A method for producing pigments having a specified contour, comprises the steps of creating a pigment layer on a starting substrate; detaching from the starting substrate; and structuring the pigment layer into a plurality of the pigments; characterized by bringing into contact the pigment layer with an intermediate substrate, wherein the pigment layer adheres at least in sections to the intermediate substrate; and separating intermediate substrate and starting substrate.

New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

In certain embodiments, a system is provided for the efficient removal of an old grip from a fishing pole while maintaining the integrity of the pole. The system can include a removal portion including one or more rotational assemblies that rotate one or more grinding members. The grinding members can include a rotational blade with a centering rod. The rotational assembly can remove the old grip while maintaining the integrity of the rod within. The system can include multiple sets of grinding members that are organized for efficient identification or may include adjustable grinding members that can be configured for specific rods. The system can further include a guide to help identify particular grinding members for use with particular fishing poles.

The present disclosure, in some embodiments, relates to a debonding and cleaning apparatus. The apparatus has a debonding module configured to separate semiconductor substrates from carrier substrates. A first cleaning module is configured to clean surfaces of a first plurality of the semiconductor substrates and a second cleaning module is configured to clean surfaces of a second plurality of the semiconductor substrates. The apparatus also has a first substrate handling module including a first robotic arm in communication with the debonding module and a second substrate handling module including a second robotic arm that is located between the first cleaning module and the second cleaning module. The second substrate handling module is configured to transfer the first plurality of the semiconductor substrates to first cleaning module and to transfer the second plurality of the semiconductor substrates to the second cleaning module.

A method of manufacturing a delaminatable container is provided that is capable of uniformly delaminating the inner bag from the outer shell. According to the first aspect, a container body is formed having an outer shell and an inner bag. The inner bag preliminary delaminated from the outer shell in an entire circumference of a storage portion of the container body by rotating the container body while pressing the storage portion with a pressing mechanism from outside for compression or by moving the pressing mechanism along an outer circumference of the container body.

The invention specifies an electronic component which has a first electrode (10), a second electrode (20), an active region (30), which is electrically coupled to the first electrode (10) and to the second electrode (20), and a housing (100), wherein the housing (100) contains carbon layers which are monoatomic at least in subregions.

A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably having a different base polymer to that of the conduit, is first applied to the former before the conduit is formed overtop.

A label assembly including one or more dissolvable thermal direct adhesive labels and methods of assembly and use. According to one embodiment, each label includes a base layer, a thermal direct layer, an adhesive layer, and a barrier layer. The base layer, which has an upper surface and a lower surface, is water-dissolvable and may be made of a water-dissolvable paper. The thermal direct layer is positioned directly over the upper surface of the base layer and functions in the conventional manner to produce markings therein in response to heat. The adhesive layer is water-dissolvable and is positioned below the lower surface of the base layer. The barrier layer, which is positioned directly below the lower surface of the base layer and directly over the adhesive layer, serves to prevent migration of the adhesive layer through the base layer and into contact with the thermal direct layer.