-in opening and reclose feature by forming the laminate as a two-part structure having an outer structure joined in face-to-face relation with an inner structure. Score lines are formed in both structures to enable an opening to be formed through the laminate by lifting an opening portion (e.g., a flap or the like) of the two structures out of the plane of the laminate. The score line through the outer structure defines a larger opening than the score line through the inner structure, such that a marginal region of the outer structure extends beyond the edge of the opening portion of the inner structure. A pressure-sensitive adhesive is used to re-adhere the marginal region to an underlying surface of the inner structure adjacent the opening through the laminate.

The invention comprises, in an embodiment, a resealable packaging structure comprising a container having a bottom and at least one sidewall extending upwardly therefrom, wherein the sidewall terminates in a flange. A flexible resealable lid is sealed to the flange. The lid comprises a polyethylene terephthalate layer disposed adjacent the flange, a pressure sensitive adhesive layer disposed adjacent the polyethylene terephthalate layer, and an oriented polypropylene layer disposed adjacent the pressure sensitive adhesive layer. The polyethylene terephthalate layer comprises a laser scored line which penetrates through the thickness of the inner layer but not through the outer layer and defines an opening portion that can be lifted out of the plane of the inner layer, thereby creating an opening through the lid defined by the laser score line.

A method of cutting a wafer of composite core from a bulk composite core includes stabilizing the bulk composite core with a fixture, the bulk composite core having a plurality of tube members. The method also includes cutting through each of the tube members to create the wafer while the bulk composite core is stabilized by the fixture.

A flexible packaging laminate is formed to have a built-in opening and reclose feature by forming the laminate as a two-part structure having an outer structure joined in face-to-face relation with an inner structure. Score lines are formed in both structures to enable an opening to be formed through the laminate by lifting an opening portion (e.g., a flap or the like) of the two structures out of the plane of the laminate. The score line through the outer structure defines a larger opening than the score line through the inner structure, such that a marginal region of the outer structure extends beyond the edge of the opening portion of the inner structure. A pressure-sensitive adhesive is used to re-adhere the marginal region to an underlying surface of the inner structure adjacent the opening through the laminate.

A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.