The present disclosure, in some embodiments, relates to a debonding and cleaning apparatus. The apparatus has a debonding module configured to separate semiconductor substrates from carrier substrates. A first cleaning module is configured to clean surfaces of a first plurality of the semiconductor substrates and a second cleaning module is configured to clean surfaces of a second plurality of the semiconductor substrates. The apparatus also has a first substrate handling module including a first robotic arm in communication with the debonding module and a second substrate handling module including a second robotic arm that is located between the first cleaning module and the second cleaning module. The second substrate handling module is configured to transfer the first plurality of the semiconductor substrates to first cleaning module and to transfer the second plurality of the semiconductor substrates to the second cleaning module.

A method of manufacturing a delaminatable container is provided that is capable of uniformly delaminating the inner bag from the outer shell. According to the first aspect, a container body is formed having an outer shell and an inner bag. The inner bag preliminary delaminated from the outer shell in an entire circumference of a storage portion of the container body by rotating the container body while pressing the storage portion with a pressing mechanism from outside for compression or by moving the pressing mechanism along an outer circumference of the container body.

A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.

New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably having a different base polymer to that of the conduit, is first applied to the former before the conduit is formed overtop.

A method of transferring functionalized graphene comprising the steps of providing graphene on a first substrate, functionalizing the graphene and forming functionalized graphene on the first substrate, delaminating the functionalized graphene from the first substrate, and applying the functionalized graphene to a second substrate.

The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.

An object adhesion/peeling method according to an embodiment includes adhering a adhesion target object to a second surface side of an adhesive sheet, wherein the adhesive sheet includes adhesive surfaces on a first surface side and the second surface side, and a first electrode and a second electrode provided to be adjacent to the first electrode are provided on the first surface side; adhering the first surface side of the adhesive sheet to a fixation target surface; inputting a predetermined voltage to the first electrode and the second electrode to generate a potential difference based on the predetermined voltage in a direction orthogonal to a layer thickness direction of the adhesive sheet; and causing an electrochemical reaction on the first surface side of the adhesive sheet to peel off the adhesive sheet from the fixation target surface.

A manufacturing apparatus of a display device includes: a stage to support a work substrate covered by a work protective film; a separation module including a separation structure, and a pressure sensor to measure an intensity of a pressure applied to the separation structure; a driver to control a position of the separation module; and a controller to control the separation module and the driver.