A fiber preform is infused with two differing resin systems concurrently using stacked resin delivery assemblies located along one edge of the preform.

An overlay applicator can include an overlay with a top side and a bottom side. The bottom side can include an adhesive agent configured to adhere to a screen of an electronic device. The overlay applicator can include an adhesive release liner. The adhesive release liner can include a top side and a bottom side. The top side of the adhesive release liner can be removably attached to the bottom side of the overlay. The adhesive release liner can be configured to protect the adhesive agent at the bottom side of the overlay from contaminants. The overlay applicator can include a protective film removably attached to the top side of the overlay. The overlay applicator can include an alignment tab. The alignment tab can include an alignment mechanism. The overlay applicator further can include a pull tab. The pull can include a wiper. Other embodiments are provided.

The invention relates to a method for manufacturing a label laminate. The method includes forming at least one water based adhesive layer on a belt, drying said at least one water based adhesive layer on the belt, unwinding a first material layer, unwinding a second material layer, attaching said at least one dried water based adhesive layer to the surface of the first material layer, and laminating the first material layer comprising at least one water based adhesive layer together with the second material layer in order to form the label laminate. The invention also relates to a label laminate and to a system for manufacturing a label laminate.

A surface covering tile has a plurality of edges extending between the face and the back surface. A pressure sensitive adhesive is disposed on the back surface and covers less than 40% of the back along each one of the plurality of edges where the back surface intersects the plurality of edges. For highly porous back surfaces, the pressure sensitive adhesive is selected and applied in a manner limiting penetration into the back surface. The amount of pressure sensitive adhesive required to affix the tile is reduced, and the tile can be optionally constructed in a manner that facilitates lateral movement of the tile during installation.

A surface covering tile has a plurality of edges extending between the face and the back surface. A pressure sensitive adhesive is disposed on the back surface and covers less than 40% of the back along each one of the plurality of edges where the back surface intersects the plurality of edges. For highly porous back surfaces, the pressure sensitive adhesive is selected and applied in a manner limiting penetration into the back surface. The amount of pressure sensitive adhesive required to affix the tile is reduced, and the tile can be optionally constructed in a manner that facilitates lateral movement of the tile during installation.

The present disclosure provides systems and methods for storing and dispensing nanostructure material that can maintain the morphology of the nanostructures. The nanostructures are disposed on a flexible substrate that is spooled into a roll. The substrate can be provided with raised edges that space adjacent portions from each other in the roll to protect the nanostructures from damage or misalignment. The roll can be provided to a cassette that can be sealed to protect the nanostructure material from exposure to unwanted environments and to protect individuals from exposure to the nanostructure material. The substrate can be unrolled in the cassette to permit the nanostructure material to be applied to an item outside the cassette while maintaining the morphology of the nanostructures. Various controls can be provided to unroll the substrate and deposit the nanostructure material with high precision and repeatability.

An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.